V9MLN41206

Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor The MLN SurgeArray™ Suppressor is designed to help protect components from transient voltages that exist at the circuit board level. This device provides four independent suppressors in a single “1206” leadless chip in order to reduce part count and placement time as well as save space on printed circuit boards. SurgeArray™ devices are intended to suppress ESD, EFT and other transients in order to protect integrated circuits or other sensitive components operating at any voltage up to 18VDC. SurgeArray devices are rated to the IEC 61000-4-2 human body model ESD to help products attain EMC compliance. The array offers excellent isolation and low crosstalk between sections. The inherent capacitance of the SurgeArray Suppressor permits it to function as a filter/suppressor, thereby replacing separate zener/ capacitor combinations. The MLN array is manufactured using the Littelfuse Multilayer technology process and is similar to the Littelfuse ML and MLE Series of discrete leadless chips. The MLN can also be provided in a Dual version. Contact Littelfuse for information. 3 SURFACE MOUNT VARISTORS 151 Features • Four Individual Devices in One 1206 Chip • ESD Rated to IEC 61000-4-2 (Level 4) • AC Characterized for Impedance and Capacitance • Low Adjacent Channel Crosstalk, -55dB at 10MHz (Typ) • Low Leakage (6nA at 5.5V, 30nA at 15V) • Operating Voltage up to 18VM(DC) • -55oC to 125oC Operating Temperature Range • Low-Profile, PCMCIA Compatible Applications • Data, Diagnostic I/O Ports • Analog Signal/Sensor Lines • Portable/Hand-Held Products • Mobile Communications/Cellular Phones • Computer/DSP Products • Industrial Instruments Including Medical w w w. l i t t e l f u s e . c o m Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table. MLN ARRAY Continuous: Steady State Applied Voltage: DC Voltage Range (VM(DC)). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 125 Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 150 Device Ratings and Specifications Any Single Section MAX RATINGS (125 oC) MAXIMUM NONMAXIMUM REPETITIVE CONTINUOUS SURGE WORKING CURRENT VOLTAGE (8/20µs) VM(DC) ITM MAXIMUM CLAMPING VOLTAGE (AT NOTED 8/20µs) CURRENT VC (See Fig. 3) (V) V5.5MLN41206 V9MLN41206 V14MLN41206 V18MLN41206 V18MLN41206L NOTES: 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit. See explanation of Terms on page 7. 2. Direct discharge to device terminals (IEC preffered test method). See figure 2. 3. Corona discharge through air (represents actual ESD event) 4. Capacitance may be customized, contact Sales. 5.5 9 14 18 18 (A) 30 30 30 30 20 (V) 15.5 at 2A 23 at 2A 30 at 2A 40 at 2A 50 at 1A (J) 0.1 0.1 0.1 0.1 0.05 PERFORMANCE SPECIFICATIONS (25 oC) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs) WTM UNITS V C O C O PART NUMBER TYPICAL ESD SUPPRESSION VOLTAGE (NOTE 1) NOMINAL VOLTAGE AT 1mA DC CURRENT CAPACITANCE AT 1MHz (1V p-p) (NOTE 2) (NOTE 3) 8kV CONTACT 15kV AIR Peak Clamp (V) 60 95 110 165 200 (V) 35 50 55 60 95 Peak (V) 45 75 85 100 130 VN(DC) MIN VN(DC) MAX (NOTE 4) C TYP (pF) 430 250 140 100 45 MAX (pF) 520 300 175 125 75 (V) 7.1 11.0 15.9 22.0 25.0 (V) 9.3 16.0 20.3 28.0 35.0 Temperature Derating PERCENT OF RATED VALUE For applications exceeding 125oC ambient temperature, the peak surge current and energy ratings must be reduced as shown in Figure 1. 