LBSS139DW1T1G
S-LBSS139DW1T1G
Power MOSFET
200 mAmps, 50 Volts N–Channel SC-88
1. FEATURES
●
We declare that the material of product compliance with
RoHS requirements and Halogen Free.
●
S- prefix for automotive and other applications requiring
unique site and control change requirements; AEC-Q101
SC88(SOT-363)
qualified and PPAP capable.
●
Low threshold voltage (VGS(th): 0.5V...1.5V) makes it ideal for low
voltage applications.
●
ESD Protected:1500V
2. DEVICE MARKING AND ORDERING INFORMATION
Device
Marking
Shipping
LBSS139DW1T1G
J2
3000/Tape&Reel
LBSS139DW1T3G
J2
10000/Tape&Reel
3. MAXIMUM RATINGS(Ta = 25ºC)
Parameter
Drain–Source Voltage
Gate–to–Source Voltage – Continuous
Symbol
Limits
Unit
VDSS
50
Vdc
VGS
±20
Vdc
ID
200
IDM
800
Symbol
Limits
Unit
PD
380
mW
Drain Current
mAdc
– Continuous TA = 25°C
– Pulsed (tp≤10μs)
4. THERMAL CHARACTERISTICS
Parameter
Total Device Dissipation,
FR−4 Board (Note 1) @ TA = 25ºC
3.05
mW/ºC
RΘJA
328
ºC/W
TJ,Tstg
−55∼+150
ºC
260
ºC
Derate above 25ºC
Thermal Resistance,
Junction–to–Ambient(Note 1)
Junction and Storage temperature
Maximum Lead Temperature for Soldering TL
Purposes, for 10 seconds
1. FR–4 = 1.0×0.75×0.062 in.
Leshan Radio Company, LTD.
Rev.B Jan 2016
1/7
LBSS139DW1T1G, S-LBSS139DW1T1G
Power MOSFET
5. ELECTRICAL CHARACTERISTICS (Ta= 25ºC)
OFF CHARACTERISTICS
Symbol
Characteristic
Drain–Source Breakdown Voltage
VBRDSS
(VGS = 0, ID = 250μAdc)
Min.
Typ.
Max.
50
-
-
Unit
Vdc
μAdc
Zero Gate Voltage Drain Current
IDSS
(VGS = 0, VDS = 25 Vdc)
(VGS = 0, VDS = 50 Vdc)
Gate–Body Leakage Current, Forward
IGSSF
(VGS = 20 Vdc)
Gate–Body Leakage Current, Reverse
IGSSR
(VGS = - 20 Vdc)
-
-
0.1
-
-
0.5
μAdc
-
-
10
μAdc
-
-
-10
ON CHARACTERISTICS (Note 2)
Gate Threshold Voltage
VGS(th)
(VDS = VGS, ID = 1.0mAdc)
Static Drain–Source On–State Resistance
Vdc
0.5
-
1.5
RDS(on)
(VGS = 2.75 Vdc, ID < 200 mAdc,
Ohms
-
5.6
10
-
-
3.5
TA = –40°C to +85°C)
(VGS = 5.0 Vdc, ID = 200 mAdc)
Forward Transconductance
gfs
(VDS = 25 Vdc, ID = 200 mAdc, f = 1.0 kHz)
mS
100
-
-
DYNAMIC CHARACTERISTICS
Input Capacitance
Ciss
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)
Output Capacitance
Coss
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)
Reverse Transfer Capacitance
Crss
(VDS = 25 Vdc, VGS = 0, f = 1.0 MHz)
pF
-
22.8
-
-
3.5
-
pF
pF
-
2.9
-
SWITCHING CHARACTERISTICS
ns
Turn-On Delay Time
Turn-Off Delay Time
(VDD = 30 Vdc , VGEN =
10 V,RG =25Ω ,RL =60
Ω,ID =500 mAdc)
td(on)
-
3.8
-
td(off)
-
19
-
2.Pulse Test: Pulse Width ≤300 μs, Duty Cycle ≤2.0%.
Leshan Radio Company, LTD.
Rev.B Jan 2016
2/7
LBSS139DW1T1G, S-LBSS139DW1T1G
Power MOSFET
6.ELRCTRICAL CHARACTERISTICS CURVES
Power Dissipation
1.0
Drain Current
0.6
0.5
ID - Drain Current (A)
Ptot - Power (W)
0.8
0.6
0.4
0.2
0.4
0.3
0.2
0.1
o
TA=25 C,VG=10V
o
0.0
TA=25 C
0
20
40
60
0.0
80 100 120 140 160
Tj - Junction Temperature (°C)
Safe Operation Area
60
80 100 120 140 160
Thermal Transient Impedance
300us
1ms
10ms
0.1
100ms
1s
DC
0.01
o
TC= 25 C
0.1
1
10
Normalized Effective Transient
Rd
s(
on
)L
im
it
100us
ID - Drain Current (A)
40
2
1
100 300
VDS - Drain-Source Voltage (V)
Leshan Radio Company, LTD.
