SP725ABG

Silicon Protection Arrays SCR Diode Array for ESD and Transient Overvoltage Protection RoHS Pb GREEN SP725 Lead-Free/Green Series Description Pinout In 1 2 3 4 8 7 6 5 VVV+ V+ SP725 (SOIC) In In In Features Functional Block Diagram V+ 5, 6 IN 1 IN 2 IN 3, 4 V7, 8 Applications SP725 Lead-Free/Green Series Specifications are subject to change without notice. 67 Electronics Designers Guide www.littelfuse.com ©2008 Littelfuse Silicon Protection Arrays SCR Diode Array for ESD and Transient Overvoltage Protection Absolute Maximum Ratings Parameter Rating Units V V V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units Electrical Specifications Parameter V TA = -40 C to 105 C, VIN = 0.5VCC , Unless Otherwise Specified Symbol V V V Test Conditions Min Typ Max Units V V V V V www.littelfuse.com ©2008 Littelfuse 68 Electronics Designers Guide SP725 Lead-Free/Green Series Specifications are subject to change without notice. Silicon Protection Arrays SCR Diode Array for ESD and Transient Overvoltage Protection ESD Capability Figure 1: Electrostatic Discharge Test R1 CHARGE SWITCH H.V. SUPPLY ± VD CD RD DISCHARGE SWITCH IN DUT IEC 61000-4-2: R1 50 to 100M MIL-STD-3015.7: R 1 1 to 10M ESD Test Conditions - Table 1 STANDARD TYPE/MODE R C ±V 8kV Figure 2: Low Current SCR Forward Voltage Drop Curve 200 TA = 25oC SINGLE PULSE Figure 3: High Current SCR Forward Voltage Drop Curve 5 TA = 25oC SINGLE PULSE 160 FORWARD SCR CURRENT (mA) FORWARD SCR CURRENT (A) 4 120 3 80 2 IFWD EQUIV. SAT. ON THRESHOLD ~ 1.1V VFWD 40 1 0 600 800 1000 1200 0 0 1 2 3 FORWARD SCR VOLTAGE DROP (mV) FORWARD SCR VOLTAGE DROP (V) SP725 Lead-Free/Green Series Specifications are subject to change without notice. 69 Electronics Designers Guide www.littelfuse.com ©2008 Littelfuse Silicon Protection Arrays SCR Diode Array for ESD and Transient Overvoltage Protection Figure 4: Typical Application of the SP725 +VCC +VCC INPUT DRIVERS OR SIGNAL SOURCES LINEAR OR DIGITAL IC INTERFACE IN 1 - 4 TO +VCC V+ SP725 V- SP725 INPUT PROTECTION CIRCUIT (1 OF 4 SHOWN) Peak Transient Current Capability for Long Duration Surges Figure 5: Typical SP725 Peak Current Test Circuit With a Variable Pulse Width Input + R1 VX VARIABLE TIME DURATION CURRENT PULSE GENERA TOR CURRENT SENSE (-) (+) 1 IN 2 IN 3 IN SP725 V- 8 V- 7 V+ 6 V+ 5 C1 - + VOLTAGE PROBE R1 ~ 10 TYPICAL VX ADJ. 10V/A TYPICAL C1 ~ 100μF 4 IN - Figure 6: SP725 Typical Nonrepetitive Peak Current Pulse Capability 14 12 10 8 6 4 2 0 0.001 TA = 105oC TA = 25oC CAUTION: SAFE OPERA TING CONDITIONS LIMIT THE MAXIMUM PEAK CURRENT FOR A GIVEN PULSE WIDTH TO BE NO GREATER THAN 75% OF THE VALUES SHOWN ON EACH CURVE. V+ TO V- SUPPLY = 15V PEAK CURRENT (A) 0.01 0.1 1 PULSE WIDTH TIME (ms) 10 100 1000 www.littelfuse.com ©2008 Littelfuse 70 Electronics Designers Guide SP725 Lead-Free/Green Series Specifications are subject to change without notice. Silicon Protection Arrays SCR Diode Array for ESD and Transient Overvoltage Protection Soldering Parameters - Wave Soldering Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed Small Outline Plastic Packages (SOIC) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45o 0.25(0.010) M BM M8.15 (JEDEC MS-012-AA Issue C) L Symbol Inches Min Max Millimeters Min Max Notes e B 0.25(0.010) M C AM BS A1 ? C 0.10(0.004) 8 8 8 SP725 Lead-Free/Green Series Specifications are subject to change without notice. 71 Electronics Designers Guide www.littelfuse.com ©2008 Littelfuse Silicon Protection Arrays SCR Diode Array for ESD and Transient Overvoltage Protection Part Numbering System Product Characteristics Lead Plating Green Tape and Reel SP 725 AB T G Silicon Protection Array Series Lead Material Lead Coplanarity Package Type AB: 8 Leaded SOIC Subsitute Material Body Material Flammability Ordering Information Part Number Temp. Range (ºC) Package Marking Min. Order Qty. Embossed Carrier Tape & Reel Specification - SOIC Package Symbol Millimetres Min Max Min Inches Max www.littelfuse.com ©2008 Littelfuse 72 Electronics Designers Guide SP725 Lead-Free/Green Series Specifications are subject to change without notice.