100 90 80 70 60 50 40 30 20 10 0 -55 50 60 70 80 90 100 110 120 130 140 150 AMBIENT TEMPERATURE ( oC) FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE PERCENT OF PEAK VALUE 100 90 O1 = VIRTUAL ORIGIN OF WAVE t = TIME FROM 10% TO 90% OF PEAK t1 = VIRTUAL FRONT TIME = 1.25 x t t2 = VIRTUAL TIME TO HALF VALUE (IMPULSE DURA TION) EXAMPLE: FOR AN 8/20µs CURRENT WAVEFORM: 8µs = t1 = VIRTUAL FRONT TIME 20µs = t2 = VIRTUAL TIME TO HALF VALUE 50 10 O1 t t1 t2 TIME FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM FOR CLAMPING VOLTAGE 152 w w w. l i t t e l f u s e . c o m Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Typical Performance Curves 40 Any Single Section 70 60 30 50 SAMPLES VNOM 40 30 20 10 0 1 10 100 1000 10,000 0 20 3 SURFACE MOUNT VARISTORS 10 30 35 40 45 50 55 60 65 70 NUMBER OF DISCHARGES CAPACITANCE (pF) FIGURE 4. PRODUCT DISTRIBUTION OF CAPACITANCE (1MHz) Typical Performance Curves 90 80 VARISTOR VOLTAGE (V) 70 60 50 40 30 20 10 0 1.0E-07 1.0E-06 1.0E-05 Any Single Section MAXIMUM CLAMP VOLTAGE MAXIMUM STANDBY CURRENT (LEAKAGE) TYPICAL 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 CURRENT (A) FIGURE 5. V-I CHARACTERISTICS 100 NUMBER OF SURGES 1 SURGE CURRENT (A) 10 2 10 100 103 104 105 106 1 ∞ 0.1 10 100 SQUARE WAVE PULSE DURA TION ( µs) 1000 10000 FIGURE 6. PULSE RATING FOR LONG DURATION SURGES (ANY SINGLE SECTION) 153 w w w. l i t t e l f u s e . c o m Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Typical Performance Curves 100 NORMALIZED VARISTOR VOLTAGE (%) -40oC 25oC 85oC 125oC Any Single Section (Continued) 10 0.1µA 1 µA 1 0 µA CURRENT (A) 100 µA 1mA FIGURE 7. STANDBY CURRENT AT NORMALIZED VARISTOR VOLTAGE AND TEMPERATURE (ANY SINGLE SECTION) 70 65 CAPACITANCE (pF) 60 55 50 45 40 1MHz 10MHz FREQUENCY 100MHz 1GHz FIGURE 8. CAPACITANCE vs FREQUENCY 1000 100 OHMS 10 1 0.1 1MHz 10MHz 100MHz FREQUENCY 1GHz 10GHz FIGURE 9. EQUIVALENT SERIES RESISTANCE 154 w w w. l i t t e l f u s e . c o m Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Typical Performance Curves 10000 Any Single Section (Continued) 1000 IMPEDANCE (Z) 100 10 3 SURFACE MOUNT VARISTORS 155 1 0.1 1MHz 10MHz 100MHz FREQUENCY 1GHz 10GHz FIGURE 10. IMPEDANCE vs FREQUENCY 0 -20 CROSSTALK (dB) -40 -60 VIN = 1VRMS Z = 50Ω -80 -100 -120 1kHz 10kHz 100kHz 1MHz FREQUENCY 10MHz 100MHz 1GHz FIGURE 11. ADJACENT CHANNEL CROSSTALK Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are Infrared (IR) Reflow, Vapour Phase Reflow, and Wave Soldering. Typical profiles are shown in Figures 12, 13 and 14. When wave soldering, the MLN suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a conveyor and run through the soldering process to contact the wave. With IR and Vapour Phase Reflow, the device is placed in a solder paste on the substrate. As the solder paste is heated, it reflows and solders the unit to the board. The recommended solder for the MLN suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. When using a reflow process, care should be taken to ensure that the MLN chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solders peak temperature is essential to minimize thermal shock. Examples of the soldering conditions for the MLN array of suppressors are given in the tables below. