SP6002-04UTG-1

SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection HF RoHS Pb GREEN SP6002 Lead-Free/Green Series Description The Littelfuse SP6002 SPA series integrates 4 and 6 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. Pinout Features frequencies from 800MHz to 3GHz attenuation (TYP) at 1GHz ±30kV contact, ±30kV air package (TYP 0.5mm height) 1 GND 8 4 UDFN-08 5 SP6002-04UTG-1 1 6 UDFN-12 12 GND SP6002-06UTG-1 Functional Block Diagram Applications SP6002-04UTG-1 1 Cd Cd SP6002-06UTG-1 8 1 Cd Cd portable electronics 12 interfaces for handsets portable electronics device 2 Cd Cd 7 6 Cd Cd 2 Cd Cd 11 10 3 3 Cd Cd 4 Cd Cd 5 4 Cd Cd 9 8 Cd Cd 5 6 Cd Cd 7 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 95 Revised: March 25, 2010 SP6002 Lead-Free/Green Series Lead-Free/Green SP6002 7 SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Absolute Maximum Ratings Symbol TOP TSTOR Operating Temperature Storage Temperature Parameter Value -40 to 85 -60 to 150 Units °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Breakdown Voltage Reverse Leakage Current Resistance Diode Capacitance1,2 Line Capacitance1,2 ESD Withstand Voltage1 Cutoff Frequency3 Symbol VRWM VBR I RA CD CL VESD F-3dB IR=1mA VRWM=5V IR=10mA VR=2.5V,f=1MHz VR=2.5V,f=1MHz IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Above this frequency, appreciable attenutation occurs 24 ±30 ±30 100 85 7 .0 7 .8 0.1 100 15 30 36 Test Conditions Min Typ Max 6.0 8.5 1.0 115 Units V V μA Ω pF pF kV kV MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 3 Total line capacitance is two times the diode capacitance (CD). 50Ω source and 50Ω load termination SP6002 Lead-Free/Green Series 96 Revised: March 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Insertion Loss (S21) CH1 S 21 log MAG 5 dB/ REF 0 dB 1 _:-613 dB Analog Crosstalk (S41) CH1 S log MAG 10 dB/ REF 0 dB Cor Smo 1 Cor Del Smo x2 Start 3.000 000MHz Stop 6 000.000.000MHz x2 START 3.000 000 MHz STOP 6 000.000 000 MHz Line Capacitance vs. DC Bias 60 50 Capacitance (pF) 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DC Bias (V) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 97 Revised: March 25, 2010 SP6002 Lead-Free/Green Series Lead-Free/Green SP6002 SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Application Example Dx: SP6002-04 Silicon Protection Array LCD Module Controller 4 5 Input Outside World 1 8 D1 D2 D3 D4 SP6002-04UTG (μDFN) GND Signal Ground Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP6002 Lead-Free/Green Series 98 Revised: March 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Package Dimensions - UDFN-08 D Symbol A UDFN-08 Millimeters Min A A3 A1 Inches Min 0.018 0.000 Max 0.022 0.002 Max 0.550 0.050 E 0.450 0.000 A1 A3 b D 0.127 REF 0.150 1.600 1.100 1.250 0.300 0.250 1.800 1.300 1.450 0.500 0.005 REF 0.006 0.063 0.043 0.049 0.012 0.010 0.071 0.051 0.057 0.020 E2 D2 K D2 E E2 e 0.400 BSC 0.200 0.150 0.350 0.016 BSC 0.008 0.006 0.000 0.014 L K L e b Package Dimensions - UDFN-12 UDFN-12 D A Symbol Millimeters Min Max 0.550 0.050 Min 0.018 0.000 Inches Max 0.022 0.002 A A3 A1 0.450 0.000 E A1 A3 b 0.127 REF 0.150 2.400 1.900 1.250 0.300 0.250 2.600 2.100 1.450 0.500 0.005 REF 0.006 0.094 0.075 0.049 0.012 0.010 0.102 0.083 0.057 0.020 D2 E2 D D2 E E2 L e K 0.400 BSC 0.200 0.150 0.350 0.016 BSC 0.008 0.006 0.000 0.014 e b L ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 99 Revised: March 25, 2010 SP6002 Lead-Free/Green Series Lead-Free/Green SP6002 K SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Part Numbering System Product Characteristics Lead Plating Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Notes : 1. All dimensions are in millimeters SP 6002 – 0x U T G - 1 Silicon Protection Array Series Number of Channels 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 G= Green T= Tape & Reel Package UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. JHx KH4 KH6 Product Series K = SP6002 Assembly Site Ordering Information Part Number SP6002-04UTG-1 SP6002-06UTG-1 Package uDFN-08 uDFN-12 Size 1.7x1.35mm 2.5x1.35mm 4. All specifications comply to JEDEC SPEC MO-223 Issue A 4 = UDFN-08 6 = UDFN-12 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Marking Min. Order Qty. 3000 3000 Embossed Carrier Tape & Reel Specification – UDFN-08 D P2 t E Symbol E F Millimetres Min 1.65 3.45 1.00 1.50 min 3.90 4.10 Max 1.85 3.55 Min 0.065 0.136 0.040 Inches Max 0.073 0.140 - W D1 D P 0.059 min 0.154 0.161 F 10P 40.0 +/- 0.20 7 .70 1.95 1.55 1.90 0.95 0.30 max 8.30 2.05 1.75 2.1 1.15 1.575 +/- 0.008 0.303 0.077 0.061 0.075 0.037 0.327 0.081 0.069 0.083 0.045 D1 AO P BO W P2 A0 B0 K0 t 0.012 max SP6002 Lead-Free/Green Series KO 100 Revised: March 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Embossed Carrier Tape & Reel Specification – UDFN-12 P2 oD / Symbol Millimetres Min 1.65 3.45 0.55 1.50 min 3.90 4.10 Max 1.85 3.55 0.65 Min 0.065 0.136 0.021 Inches Max 0.073 0.140 0.025 t E E F D1 W D 0.059 min 0.154 0.161 BO P 10P W P2 40.0 +/- 0.20 7 .90 1.95 1.33 2.63 0.58 0.22 max 8.30 2.05 1.53 2.83 0.78 1.575 +/- 0.008 0.311 0.077 0.052 0.103 0.023 0.327 0.081 0.060 0.111 0.031 oD / A0 P F A0 B0 K0 t 0.009 max K0 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 101 Revised: March 25, 2010 SP6002 Lead-Free/Green Series Lead-Free/Green SP6002