L74VHC1GT01DFT1

LESHAN RADIO COMPANY, LTD. 2–Input NAND Gate with Open Drain Output with LSTTL–Compatible Inputs L74VHC1GT01 The L74VHC1GT01 is an advanced high speed CMOS 2–input NAND gate with an open drain output fabricated with silicon gate CMOS technology. It achieves high speed peration similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including an open drain output which provides the ability to set output switching level. This allows the L74VHC1GT01 to be used to interface 5 V circuits to circuits of any voltage between V CC and 7 V using an external resistor and power supply. The device input is compatible with TTL–type input thresholds and the output has a full 5.0 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic–level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high–voltage power supply. The L74VHC1GT01 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the L74VHC1GT01 to be used to interface 5 V circuits to 3 V circuits. The output structures also provide protection when V CC = 0 V. These input and output structures help prevent device destruction caused by supply voltage – input/output voltage mismatch, battery backup, hot insertion, etc. • High Speed: t PD = 3.7 ns (Typ) at V CC = 5 V • Low Internal Power Dissipation: I CC = 2 mA (Max) at T A = 25°C • Power Down Protection Provided on Inputs • Pin and Function Compatible with Other Standard Logic Families • Chip Complexity: FETs = 62; Equivalent Gates = 16 MARKING DIAGRAMS 5 4 1 2 3 V0d SC–88A / SOT–353/SC–70 DF SUFFIX Pin 1 d = Date Code 5 4 Figure 1. Pinout (Top View) 1 2 3 V0d Figure 2. Logic Symbol Pin 1 d = Date Code TSOP–5/SOT–23/SC–59 DT SUFFIX FUNCTION TABLE PIN ASSIGNMENT 1 2 3 4 5 IN B IN A GND OUT Y V CC A L L H H Inputs B L H L H Output Y Z Z Z L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. 1/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT01 MAXIMUM RATINGS Parameter Value Unit DC Supply Voltage – 0.5 to + 7.0 V DC Input Voltage – 0.5 to 7.0 V DC Output Voltage – 0.5 to 7.0 V DC Input Diode Current –20 mA DC Output Diode Current V OUT < GND; V OUT > V CC +20 mA DC Output Sink Current + 25 mA DC Supply Current per Supply Pin +50 mA Power dissipation in still air SC–88A, TSOP–5 200 mW Thermal resistance SC–88A, TSOP–5 333 °C/W Lead Temperature, 1 mm from Case for 10 Seconds 260 °C Junction Temperature Under Bias + 150 °C Storage temperature –65 to +150 °C ESD Withstand Voltage Human Body Model (Note 2) >2000 V Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A Latch–Up Performance Above V CC and Below GND at 125°C (Note 5) ± 500 mA I LATCH–UP 1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22–A114–A 3. Tested to EIA/JESD22–A115–A 4. Tested to JESD22–C101–A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Parameter V CC DC Supply Voltage V IN DC Input Voltage V OUT DC Output Voltage TA Operating Temperature Range t r ,t f Input Rise and Fall Time Min 2.0 0.0 0.0 – 55 0 0 Max 5.5 5.5 7.0 + 125 100 20 Unit V V V °C ns/V Symbol V CC V IN V OUT I IK I OK I OUT I CC PD θ JA TL TJ T stg V ESD V CC = 3.3 ± 0.3 V V CC = 5.0 ± 0.5 V DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 NORMALIZED FAILURE RATE 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature 2/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT01 DC ELECTRICAL CHARACTERISTICS V Symbol V IH Parameter Minimum High–Level Input Voltage Test Conditions CC T A = 25°C Min 1.4 2.0 2.0 