SP6001

12pF EMI Filter Array with ESD Protection SPA™ Silicon Protection Array Products HF RoHS Pb GREEN SP6001 Lead-Free/Green Series Description The Littelfuse SP6001 SPA series integrates 4 and 6 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. Pinout Features • EMI filtering of frequencies from 800MHz to 3GHz • Greater than -30dB attenuation (TYP) at 1GHz • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Small, low-profile UDFN package (TYP 0.5mm height) 1 4 GND UDFN-08 8 5 SP6001-04UTG-1 1 6 UDFN-12 12 GND 7 SP6001-06UTG-1 Functional Block Diagram Applications SP6001-04UTG-1 1 2 3 4 Cd Cd SP6001-06UTG-1 8 7 6 5 1 2 3 4 5 6 Cd Cd Cd Cd • Keypad interface for portable electronics 12 11 10 • Mobile phone • Smartphone • Portable navigation device • LCD and camera display interfaces for handsets • Connector interfaces for portable electronics Cd Cd Cd Cd Cd Cd Cd Cd 9 Cd Cd Cd Cd 8 Cd Cd 7 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 1 SP6001 Lead-Free/Green Series Lead-Free/Green SP6001 SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Absolute Maximum Ratings Symbol TOP TSTOR Operating Temperature Storage Temperature Parameter Value -40 to 85 -60 to 150 Units °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Breakdown Voltage Reverse Leakage Current Resistance Diode Capacitance1,2 Line Capacitance1,2 ESD Withstand Voltage1 Cutoff Frequency3 Symbol VRWM VBR ILEAK RA CD CL VESD F-3dB IR=1mA VRWM=5V IR=10mA VR=2.5V,f=1MHz VR=2.5V,f=1MHz IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Above this frequency, appreciable attenutation occurs 19 ±30 ±30 115 85 7 .0 7 .5 0.1 100 12 24 29 Test Conditions Min Typ Max 6.0 8.0 1.0 115 Units V V µA Ω pF pF kV kV MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 3 Total line capacitance is two times the diode capacitance (CD). 50Ω source and 50Ω load termination SP6001 Lead-Free/Green Series 2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 12pF EMI Filter Array with ESD Protection SPA™ Silicon Protection Array Products Insertion Loss (S21) CH1 S 21 log MAG 5 dB/ REF 0 dB 1 _:-5.8807 dB Analog Crosstalk (S41) CH1 S log MAG 10 dB/ REF 0 dB Cor Smo 1 Cor Del Smo 1 x2 Start x2 3.000 000MHz Stop 6 000.000.000MHz START 3.000 000 MHz Stop 6 000.000 000 MHz Line Capacitance vs. DC Bias 50 40 Capacitance (pF) 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DC Bias (V) ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 3 SP6001 Lead-Free/Green Series Lead-Free/Green SP6001 SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Application Example Dx: SP6001-04 Silicon Protection Array Input LCD Module Controller 4 5 Outside World 1 8 D1 D2 D3 D4 SP6001-04UTG (µDFN) GND Signal Ground Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP6001 Lead-Free/Green Series 4 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 12pF EMI Filter Array with ESD Protection SPA™ Silicon Protection Array Products Package Dimensions - UDFN-08 D Symbol A UDFN-08 Millimeters Min A A3 A1 Inches Min 0.018 0.000 0.006 0.063 0.043 0.049 0.012 0.008 Max 0.022 0.002 0.010 0.071 0.051 0.057 0.020 0.000 0.014 Max 0.550 0.050 0.250 1.800 1.300 1.450 0.500 0.450 0.000 0.150 1.600 1.100 1.250 0.300 0.200 0.150 E A1 A3 b D 0.127 REF 0.005 REF E2 D2 K D2 E E2 e 0.400 BSC 0.350 0.016 BSC 0.006 L K L e b Package Dimensions - UDFN-12 D A UDFN-12 Symbol A A1 A3 b D E2 Millimeters Min 0.450 0.000 0.150 2.400 1.900 1.250 0.300 0.200 0.150 0.350 Max 0.550 0.050 0.250 2.600 2.100 1.450 0.500 Min 0.018 0.000 0.006 0.094 0.075 0.049 0.012 0.008 0.006 Inches Max 0.022 0.002 E A3 A1 0.127 REF 0.005 REF 0.102 0.083 0.057 0.020 0.000 0.014 D2 K D2 E E2 e K L e b L 0.400 BSC 0.016 BSC ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 5 SP6001 Lead-Free/Green Series Lead-Free/Green SP6001 0.010 SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Part Numbering System Product Characteristics Lead Plating Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. SP 6001 – 0x U T G - 1 Silicon Protection Array Series Number of Channels 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 G= Green T= Tape & Reel Package UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) Part Marking System JH4 JH6 JHx Product Series J = SP6001 Assembly Site 4 = UDFN-08 6 = UDFN-12 Ordering Information Part Number SP6001-04UTG-1 SP6001-06UTG-1 Package uDFN-08 uDFN-12 Size 1.7x1.35mm 2.5x1.35mm Marking JH4 JH6 Min. Order Qty. 3000 3000 Embossed Carrier Tape & Reel Specification – UDFN-08 P2 t E Symbol E F D1 D P Millimetres Min 1.65 3.45 1.00 1.50 min 3.90 7 .70 1.95 1.55 1.90 0.95 0.30 max 4.10 8.30 2.05 1.75 2.1 1.15 40.0 +/- 0.20 Max 1.85 3.55 Min 0.065 0.136 0.040 Inches Max 0.073 0.140 0.161 0.327 0.081 0.069 0.083 0.045 D W 0.059 min 0.154 0.303 0.077 0.061 0.075 0.037 1.575 +/- 0.008 F 10P P BO D1 AO W P2 A0 B0 K0 t 0.012 max SP6001 Lead-Free/Green Series KO 6 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 12pF EMI Filter Array with ESD Protection SPA™ Silicon Protection Array Products Embossed Carrier Tape & Reel Specification – UDFN-12 P2 oD / t Symbol E Millimetres Min 1.65 3.45 0.55 1.50 min 3.90 7 .90 1.95 1.33 2.63 0.58 0.22 max 4.10 8.30 2.05 1.53 2.83 0.78 40.0 +/- 0.20 Max 1.85 3.55 0.65 Min 0.065 0.136 0.021 0.154 0.311 0.077 0.052 0.103 0.023 Inches Max 0.073 0.140 0.025 0.161 0.327 0.081 0.060 0.111 0.031 E F D1 D W 0.059 min 1.575 +/- 0.008 BO P 10P W P2 A0 B0 K0 t oD / A0 P F 0.009 max K0 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 7 SP6001 Lead-Free/Green Series Lead-Free/Green SP6001