V14MLN41206

Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor The MLN SurgeArray™ Suppressor is designed to help protect components from transient voltages that exist at the circuit board level. This device provides four independent suppressors in a single leadless chip in order to reduce part count and placement time as well as save space on printed circuit boards. SurgeArray™ devices are intended to suppress ESD, EFT and other transients in order to protect integrated circuits or other sensitive components operating at any voltage up to 18VDC. SurgeArray devices are rated to the IEC 61000-4-2 human body model ESD to help products attain EMC compliance. The array offers excellent isolation and low crosstalk between sections. The inherent capacitance of the SurgeArray Suppressor permits it to function as a filter/suppressor, thereby replacing separate zener/ capacitor combinations. The MLN array is manufactured using the Littelfuse Multilayer technology process and is similar to the Littelfuse ML and MLE Series of discrete leadless chips. The MLN can also be provided in a Dual version. Contact Littelfuse for information. Features • RoHS Compliant • Four Individual Devices in One Chip • ESD Rated to IEC 61000-4-2 (Level 4) • AC Characterized for Impedance and Capacitance • Low Adjacent Channel Crosstalk, -55dB at 10MHz (Typ) • Low Leakage • Operating Voltage up to 18VM(DC) • -55oC to 125oC Operating Temperature Range • Low-Profile, PCMCIA Compatible Size Metric 2012 3216 EIA 0805 1206 Applications • Data, Diagnostic I/O Ports • Analog Signal/Sensor Lines • Portable/Hand-Held Products • Mobile Communications/Cellular Phones • Computer/DSP Products • Industrial Instruments Including Medical 180 w w w. l i t t e l f u s e . c o m Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor V C O C O Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table. Continuous: Steady State Applied Voltage: DC Voltage Range (VM(DC)) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 125 Storage Temperature Range (TSTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 150 Device Ratings and Specifications Any Single Section MAX RATINGS (125 oC) MAXIMUM NONREPETITIVE MAXIMUM SURGE CONTINUOUS CURRENT WORKING (8/20µs) VOLTAGE VM(DC) ITM MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs) WTM PERFORMANCE SPECIFICATIONS (25 oC) MAXIMUM CLAMPING VOLTAGE (AT NOTED 8/20µs) CURRENT VC (NOTE 2) (NOTE 3) 8kV CONTACT 15kV AIR Peak Clamp (V) NEW Peak (V) 90 45 75 85 170 100 130 VN(DC) MIN VN(DC) MAX (NOTE 4) C TYP (pF) 220 430 250 140 75 100 45 MAX (pF) 300 520 300 175 100 125 75 (A) 20 30 30 30 20 30 30 (J) 0.05 0.1 0.1 0.1 0.05 0.1 0.05 (V) 19 at 1A 15.5 at 2A 23 at 2A 30 at 2A 50 at 1A 40 at 2A 50 at 1A (V) 140 60 95 110 260 165 200 (V) 40 35 50 55 100 63 95 (V) 7.1 7.1 11.0 15.9 22.0 22.0 25.0 (V) 10.8 10.8 16.0 20.3 28.0 28.0 35.0 V5.5MLN40805 V5.5MLN41206 V9MLN41206 V14MLN41206 5.5 5.5 9 14 18 18 18 NEW V18MLN40805 V18MLN41206 V18MLN41206L NOTES: 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit. 2. Direct discharge to device terminals (IEC preffered test method). 