20
Tj - Junction Temperature (°C)
5
1E-3
0
Rev.B Jan 2016
1
Duty = 0.5
0.2
0.1
0.05
0.1
0.02
0.01
Single Pulse
0.01
1E-4 1E-3 0.01
2
Mounted on 1in pad
o
RθJA : 150 C/W
0.1
1
10
100
Square Wave Pulse Duration (sec)
3/7
LBSS139DW1T1G, S-LBSS139DW1T1G
Power MOSFET
6.ELRCTRICAL CHARACTERISTICS CURVES(Con.)
Output Characteristics
Drain-Source On Resistance
1.0
2.6
ID - Drain Current (A)
0.8
VGS= 4,5,6,8,10 V
3.0 V
0.6
0.4
0.2
0.0
0.0
0.5
1.0
1.5
2.0
2.5
RDS(ON) - On Resistance (Ω)
2.4
2.2
2.0
1.8
VGS= 4.5V
1.6
VGS= 10 V
1.4
1.2
1.0
0.8
0.6
0.4
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
3.0
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Transfer Characteristics
Gate Threshold Voltage
2.4
1.6
IDS = 250 μA
ID= 0.5 A
Normalized Threshold Voltage
RDS(ON) - On Resistance (Ω)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
1
2
3
4
5
6
7
8
9
10
VGS - Gate-Source Voltage (V)
Leshan Radio Company, LTD.
Rev.B Jan 2016
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
0
25
50
75 100 125 150
Tj - Junction Temperature (°C)
4/7
LBSS139DW1T1G, S-LBSS139DW1T1G
Power MOSFET
6.ELRCTRICAL CHARACTERISTICS CURVES(Con.)
Drain-Source On Resistance
Source-Drain Diode Forward
2
1.6
VGS= 10 V
1.4
1
IS - Source Current (A)
Normalized On Resistance
ID = 0.5 A
1.2
1.0
0.8
o
Tj =25 C
o
RON@Tj= 25 C: 1.2 Ω
75 100 125 150
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Tj - Junction Temperature (°C)
VSD - Source-Drain Voltage (V)
-50 -25
0
25
50
Gate Charge
Capacitance
40
4.5
Frequency = 1 MHz
35
VGS - Gate-Source Voltage (V)
Ciss
25
20
15
Coss
10
5
Crss
0
0
5
10
15
20
25
30
VDS - Drain-Source Voltage (V)
Leshan Radio Company, LTD.
VDS= 10 V
4.0
30
C - Capacitance (pF)
o
Tj= 150 C
Rev.B Jan 2016
IDS= 0.5 A
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
QG - Gate Charge (pC)
5/7
LBSS139DW1T1G, S-LBSS139DW1T1G
Power MOSFET
6.ELRCTRICAL CHARACTERISTICS CURVES(Con.)
Drain-Source On Resistance
Drain-Source On Resistance
1.6
3.0
ID = 0.5 A
VGS= 4.5 V
1.2
VGS= 10 V
1.0
0.8
0.6
o
RON@Tj= 25 C: 1.2 Ω
0.4
-50 -25
0
25
50
RDS(ON) – On Resistance(Ω)
1.4
Normalized On Resistance
VGS= 4.5V
O
TJ= 125 C
2.8
2.6
O
TJ= 85 C
2.4
2.2
2.0
O
TJ= 25 C
1.8
1.6
1.4
O
TJ= -55 C
1.2
1.0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
75 100 125 150
Tj - Junction Temperature (°C)
ID - Drain Current (A)
Drain-Source On Resistance
3.0
1.2
VGS= 10V
2.6
1.0
2.4
2.2
2.0
1.8
1.6
1.4
ID - Drain Current (A)
RDS(ON) – On Resistance(Ω)
2.8
O
TJ= 125 C
O
TJ= 85 C
O
TJ= 25 C
1.2
1.0
O
TJ= -55 C
0.8
0.8
0.6
o
Tj=125 C
0.4
o
Tj=25 C
0.2
o
Tj=-55 C
0.6
0.4
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
ID - Drain Current (A)
Leshan Radio Company, LTD.
0.0
0
1
2
3
4
5
6
VGS – Gate Voltage (V)
Rev.B Jan 2016
6/7
LBSS139DW1T1G, S-LBSS139DW1T1G
Power MOSFET
7.OUTLINE AND DIMENSIONS
Notes:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
INCHES
DIM
A
MIN
NOM
MAX
MIN
NOM
MAX
---
---
1.10
---
---
0.043
A1
0.00
---
0.10
0
---
0.004
A2
0.70
0.90
1.00
0.027 0.035 0.039
b
0.15
0.20
0.25
0.006 0.008
C
0.08
0.15
0.22
0.003 0.006 0.009
D
1.80
2.00
2.20
0.07
E
2.00
2.10
2.20
0.078 0.082 0.086
E1
1.15
1.25
1.35
0.045 0.049 0.053
0.46
0.010 0.014 0.018
e
L
0.65 BSC
0.26
0.36
0.01
0.078 0.086
0.026 BSC
L2
0.15 BSC
0.006 BSC
aaa
0.15
0.01
bbb
0.30
0.01
ccc
0.10
0.00
ddd
0.10
0.00
8.SOLDERING FOOTPRINT
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Rev.B Jan 2016
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