LBTP660Z4TZHG
S-LBTP660Z4TZHG
General Purpose Transistors PNP Silicon
1. FEATURES
●
SOT223
We declare that the material of product compliance with
RoHS requirements and Halogen Free.
●
S-prefix for automotive and other applications requiring
unique site and control change requirements; AEC-Q101
qualified and PPAP capable.
2. DEVICE MARKING AND ORDERING INFORMATION
Device
Marking
Shipping
LBTP660Z4TZHG
A9
1000/Tape&Reel
3. MAXIMUM RATINGS(Ta = 25ºC)
Parameter
Symbol
Limits
Unit
Collector–Emitter Voltage
VCEO
-60
V
Collector–Base Voltage
VCBO
-100
V
Emitter–Base Voltage
VEBO
-6
V
IC
-6
A
Collector Current — Continuous
Peak collector current
Junction and Storage temperature
ICM
-12
A
TJ,Tstg
−55∼+150
ºC
Symbol
Limits
Unit
PD
833
mW
RΘJA
150
ºC/W
4. THERMAL CHARACTERISTICS
Parameter
Total Device Dissipation,
FR−4 Board (Note 1) @ TA = 25ºC
Thermal Resistance,
Junction–to–Ambient(Note 1)
1. FR–4 = 30.0mm×25.0mm×1.6mm.
Leshan Radio Company, LTD.
Rev.B Dec. 2020
1/5
LBTP660Z4TZHG,S-LBTP660Z4TZHG
General Purpose Transistors PNP Silicon
5. ELECTRICAL CHARACTERISTICS (Ta= 25ºC)
Characteristic
Collector–Emitter Breakdown Voltage
(IC=-10mA,IB=0)
Collector–Base Breakdown Voltage
(IC=-100µA,IE=0)
Emitter–Base Breakdown Voltage
(IE=-100µA,IC=0)
Collector-Base cut-off current
(VCB = -100 V, IE = 0)
Emitter-Base cut-off current
(VEB =-6V, IC =0)
Collector-Emitter cutoff Current
(IB=0, VCE = -60V)
Symbol
Min.
Typ.
Max.
Unit
VBR(CEO)
-60
-
-
V
VBR(CBO)
-100
-
-
V
VBR(EBO)
-6
-
-
V
ICBO
-
-
-100
nA
IEBO
-
-
-100
nA
ICEO
-
-
-10
µA
150
-
-
DC Current Gain
(VCE = -2 V,IC = -500mA)
(VCE = -2 V,IC = -1A)
HFE
120
-
360
(VCE = -2 V,IC = -2A)
100
-
-
(VCE = -2 V,IC = -6A)
70
-
-
(IC=-100mA,IB=-2mA)
-
-
-50
(IC=-1A,IB=-100mA)
-
-
-70
-
-
-120
(IC=-3A,IB=-300mA)
-
-
-250
(IC=-6A,IB=-600mA)
-
-
-350
VBE(sat)
-
-
-1
V
fT
100
-
-
MHz
Cibo
-
360
-
pF
Cobo
-
60
-
pF
Collector–Emitter Saturation Voltage
(IC=-2A,IB=-200mA)
Base-Emitter saturation voltage(Note 2)
(IC=-1A, IB=-100mA)
Transition Frequency
(VCE = -10 V, IC = -500 mA,f = 1 MHz)
Input Capacitance
(VEB = -5.0 V, f = 1.0 MHz)
Output Capacitance
(VCB = -10 V, f = 1.0 MHz)
VCE(sat)
mV
2.tp ≤ 300 µs,δ ≤ 0.02;
Leshan Radio Company, LTD.