3. Corona discharge through air (represents actual ESD event) 4. Capacitance may be customized, contact Sales. For applications exceeding 125oC ambient temperature, the peak surge current and energy ratings must be reduced as shown in Figure 1. PERCENT OF PEAKVALUE Temperature Derating 100 90 50 100 PERCENT OF RATED VALUE 90 80 70 60 50 40 30 20 10 0 -55 50 60 70 80 90 100 110 120 130 140 150 10 O1 t t1 t2 TIME O1 = VIRTUAL ORIGIN OFWAVE t = TIME FROM 10% TO 90% OF PEAK t1 = VIRTUAL FRONT TIME = 1.25 x t t2 = VIRTUALTIME TO HALFVALUE (IMPULSE DURATION) EXAMPLE: FOR AN 8/20µs CURRENT WAVEFORM: 8µs = t1 = VIRTUAL FRONT TIME 20µs = t2 = VIRTUAL TIME TO HALF VALUE AMBIENT TEMPERATURE ( oC) FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM FOR CLAMPING VOLTAGE F w w w. l i t t e l f u s e . c o m 181 SURFACE MOUNT VARISTORS PART NUMBER TYPICAL ESD SUPPRESSION VOLTAGE (NOTE 1) NOMINAL VOLTAGE AT 1mA DC CURRENT CAPACITANCE AT 1MHz (1V p-p) 3 Surface Mount Varistors Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor Any Single Section 100 V18 V18 MAXIMUM STANDBY MAXIMUM CLAMP VOLTAGE Typical Performance Curves 25 20 V5.5 Varistor Voltage (V) 10000 V14 NOMINAL VOLTAGE VNOM (V) 15 V9 10 10 V5.5 5 0 0 10 100 NUMBER OF DISCHARGES 1000 1 0.00001 0.0001 0.001 0.01 0.1 1 10 100 FIGURE 3. NOMINAL VOLTAGE STABILITYTO IEC 1000-4-2 (8kV CONTACT METHOD, ONE SECTION) Current (A) FIGURE 4. V-I CHARACTERISTIC, 0805 SIZE 100 V18L 100 MAXIMUM CLAMP VOLTAGE V18 MAXIMUM STANDBY V14 V9 1 NUMBER OF SURGES 100 Varistor Voltage (V) SSurge Current (A) V5.5 V18L V18 V14 2 10 10 103 10 V9 1 ∞ 104 V5.5 105 106 1 0.00001 0.1 10 0.0001 0.001 0.01 0.1 1 10 100 100 1000 10000 Square Wave Impulse Duration (µs) FIGURE 6. 0805 SIZE PULSE RATING FOR LONG DURATION SURGES (ANY SINGLE SECTION) Current (A) FIGURE 5. V-I CHARACTERISTIC, 1206 SIZE 100 500 NUMBER OF SURGES 1 100 2 V5.5 400 Surge Current (A) 10 10 Capacitance (pF) 103 300 V9 200 V14 V18 1 ∞ 104 105 106 100 V18L 0.1 10 100 1000 10000 0 0.1 1 10 100 1000 Square Wave Impulse Duration (µs) FIGURE 7. 1206 SIZE PULSE RATING FOR LONG DURATION SURGES (ANY SINGLE SECTION) Frequency (MHz) FIGURE 8. CAPACITANCE vs FREQUENCY 182 w w w. l i t t e l f u s e . c o m Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor Any Single Section (Continued) 10000 Typical Performance Curves 400E-12 350E-12 1000 300E-12 Parallel Capacitance, Cp (F) 5.5V 250E-12 Parallel Capacitance, Cp (F) 100 200E-12 10 5.5V 18V 150E-12 3 SURFACE MOUNT VARISTORS 1000 100E-12 18V 1 50E-12 000E+0 1.0E+06 1.0E+07 1.0E+08 1.0E+09 0.1 1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10 Frequency (Hz) FIGURE 9. CAPACITANCE VS. FREQUENCY, 0805 SIZE Frequency (Hz) FIGURE 10. IMPEDENCE VS FREQUENCY, 0805 SIZE 1000 100 OHMS 10 1 0.1 1MHz 10MHz 100MHz 1GHz 10GHz Frequency FIGURE 11. CAPACITANCE VS FREQUENCY, 1206 SIZE 10000 0 -20 1000 Impeance |Z| ( ) 100 Crosstalk (dB) -40 V5.5 V9 -60 V14 V18 V18L 10 V14 V18 V18L -80 V5.5 V9 1 -100 VIN = 1VRMS Z = 50 0.1 0.1 1 10 100 1000 -120 0.001 0.01 0.1 1 10 100 Frequency (MHz) FIGURE 12. IMPEDANCE vs FREQUENCY, 1206 SIZE Frequency (MHz) FIGURE 13. ADJACENT CHANNEL CROSSTALK w w w. l i t t e l f u s e . c o m 183 Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor 230 230 Soldering Recommendations Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are IR Re-flow & Wave soldering. Typical profiles are shown in Figures 14 & 15 The recommended solder for the MLN SurgeArray suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. When using a reflow process, care should be taken to ensure that the MLN chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solderís peak temperature is essential to minimize thermal shock. TEMPERATURE ( oC)oC) TEMPERATURE ( FIGURE 14. REFLOW SOLDER PROFILE FIGURE 14. REFLOW SOLDER PROFILE 300 300 250 250 200 200 150 150 100 100 50 50 0 00.0 0.0 0.5 0.5 1.0 1.0 1.5 2.0 2.5 3.0 3.5 3.5 4.0 4.0 4.5 4.5 SECOND PREHEAT SECOND PREHEAT FIRST