LESHAN RADIO COMPANY, LTD.
General Purpose Transistors
PNP Silicon
We declare that the material of product compliance with RoHS requirements. ORDERING INFORMATION Device L2SA1774XT1G L2SA1774XT3G Marking FX FX Shipping 3000/Tape & Reel 10000/Tape & Reel
1 2
L2SA1774XT1G
3
SC-89
!Absolute maximum ratings (Ta=25°C)
Parameter Collector-base voltage Collector-emitter voltage Emitter-base voltage Collector current Collector power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC Limits −60 −50 −6 −0.15 Unit V V V A (DC)
1 BASE 2 EMITTER COLLECTOR 3
PC
0.15
W
Tj Tstg
150 −55~+150
˚C ˚C
!Electrical characteristics (Ta=25°C)
Parameter Collector-base breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector cutoff current Emitter cutoff current Collector-emitter saturation voltage DC current transfer ratio Transition frequency Output capacitance Symbol BVCBO BVCEO BVEBO ICBO IEBO VCE(sat) hFE fT Cob Min. −60 −50 −6 − − − 120 − − Typ. − − − − − − − 140 4.0 Max. − − − −0.1 −0.1 −0.5 560 − 5.0 Unit V V V µA µA V − MHz pF IC=−50µA IC=−1µA IE=−50µA VCB=−60V VEB=−6V IC/IB=−50mA/−5mA VCE=−6V, IC=−1mA VCE=−12V, IE=2mA, f=30MHz VCB=−12V, IE=0A, f=1MHz Conditions
!Device marking
L2SA1774QT1G=FQ L2SA1774ST1G=FS L2SA1774RT1G=FR
! hFE values are classified as follows:
Item hFE Q 120~270 R 180~390 S 270~560
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LESHAN RADIO COMPANY, LTD.
L2SA1774XT1G
!Electrical characteristic curves
−50
COLLECTOR CURRENT : Ic (mA)
COLLECTOR CURRENT : IC (mA)
−20 −10 −5 −2 −1 −0.5 −0.2 −0.1
COLLECTOR CURRENT : I C (mA)
Ta=100˚C 25˚C −40˚C
VCE=−6V
−10
−35.0 Ta=25˚C
−100
−31.5 −28.0 −24.5
Ta=25˚C −500 −450 −400 −350 −300
−8
−80
−6
−21.0 −17.5
−60
−250 −200
−4
−14.0 −10.5
−40
−150 −100
−2
−7.0 −3.5µA
−20
−50µA
−0.2 −0.4 −0.6 −0.8 −1.0 −1.2 −1.4 −1.6
0
−0.4
−0.8
−1.2
IB=0 −1.6 −2.0
IB =0 0 −1 −2 −3 −4 −5
BASE TO EMITTER VOLTAGE : VBE (V)
COLLECTOR TO MITTER VOLTAGE : VCE (V)
COLLECTOR TO EMITTER VOLTAGE : VCE (V)
Fig.1 Grounded emitter propagation characteristics
Fig.2 Grounded emitter output characteristics (I)
Fig.3 Grounded emitter output characteristics (II)
Ta=25˚C
VCE=−5V −3V −1V
DC CURRENT GAIN : hFE
200
COLLECTOR SATURATION VOLTAGE : VCE(sat) (V)
500
500 Ta=100˚C 25˚C −40˚C
−1
Ta=25˚C
DC CURRENT GAIN : hFE
−0.5
200
100
−0.2 IC/IB=50 −0.1 20 10
100
50
50
VCE=−6V −5 −10 −20 −50 −100
−0.05 −0.2 −0.5 −1 −2 −5 −10 −20 −50 −100
−0.2 −0.5 −1
−2
−5 −10 −20
−50 −100
−0.2 −0.5 −1
−2
COLLECTOR CURRENT : IC (mA)
COLLECTOR CURRENT : IC (mA)
COLLECTOR CURRENT : IC (mA)
Fig.4 DC current gain vs. collector current (I)
Fig.5 DC current gain vs. collector current (II)
Fig.6 Collector-emitter saturation voltage vs. collector current (I)
COLLECTOR SATURATION VOLTAGE : VCE(sat) (V)
lC/lB=10
−0.5
TRANSITION FREQUENCY : fT (MHz)
Ta=25˚C VCE=−12V
COLLECTOR OUTPUT CAPACITANCE : Cob (pF) EMITTER INPUT CAPACITANCE : Cib (pF)
−1
1000
20
Cib
10
500
Ta=25˚C f=1MHz IE =0A IC =0A
Co b
−0.2 Ta=100˚C 25˚C −40˚C
200
5
−0.1
100
2
−0.05 −0.2 −0.5 −1 −2 −5 −10 −20 −50 −100
50 0.5 1 2 5 10 20 50 100
−0.5
−1
−2
−5
−10
−20
COLLECTOR CURRENT : IC (mA)
EMITTER CURRENT : IE (mA)
COLLECTOR TO BASE VOLTAGE : VCB (V) EMITTER TO BASE VOLTAGE : VEB (V)
Fig.7 Collector-emitter saturation voltage vs. collector current (II)
Fig.8 Gain bandwidth product vs. emitter current
Fig.9 Collector output capacitance vs. collector-base voltage Emitter inputcapacitance vs. emitter-base voltage
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LESHAN RADIO COMPANY, LTD.
L2SA1774XT1G
SC-89
A -X-
3 1 2
B -Y-
S
K G
2 PL
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 463C-01 OBSOLETE, NEW STANDARD 463C-02. MILLIMETERS MIN NOM MAX 1.50 1.60 1.70 0.75 0.85 0.95 0.60 0.70 0.80 0.23 0.28 0.33 0.50 BSC 0.53 REF 0.10 0.15 0.20 0.30 0.40 0.50 1.10 REF −−− −−− 10 _ −−− −−− 10 _ 1.50 1.60 1.70 INCHES NOM 0.063 0.034 0.028 0.011 0.020 BSC 0.021 REF 0.006 0.016 0.043 REF −−− −−− 0.063
D 0.08 (0.003)
M
3 PL
XY
M C
N J -TSEATING PLANE
DIM A B C D G H J K L M N S
MIN 0.059 0.030 0.024 0.009 0.004 0.012 −−− −−− 0.059
MAX 0.067 0.040 0.031 0.013 0.008 0.020 10 _ 10 _ 0.067
H
H
L
G RECOMMENDED PATTERN OF SOLDER PADS
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