LBZT52B5V6T1G

LBZT52B5V6T1G S-LBZT52B5V6T1G SURFACE MOUNT ZENER DIODE 1. FEATURES ● We declare that the material of product compliance with SOD123 RoHS requirements and Halogen Free. ● S- prefix for automotive and other applications requiring unique site and control change requirements; AEC-Q101 qualified and PPAP capable. ● 500mw power dissipation ● Ideal for surface mountted application 2. DEVICE MARKING AND ORDERING INFORMATION Device Marking Shipping LBZT52B5V6T1G C2 3000/Tape&Reel 3. MAXIMUM RATINGS(Ta = 25ºC) Parameter Forward Voltage @ IF=10mA Symbol Limits Unit VF 0.9 V 4. THERMAL CHARACTERISTICS Parameter Total Power Dissipation on Symbol Limits Unit PD 500 mW RΘJA 305 ºC/W FR-5 Board(Note 1) Thermal Resistance, Junction to Ambient Air(Note 1) Junction and Storage temperature TJ,Tstg −55∼+150 ºC 1. Device mounted on ceramic PCB; 7.6mm×9.4mm×0.87mm with pad areas 25mm². 5. ELECTRICAL CHARACTERISTICS (Ta= 25°C) Characteristic Zener Voltage Symbol VZ (IZT=5mA) Operating Resistance (IZT=5mA) Rising Operating Resistance (IZK=0.5mA) Reverse Current (VR=2.5V) Leshan Radio Company, LTD. ZZT ZZK IR Min. Typ. Max. 5.49 - 5.73 - - 60 - - 200 - - 1 Rev.C Jun 2018 Unit V Ω Ω μA 1/3 LBZT52B5V6T1G, S-LBZT52B5V6T1G SURFACE MOUNT ZENER DIODE 6.ELECTRICAL CHARACTERISTICS CURVES 0.02 1 150℃ 0.015 0.1 0.01 IF(A) IZ(A) 85℃ 25℃ 150℃ 85℃ 25℃ -55℃ 0.01 0.005 -55℃ 0 0.001 1 2 3 4 5 6 0.5 0.7 0.9 VZ(V) VF(V) IZ vs. VZ IF vs. VF 1.1 0.10% Temp.Coefficient Characteristics (%/℃) 70 f=1MHz Ta=25℃ 65 60 CT(pF) 55 50 45 40 35 0.08% 0.06% 0.04% 0.02% 0.00% 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 -0.02% -0.04% -0.06% 30 0.0 0.5 1.0 1.5 2.0 2.5 IZ=5mA IZ=5mA -0.08% Zener Voltage :VZ (V) VR(V) Zener Voltage- temp.coefficient characteristics CT vs. VR Leshan Radio Company, LTD. IZ=0.5mA Rev.C Jun 2018 2/3 LBZT52B5V6T1G, S-LBZT52B5V6T1G SURFACE MOUNT ZENER DIODE 7.OUTLINE AND DIMENSIONS Notes: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MILLIMETERS INCHES DIM MIN A 0.94 NOM MAX MIN NOM MAX 1.17 1.35 0.037 0.046 0.053 A1 0.00 0.05 0.10 0.000 0.002 0.004 b 0.51 0.61 0.71 0.020 0.024 0.028 c --- --- 0.15 D 1.40 1.60 1.80 0.055 0.063 0.071 E HE 2.54 2.69 2.84 0.100 0.106 0.112 3.56 3.68 3.86 0.140 0.145 0.152 L 0.25 --- --- 0.010 --- --- θ 0° --- 10° 0° --- 10° --- --- 0.006 8.SOLDERING FOOTPRINT Leshan Radio Company, LTD. Rev.C Jun 2018 3/3