PREHEAT FIRST PREHEAT MAXIMUM WAVE 260 oC MAXIMUM WAVE 260 oC Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50˚C before cleaning. Lead-Free (Pb-free) Soldering Recommendations Littelfuse offers the 0805 array as the preferred solution for lead-free soldering conditions. The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but there is a wide selection of pastes & fluxes available with which the nickel barrier parts should be compatible. The reflow profile must be constrained by maximums shown in Figure16. For Pb-free Wave soldering, Figure 15 still applies. Note: the Pb-free paste, flux & profile were used for evaluation purposes by Littelfuse, based upon industry standards & practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. 1.5 TIME (MINUTES) 3.0 2.0 2.5 TIME (MINUTES) FIGURE 15. WAVE SOLDER PROFILE FIGURE 15. WAVE SOLDER PROFILE MAXIMUM TEMPERATURE 260˚C 20 - 40 SECONDS WITHIN 5˚C MAXIMUM TEMPERATURE 260˚C 20 - 40 SECONDS WITHIN 5˚C RAMP RATE 217˚C PREHEAT ZONE PREHEAT ZONE 5.0 5.0 6.0 6.0 7.0 7.0 FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE 184 w w w. l i t t e l f u s e . c o m Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor T W Mechanical Dimensions X P L S BW 3 Size 0805 Millimeter Inch 1206 Millimeter 3.2 ±0.2 1.6 ±0.2 1.35 Max 0.41 ±0.1 0.18 +0.25/-0.05 0.76 Ref 1.14 ±0.1 0.38 ±0.1 2.03 ±0.2 0.126 ±0.008 1.27 ±0.2 0.063 ±0.008 1.10 Max 0.053 Max 0.30 ±0.1 0.18 +0.25/-0.05 0.508 Ref 0.030 Ref 0.76 ±0.1 0.045 ±0.004 0.254 ±0.1 0.015 ±0.004 0.016 ±0.004 0.007 +0.01/- 0.002 Units Inch L 0.080 ±0.008 W 0.050 ±0.008 T 0.038 Max BW BL P 0.020 Ref X 0.030 ±0.004 S 0.010 ±0.004 0.012 ±0.004 0.007 +0.01/- 0.002 Recommended Pad Outline E D A B C TABLE 1. PAD LAYOUT DIMENSIONS Size 0805 Units Millimeters Inches Millimeters 1206 Inches A 0.90 0.035 0.89 0.035 B 1.30 0.051 1.65 0.065 C 2.20 0.087 2.54 0.100 D 0.35 0.014 0.46 0.018 E 0.50 0.02 0.79 0.030 w w w. l i t t e l f u s e . c o m 185 SURFACE MOUNT VARISTORS BL Multiline Transient Voltage Surge Suppressor RoHS MLN SurgeArray™ Suppressor VXXMLN TYPES Ordering Information V DEVICE FAMILY TVSS Device MAXIMUM DC WORKING VOLTAGE MULTILAYER DESIGNATOR SERIES DESIGNATOR N: Array DEVICE SIZE: 0805: 80mil x 50mil 1206: 120mil x 60mil NUMBER OF SECTIONS END TERMINATION OPTION W: Ag/Pd/Pt (1206 only) N: Nickel barrier (0805 only) 18 ML N 4 1206 W T PACKING OPTIONS A: 2500 Piece Bulk Pack H: 7in (178mm) Diameter Reel (Note) T: 13in (330mm) Diameter Reel (Note) NOTE: See Standard Shipping Quantities table. Tape and Reel Specifications • Conforms to EIA - 481, Revision A • Can be Supplied to IEC Publication 286 - 3 SYMBOL A0 B0 K0 W F E P1 P2 P0 D0 D1 t1 t2 Width of Cavity Length of Cavity Depth of Cavity Width of Tape Distance Between Drive Hole Centers and Cavity Centers Distance Between Drive Hole Centers and Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers and Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter of Cavity Piercing Embossed Tape Thickness Top Tape Thickness DESCRIPTION MILLIMETERS Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. 8 ±0.2 3.5 ±0.5 1.75 ±0.1 4 ±0.1 2 ±0.1 4 ±0.1 1.55 ±0.05 1.05 ±0.05 0.3 Max 0.1 Max NOTE: Dimensions in millimeters. t1 D0 P0 P2 E PLASTIC CARRIER TAPE PRODUCT IDENTIFYING LABEL F K0 B0 W t2 D1 P1 A0 EMBOSSMENT TOP TAPE 8mm NOMINAL 178mm OR 330mm DIA. REEL Standard Shipping Quantities DEVICE SIZE 0805 and 1206 “13” INCH REEL (“T” OPTION) 10,000 “7” INCH REEL (“H”OPTION) 2,500 BULK PACK (“A” OPTION) 2,500 186 w w w. l i t t e l f u s e . c o m