Rev.B Dec. 2020
2/5
LBTP660Z4TZHG,S-LBTP660Z4TZHG
General Purpose Transistors PNP Silicon
6.ELECTRICAL CHARACTERISTICS CURVES
500
7
VCE=2V
150℃
IB=40mA
6
VCE Collector to Emittor (V)
HFE Dc Gain
400
300
25℃
200
-55℃
IB=30mA
5
4
IB=20mA
IB=15mA
3
IB=10mA
2
100
IB=5mA
1
0
0.002
0
0.02
0.2
2
20
0
1
2
3
4
IC Collector Current (A)
IC Collector Current (A)
IC vs. VCE
HFE vs. IC
1.4
1.0
0.9
IC=1mA
IC=10mA
1.2
0.8
0.6
VCE=2V
IC=100mA
IC=30mA
1.0
IC=50mA
VBE(on) (V)
0.7
VCE(sat) (V)
5
0.5
0.4
0.3
0.8
0.6
0.4
-55℃
25℃
150℃
0.2
0.2
0.1
0.0
0.000001
0.00001
0.0001
0.001
0.01
0.2
20
IC Collector Current (A)
IB, Base Current (A)
VBE(on) vs. IC
VCE(sat) vs. IB
Leshan Radio Company, LTD.
0.0
0.002
Rev.B Dec. 2020
3/5
LBTP660Z4TZHG,S-LBTP660Z4TZHG
General Purpose Transistors PNP Silicon
6.ELECTRICAL CHARACTERISTICS CURVES(Con.)
1.4
1.0
0.9
IC/IB=10
1.2
IC/IB=10
0.8
1.0
VBE(sat) (V)
VCE(sat) (V)
0.7
0.6
0.5
0.4
0.3
150℃
-55℃
0.8
0.6
25℃
0.4
150℃
0.2
0.2
0.1
25℃, -55℃
0.0
0.002
0.02
0.2
2
20
IC,Collector Current (A)
0.0
0.002
0.2
IC Collector Current (A)
20
VBE(sat) vs. IC
VCE(sat) vs. IC
900
Ta=25℃
f=1MHz
800
CT Capacitor (pF)
700
600
500
Cibo
400
300
200
100
Cobo
0
0
10
20
30
40
50
VR Reverse Voltage (V)
CT vs. VR
Leshan Radio Company, LTD.
Rev.B Dec. 2020
4/5
LBTP660Z4TZHG,S-LBTP660Z4TZHG
General Purpose Transistors PNP Silicon
7.OUTLINE AND DIMENSIONS
SOT223
D
b1
C
E
HE
ɵ1
ɵ1
L1
A2
b2
Gauge Plane
Seating Plane
L
L1
0.25
ɵ
e1
e
DIM
A
A1
A2
b1
b2
c
D
E
e
e1
HE
L
L1
θ
θ1
SOT223
MIN
NOR
1.50
1.60
0.00
0.05
0.80
0.90
2.90
3.02
0.60
0.72
0.20
0.27
6.30
6.50
3.30
3.50
4.60BSC
2.30BSC
6.80
7.00
0.80
1.00
1.75(REF)
0º~8º
8º
10º
All Dimensions in mm
MAX
1.70
0.10
1.00
3.10
0.80
0.35
6.70
3.70
7.20
1.20
12º
A
GENERAL NOTES
A1
1. Top package surface finish Ra0.4±0.2um
2. Bottom package surface finish Ra0.7±0.2um
3. Side package surface finish Ra0.4±0.2um
4. Protrusion or Gate Burrs shall not exceed
0.10mm per side.
8.SOLDERING FOOTPRINT
Y1
X1
C2
DIM
X1
Y1
X2
Y2
C1
C2
Y2
X2
SOT223
(mm)
3.80
2.00
1.20
2.00
2.30
6.30
C1
Leshan Radio Company, LTD.
C1
Rev.B Dec. 2020
5/5
DISCLAIMER
●
Before you use our Products, you are requested to carefully read this document and fully understand its
contents. LRC shall not be in any way responsible or liable for failure, malfunction or accident arising
from the use of any LRC’s Products against warning, caution or note contained in this document.
●
All information contained in this document is current as of the issuing date and subject to change without
any prior notice. Before purchasing or using LRC's Products,please confirm the latest information with a
LRC sales representative.
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