SP6001_11

™ Silicon Protection Array (SPA ) Products 12pF EMI Filter Array with ESD Protection SP6001 SERIES Description RoHS Pb GREEN Features • EMI filtering of frequencies from 800MHz to 3GHz 1 4 GND 8 5 Pinout • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Small, low-profile UDFN package (TYP 0.5mm height) • Greater than -30dB attenuation (TYP) at 1GHz UDFN-08 Applications • Keypad interface for portable electronics 6 SP6001-04UTG-1 • Mobile phone • Smartphone • Portable navigation device 1 UDFN-12 12 GND 7 • LCD and camera display interfaces for handsets • Connector interfaces for portable electronics Application Examples PCB Connector for LCD Display D1 SP6001-06UTG-1 1 8 UDFN-16 16 GND 9 SP6001-04UTG-1 Baseband SP6001-08UTG-1 D2 IC D3 D4 Functional Block Diagram SP6001-04UTG-1 1 Cd Cd SP6001-06UTG-1 8 1 Cd Cd Camera Module SP6001-08UTG-1 Baseband 12 D1 D2 D3 2 Cd Cd 7 6 Cd Cd 2 Cd Cd 11 10 D4 IC D5 D6 D7 D8 3 3 Cd Cd 4 Cd Cd 5 4 Cd Cd 9 8 Cd Cd 5 6 Cd Cd 7 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 141 Revised: January 11, 2011 SP6001 Series SP6001 The Littelfuse SP6001 SPA series integrates 4, 6 and 8 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. ™ Silicon Protection Array (SPA ) Products 12pF EMI Filter Array with ESD Protection Absolute Maximum Ratings Symbol TOP TSTOR Parameter Operating Temperature Storage Temperature Value -40 to 85 -60 to 150 Units °C °C Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Breakdown Voltage Reverse Leakage Current Resistance Diode Capacitance1,2 Line Capacitance1,2 ESD Withstand Voltage1 Cutoff Frequency3 Symbol VRWM VBR ILEAK RA CD CL VESD F-3dB IR=1mA VRWM=5V IR=10mA VR=2.5V,f=1MHz VR=2.5V,f=1MHz IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Above this frequency, appreciable attenutation occurs 19 (-20%of Typ) Test Conditions Min Typ Max 6.0 Units V V μA Ω pF 7 .0 (-10% of Typ) 7 .8 0.1 8.5 (+10%of Typ) 1.0 115 (+15% of Typ) 85 (-15% of Typ) 100 12 24 29 (+20%of Typ) pF kV kV ±30 ±30 115 MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Total line capacitance is two times the diode capacitance (CD). 3 50Ω source and 50Ω load termination Insertion Loss (S21) CH1 S 21 log MAG 5 dB/ REF 0 dB 1 _:-5.8807 dB Analog Crosstalk (S41) CH1 S log MAG 10 dB/ REF 0 dB Cor Smo 1 Cor Del Smo 1 x2 Start x2 3.000 000MHz Stop 6 000.000.000MHz START 3.000 000 MHz Stop 6 000.000 000 MHz Product Characteristics Lead Plating Lead Material Lead Coplanarity Subsitute Material Body Material Flammability SP6001 Series Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 142 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Revised: January 11, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. ™ Silicon Protection Array (SPA ) Products 12pF EMI Filter Array with ESD Protection Line Capacitance vs. DC Bias 50 Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly 150°C 200°C 40 Capacitance (pF) 20 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DC Bias (V) Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Package Dimensions — UDFN-08 Ramp-down Rate UDFN-08 Time 25°C to peak Temperature (TP) Inches Min 0.018 0.000 Max 0.022 0.002 Temperature D Min A A1 A3 A Millimeters E Do not exceed Max 0.550 0.050 