L1N4007FT1G

L1N4001FT1G thru L1N4007FT1G Surface Mount Glass Passivated Junction Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * 1.0 A operation at TA=75°C with no thermal runaway * Typical IR less than 1.0µA * Lead free in comply with EU RoHS 2011/65/EU directives Mechanical Data Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE Terminals: Tin Plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0155 g Handling precautin:None Electrical Characteristic 1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol codeM1M2M3M4M5M6 Device marking code symbol M7 L1N40 L1N40 L1N40 L1N40 L1N40 L1N40 L1N40 01FT1G 02FT1G 03FT1G 04FT1G 05FT1G 06FT1G 07FT1G M1 M2 M3 M4 M5 M6 M7 Unit Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current lead length at TC = 75°C(Note 1) IF(AV) 1.0 A Peak forward surge current 8.3ms single half sinewave superimposed on rated load (JEDEC Method) IFSM 30 A reverse surger current(20mS) IRSM 18 mA Typical thermal resistance (Note 1) RθJA 110 °C/W TJ –55 to +150 °C TSTG –55 to +150 °C Operating junction temperature range storage temperature range Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. symbol L1N40 L1N40 L1N40 L1N40 L1N40 L1N40 L1N40 01FT1G 02FT1G 03FT1G 04FT1G 05FT1G 06FT1G 07FT1G Unit Maximum instantaneous forward voltage at 1.0A VF 1.1 V Maximum DC reverse current TJ= 25°C at rated DC blocking voltage TJ = 125°C IR 5.0 50 µA Typical junction capacitance at 4.0V, 1MHz CJ 13 PF Parameter Symbol NOTES: 1. 8.0mm2 (.013mm thick) land areas L1N4001FT1G thru L1N4007FT1G 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or Inductive Load 1.0 0.5 8.0mm2 (.013mm thick) land areas 0 0 0.1 TJ = 25°C Pulse width = 300µs 1% Duty Cycle 0.01 0.001 0.6 15 0 0.8 1.0 1.2 1.4 Instantaneous Forward Voltage 10 Number of Cycles at 60Hz 100 10 Tj=125℃ 1.0 Tj=75℃ 0.1 Tj=25℃ 0.01 1.6 Fig 5. –typical transient thermal impedance 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance 10 1.0 0.1 100 10 TJ = 25°C f = 1.0 MHz Vsig = 50mVp-p 1.0 0.01 0.1 1.0 10 t,Pulse duration,sec 100 100 Fig 4. – Typical Reverse Characteristics Junction Capacitance (pF) Transient thermal impedance(° 30 1 Instantaneous Reverse Current (µA) 1.0 100 TJ = TJ max 8.3ms Single Half Sine-wave (JEDEC Method) 25 50 75 100 125 150 175 CASE TEMPERATURE:Tc(°C) Fig 3. – Typical Instantaneous Forward Characteristics 10 Instantaneous Forward Current (A) Average Forward Rectified Current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 0.1 1 10 Reverse Voltage (V) L1N4001FT1G thru L1N4007FT1G 3. dimension: SOD123-FL MILLIMETERS MIN MAX 3.5 3.9 0.75 0.95 2.6 3.0 1.6 2.0 0.45Typ 0.9 1.2 0.12 0.22 0.8Typ DIM A B C D E H J K INCHES MIN MAX 0.138 0.159 0.029 0.037 0.103 0.119 0.063 0.079 0.018Typ 0.036 0.047 0.005 0.009 0.032Typ Suggested solder pad layout B C A Dimensions in inches and (millimeters) PACKAGE A B C SOD123-FL 0.044(1.10 0.040(1.00) 0.079(2.00) L1N4001FT1G thru L1N4007FT1G Reel packing PACKAGE SOD123-FL REEL SIZE 7" REEL (PCS) COMPONENT SPACING 3,000 BOX INNER BOX REEL DIA. (pcs) (mm) (mm) 30,000 183*183*123 178 (mm) 4.0 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP)