L1SS400GT1G

LESHAN RADIO COMPANY, LTD. Switching diode • Applications High speed switching • Features 1) Extremely small surface mounting type. 2) High Speed. 3) High reliability. • Construction Silicon epitaxial planar • We declare that the material of product compliance with RoHS requirements. • Device Marking L1SS400GT1G=3 1 CATHODE 2 ANODE 2 L1SS400GT1G 1 SOD - 723 ABSOLUTE MAXIMUM RATINGS (Ta = 25°C) Parameter Symbol Peak reverse voltage VRM DC reverse voltage VR Peak forward current I FM Mean rectifying current IO Surge current (1s) I surge Junction temperature Tj Storage temperature Tstg Limits 90 80 225 100 500 125 – 55 ~ +125 Unit V V mA mA mA °C °C ELECTRICAL CHARACTERISTICS (Ta = 25°C) Parameter Symbol Min. Forward voltage VF – Reverse current IR – Capacitance between terminals CT – Reverse recovery time trr – Typ. – – 0.72 – Max. 1.2 0.1 3.0 4 Unit V µA pF n Conditions I F=100mA VR=80V VR=0.5V , f=1MHz sR=6V , V =10mA , RL=100 Ω IF ORDRING INFORMATION Device L1SS400GT1G L1SS400GT3G Marking 3 3 Shipping 3000/Tape&Reel 10000/Tape&Reel 1/3 LESHAN RADIO COMPANY, LTD. L1SS400GT1G ELECTRICAL CHARACTERISTIC CURVES (Ta = 25°C) 1 1m FORWARD CURRENT : IF (A) 0.1m 100m REVERSE CURRENT : IR (A) 10µ 10m 1µ 1m 100n 100µ 10n 10µ 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1n 0 20 40 60 80 100 120 FORWARD VOLTAGE : VF (V) REVERSE VOLTAGE : VR (V) Fig.1 Forward characteristics CAPACITANCE BETWEEN TERMINALS : CT (pF) 10 3 Fig.2 Reverse characteristics REVERSE RECOVERY TIME : trr (ns) 5 2 2 1 0.5 1 0.2 0.1 0 2 4 6 8 10 12 14 0 0 10 20 30 REVERSE VOLTAGE : VR (V) FORWARD CURRENT : I F (mA) Fig.3 Capacitance between terminals 100 Fig.4 Reverse recovery time characteristics 50 SURGE CURRENT : Isurge (A) 0.01µF 20 D.U.T. 5kΩ 50Ω 10 PULSE GENERATOR OUTPUT 50Ω SAMPLING OSCILLOSCOPE 5 2 1 0.1 1 10 100 1000 10,000 Fig.6 Reverse recovery time (trr) measurement circuit PULSE WIDTH : TW (ms) Fig.5 Surge current characteristics 2/3 LESHAN RADIO COMPANY, LTD. L1SS400GT1G SOD−723 D −X− −Y− E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b c D E HE L MILLIMETERS INCHES MIN NOM MAX MIN NOM MAX 0.49 0.52 0.55 0.019 0.020 0.022 0.25 0.28 0.32 0.0098 0.011 0.013 0.08 0.12 0.15 0.0032 0.0047 0.0059 0.95 1.00 1.05 0.037 0.039 0.041 0.55 0.60 0.65 0.022 0.024 0.026 1.35 1.40 1.45 0.053 0.055 0.057 0.15 0.20 0.25 0.006 0.0079 0.010 b 2X 0.08 (0.0032) X Y A c L HE SOLDERING FOOTPRINT* 1.1 0.043 0.45 0.0177 0.50 0.0197 SCALE 10:1 mm inches 3/3