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to gradually cool to less than 50oC before cleaning. w w w. l i t t e l f u s e . c o m Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor 250 MAXIMUM TEMPERATURE 222 oC 200 TEMPERATURE ( oC) TEMPERATURE ( oC) 40-80 SECONDS ABOVE 183 oC RAMP RA TE 50oC/s 100 PREHEAT ZONE 50 150 150 0 0 0 0.5 1.0 1.5 2.0 2.5 TIME (MINUTES) 3.0 3.5 4.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 TIME (MINUTES) FIGURE 12. IR REFLOW SOLDER PROFILE FIGURE 14. VAPOR PHASE SOLDER PROFILE 300 MAXIMUM WAVE 260 oC 250 TEMPERATURE ( oC) 200 Recommended Pad Outline E D A 150 SECOND PREHEAT C 100 FIRST PREHEAT 50 0 0 B 0.5 1.0 1.5 2.0 2.5 3.0 TIME (MINUTES) 3.5 4.0 4.5 TABLE 1. PAD LAYOUT DIMENSIONS DIMENSION Millimeters Inches A 0.89 0.035 B 1.65 0.065 C 2.54 0.100 D 0.46 0.018 E 0.79 0.030 FIGURE 13. WAVE SOLDER PROFILE Mechanical Dimensions T W X P L S BW BL L Inch Millimeter 156 W 0.063 ±0.008 1.6 ±0.2 T 0.053 Max 1.35 Max BW BL P 0.030 Ref 0.76 Ref X 0.045 ±0.004 1.14 ±0.1 S 0.015 ±0.004 0.38 ±0.1 0.126 ±0.008 3.2 ±0.2 0.016 ±0.004 0.007 +0.01/- 0.002 0.41 ±0.1 0.18 +0.25/-0.05 w w w. l i t t e l f u s e . c o m Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Ordering Information VXXMLN TYPES V DEVICE FAMILY TVSS Device MAXIMUM DC WORKING VOLTAGE 18 ML N 4 1206 W T PACKING OPTIONS A: 2500 Piece Bulk Pack H: 7in (178mm) Diameter Reel (Note) T: 13in (330mm) Diameter Reel (Note) NOTE: See Standard Shipping Quantities table. MULTILAYER DESIGNATOR SERIES DESIGNATOR N: Array DEVICE SIZE: i.e., 120 mil x 60 mil NUMBER OF SECTIONS END TERMINATION OPTION W: Ag/Pd/Pt 3 SURFACE MOUNT VARISTORS Tape and Reel Specifications • Conforms to EIA - 481, Revision A • Can be Supplied to IEC Publication 286 - 3 SYMBOL A0 B0 K0 W F E P1 P2 P0 D0 D1 t1 t2 Width of Cavity Length of Cavity Depth of Cavity Width of Tape Distance Between Drive Hole Centers and Cavity Centers Distance Between Drive Hole Centers and Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers and Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter of Cavity Piercing Embossed Tape Thickness Top Tape Thickness DESCRIPTION MILLIMETERS Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. 8 ±0.2 3.5 ±0.5 1.75 ±0.1 4 ±0.1 2 ±0.1 4 ±0.1 1.55 ±0.05 1.05 ±0.05 0.3 Max 0.1 Max NOTE: Dimensions in millimeters. t1 D0 P0 P2 E PLASTIC CARRIER TAPE PRODUCT IDENTIFYING LABEL F K0 B0 W t2 D1 P1 A0 EMBOSSMENT TOP TAPE 8mm NOMINAL 178mm OR 330mm DIA. REEL Standard Shipping Quantities DEVICE SIZE 1206 “13” INCH REEL (“T” OPTION) 10,000 “7” INCH REEL (“H”OPTION) 2,500 BULK PACK (“A” OPTION) 2,500 157 w w w. l i t t e l f u s e . c o m