0.53 0.8 0.8 1.9 2.9 4.4 2.58 3.94 0.0 0.0 0.0 0.1 0.1 0.1 0.36 0.36 ±0.1 2.0 0.25 T A < 85°C –55°C to 125°C Min 1.4 2.0 2.0 0.53 0.8 0.8 1.9 2.9 4.4 2.48 3.80 0.1 0.1 0.1 0.44 0.44 ±1.0 20 2.5 (V) 3.0 4.5 5.5 Typ Max Max Min 1.4 2.0 2.0 Max Unit V V IL Maximum Low–Level Input Voltage 3.0 4.5 V IN = V IH or V IL I OH = – 50 µA V IN = V IH or V IL I OH = –4 mA 5.5 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 0 to5.5 5.5 0 V 0.53 0.8 0.8 1.9 2.9 4.4 2.34 3.66 0.1 0.1 0.1 0.52 0.52 ±1.0 40 5.0 V OH Minimum High–Level Output Voltage V IN = V IH or V IL 2.0 3.0 4.0 V V OL Maximum Low–Level Output Voltage V IN = V IH or V IL I OH = –8 mA V IN = V IH or V IL I OL = 50 µA V IN = V IH or V IL I OL = 4 mA V I IN I CC I OPD Maximum Input Leakage Current Maximum Quiescent Supply Current Maximum Off–state Leakage Current I OL = 8 mA V IN = 5.5 V or GND V IN = V CC or GND V OUT = 5.5 V µA µA µA AC ELECTRICAL CHARACTERISTICS C load = 50 pF, Input t r = t f = 3.0 ns T A = 25°C Symbol t PZL Parameter Maximum Output Enable Time, Input A or B to Y Test Conditions V CC = 3.3 ± 0.3 V C L = 15 pF R L = R I = 500 Ω C L = 50 pF V CC = 5.0 ± 0.5 V C L = 15 pF R L = R I = 500 Ω C L = 50 pF V CC = 3.3 ± 0.3 V C L = 50 pF R L = R I = 500 Ω V CC = 5.0 ± 0.5 V C L = 50 pF R L = R I = 500 Ω Min Typ 5.5 8.0 3.7 5.2 8.0 5.2 4 T A < 85°C 55°C to 125°C Max Min Max Min Max Unit 7.9 11.4 5.5 7.5 11.4 7.5 10 9.5 13.0 6.5 8.5 13.0 8.5 10 11.0 15.5 8.0 8.0 15.5 10.0 10 pF ns t PLZ Maximum Output Disable Time ns C IN Maximum Input Capacitance C PD Power Dissipation Capacitance (Note 6) Typical @ 25°C, V CC = 5.0 V 18 pF 6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD x V CCx f in + I CC . C PD is used to determine the no– load dynamic power consumption; P D = C PD x V CC 2 x f in + I CCx V CC . 3/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT01 Figure 4. Output Voltage Mismatch Application Figure 5. Switching Waveforms C L = 50 pF equivalent (Includes jig and probe capacitance) R L = R 1 = 500 Ω or equivalent R T = Z OUT of pulse generator (typically 50 Ω) Figure 6. Test Circuit Figure 7. Complex Boolean Functions Figure 8. LED Driver Figure 9. GTL Driver DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number L74VHC1GT01DFT1 L74VHC1GT01DFT2 L74VHC1GT01DFT4 L74VHC1GT01DTT1 L74VHC1GT01DTT3 Logic Circuit Indicator L L L L L Temp Range Identifier 74 74 74 74 74 Technology VHC1G VHC1G VHC1G VHC1G VHC1G Device Function T01 T01 T01 T01 T01 Package Type Package Tape and (Name/SOT#/ Suffix Reel Suffix Common Name) DF DF DF DT DT T1 T2 T4 T1 T3 SC–70/SC–88A/ SOT–353 SC–70/SC–88A/ SOT–353 SC–70/SC–88A/ SOT–353 SOT–23/TSOPS/ SC–59 SOT–23/TSOPS/ SC–59 Tape and Reel Size 178 mm (7 in) 3000 Unit 178 mm (7 in) 3000 Unit 330 mm (13 in) 10,000 Unit 178 mm (7 in) 3000 Unit 330 mm (13 in) 10,000 Unit 4/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT01 PACKAGE DIMENSIONS SC70−5/SC−88A/SOT−353 DF SUFFIX G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 A 5 4 S 1 2 3 −B− D 5 PL 0.2 (0.008) M B M N J C DIM A B C D G H J K N S H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches 5/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT01 PACKAGE DIMENSIONS SOT23−5/TSOP−5/SC59−5 DT SUFFIX NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181 D 5 1 2 4 3 S B L G A J C 0.05 (0.002) H K M DIM A B C D G H J K L M S SOLDERING FOOTPRINT* 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches 6/6