L1SS400T1G

LESHAN RADIO COMPANY, LTD. Switching diode L1SS400T1G • Applications High speed switching • Features 1) Extremely small surface mounting type. 1 2) High Speed. 3) High reliability. • Construction Silicon epitaxial planar • We declare that material of product compliance with ROHS requirements. 2 SOD - 523 1 CATHODE 2 ANODE ABSOLUTE MAXIMUM RATINGS (Ta = 25°C) Parameter Symbol Peak reverse voltage VRM DC reverse voltage VR Peak forward current I FM Mean rectifying current IO Surge current (1s) I surge Junction temperature Tj Storage temperature Tstg Limits 90 80 225 100 500 150 – 55 ~ +150 ELECTRICAL CHARACTERISTICS (Ta = 25°C) Parameter Symbol Min. Forward voltage VF – Reverse current IR – Capacitance between terminals CT – Reverse recovery time trr – Typ. – – 0.72 – Unit V V mA mA mA °C °C Max. 1.2 0.1 3.0 4 Unit V µA pF ns Conditions I F=100mA VR=80V VR=0.5V , f=1MHz VR=6V , IF=10mA , RL=100 Ω ORDRING INFORMATION Device Marking Shipping L1SS400T1G A 3000/Tape&Reel L1SS400T3G A 10000/Tape&Reel Rev.O 1/3 LESHAN RADIO COMPANY, LTD. L1SS400T1G ELECTRICAL CHARACTERISTIC CURVES (Ta = 25°C) 1m 1 FORWARD CURRENT : IF (A) 0.1m REVERSE CURRENT : IR (A) 100m 10m 1m 100µ 10µ 1µ 100n 10n 1n 10µ 0.2 0.4 0.6 0.8 1.0 1.2 0 1.4 20 40 60 80 100 FORWARD VOLTAGE : VF (V) REVERSE VOLTAGE : VR (V) Fig.1 Forward characteristics Fig.2 Reverse characteristics 10 120 3 5 REVERSE RECOVERY TIME : trr (ns) CAPACITANCE BETWEEN TERMINALS : CT (pF) 0 2 1 0.5 0.2 2 1 0 0.1 0 2 4 6 8 10 12 14 REVERSE VOLTAGE : VR (V) Fig.3 Capacitance between terminals 0 10 20 30 FORWARD CURRENT : I F (mA) Fig.4 Reverse recovery time characteristics 100 SURGE CURRENT : Isurge (A) 50 0.01µF D.U.T. 20 10 PULSE GENERATOR OUTPUT 50Ω 5kΩ 50Ω SAMPLING OSCILLOSCOPE 5 2 Fig.6 Reverse recovery time (trr) measurement circuit 1 0.1 1 10 100 1000 10,000 PULSE WIDTH : TW (ms) Fig.5 Surge current characteristics Rev.O 2/3 LESHAN RADIO COMPANY, LTD. L1SS400T1G SOD-523 −X− D −Y− E 2X b 0.08 1 M 2 X Y TOP VIEW A c NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A b c D E HE L L2 MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 HE SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 2X 0.48 PACKAGE OUTLINE 1.80 2X 0.40 DIMENSION: MILLIMETERS Rev.O 3/3