0.450 0.000 TP Ramp-up Ramp-up tP Critical Critical Zone TL to TP 0.127 REF 0.150 1.600 1.100 1.250 0.300 0.250 1.800 1.300 1.450 0.500 0.005 REF 0.006 0.063 0.043 0.049 0.012 0.010 0.071 0.051 0.057 0.020 b D TL TS(max) Preheat Preheat tL Ramp-do Ramp-down A3 A1 E2 D2 D2 E E2 e K L TS(min) tS K 25 time to peak temperature 0.400 BSC 0.200 0.150 0.350 0.016 BSC 0.008 0.006 0.000 0.014 Time e b L Package Dimensions — UDFN-16 D Min E Package Dimensions — UDFN-12 UDFN-16 Millimeters Max 0.55 0.05 0.25 3.40 2.90 1.45 0.50 A A1 A3 0.45 0.00 0.15 3.20 2.70 1.25 0.30 0.20 0.15 0.35 Inches Min 0.01 0.00 0.00 0.12 0.10 0.04 0.01 0.00 0.00 0.01 Max 0.02 0.002 0.00 0.13 D E A A1 A3 UDFN-12 Millimeters Min 0.450 0.000 Max 0.550 0.050 Inches Min 0.018 0.000 Max 0.022 0.002 0.127 REF 0.00 REF A A A3 A1 b D D2 E E2 e K L 0.127 REF 0.150 2.400 1.900 1.250 0.300 0.250 2.600 2.100 1.450 0.500 0.005 REF 0.006 0.094 0.075 0.049 0.012 0.010 0.102 0.083 0.057 0.020 b D A3 E2 D2 0.11 0.05 0.01 A1 E2 K D2 D2 E E2 e L 0.40 BSC 0.01 BSC K L e b 0.400 BSC 0.200 0.150 0.350 0.016 BSC 0.008 0.006 0.000 0.014 K L e ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. b 143 Revised: January 11, 2011 SP6001 Series SP6001 30 60 – 180 secs ™ Silicon Protection Array (SPA ) Products 12pF EMI Filter Array with ESD Protection Embossed Carrier Tape & Reel Specification – UDFN-08 D Embossed Carrier Tape & Reel Specification – UDFN-12 P2 oD / P2 t E AO W t E A0 W BO F KO P oD / Inches Min 0.065 0.136 0.040 0.154 0.303 0.077 0.061 0.075 0.037 Max 0.073 0.140 0.161 0.327 0.081 0.069 0.083 0.045 E F Max 1.85 3.55 4.10 8.30 2.05 1.75 2.1 1.15 Millimetres Min E F D1 D P 10P W P2 A0 B0 K0 t 1.65 3.45 1.00 1.50 min 3.90 7 .70 1.95 1.55 1.90 0.95 40.0 +/- 0.20 P Millimetres Min 1.65 3.45 0.55 3.90 7 .90 1.95 1.33 2.63 0.58 Max 1.85 3.55 0.65 4.10 8.30 2.05 1.53 2.83 0.78 Inches Min 0.065 0.136 0.021 0.154 0.311 0.077 0.052 0.103 0.023 Max 0.073 0.140 0.025 0.161 0.327 0.081 0.060 0.111 0.031 0.059 min 1.575 +/- 0.008 D1 D P 10P W P2 A0 B0 K0 t 1.50 min 40.0 +/- 0.20 K0 D1 BO F 0.059 min 1.575 +/- 0.008 0.30 max 0.012 max 0.22 max 0.009 max Embossed Carrier Tape & Reel Specification – UDFN-16 P0 P2 + + + D0 P1 + + E F W + + + + + Part Numbering System Silicon Protection Array Series Number of Channels SP 6001 – 0x U T G - 1 G= Green T= Tape & Reel Package UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) UDFN-16 (3.3x1.35mm) 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 08 = 8 Channel UDFN-16 T 12º MAX Ø 1.00 ± 0.05 12º MAX Part Marking System JH4 Inches Min 0.06 0.13 0.05 0.06 0.21 0.03 0.15 0.07 0.15 0.01 0.46 Max 0.06 0.14 0.06 0.07 0.21 0.04 0.16 0.08 0.16 0.01 0.48 144 Revised: January 11, 2011 A0 K0 B0 JHx Product Series J = SP6001 Assembly Site 4 = UDFN-08 6 = UDFN-12 8 = UDFN-16 Millimetres Min A0 B0 D0 E F K0 P0 P1 P2 T W SP6001 Series Max 1.75 3.70 1.60 1.85 5.55 1.05 4.10 2.05 4.10 0.30 12.30 JH6 JH8 1.55 3.50 1.40 1.65 5.45 0.85 3.90 1.95 3.90 0.26 11.90 Ordering Information Part Number SP6001-04UTG-1 SP6001-06UTG-1 SP6001-08UTG-1 Package uDFN-08 uDFN-12 uDFN-16 Size (mm) 1.7x1.35 2.5x1.35 3.3x1.35 Marking JH4 JH6 JH8 Min. Order Qty. 3000 3000 3000 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.