LESHAN RADIO COMPANY, LTD.
LESD9D5.0T5G ESD PROTECTION DIODE
Discription
The LESD9D5.0T5G is designed to protect
voltage sensitive components from ESD.
Excellent clamping capability, low leakage, and
fast response time provide best in class protection
on designs that are exposed to ESD. Because of
its small size, it is suited for use in cellular
phones, MP3 players, digital cameras and many
other portable applications where board space is
at a premium.
LESD9D5.0T5G
S-LESD9D5.0T5G
2
Applications
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1
Cellular phones audio
MP3 players
Digital cameras
Portable applicationss
mobile telephone
SOD-923
Features
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Small Body Outline Dimensions:
0.039″ x 0.024″(1.0 mm x 0.60 mm)
Low Body Height: 0.017″ (0.43 mm) Max
Stand−off Voltage: 3.3 V − 12 V
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body
Model
IEC61000−4−2 Level 4 ESD Protection
These are Pb−Free Devices
We declare that the material of product
compliance with RoHS requirements.
S- Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change
Requirements; AEC-Q101 Qualified and PPAP Capable.
Ordering information
Device
Marking
Shipping
LESD9D5.0T5G
S-LESD9D5.0T5G
G
8000/Tape&Reel
MAXIMUM RATINGS
Rating
Symbol
IEC 61000-4-2 (ESD)
ESD Voltage
discharge
Air
Contact discharge
Per Human Body Model
Value
Unit
±15
±8
kV
kV
16
kV
Total Power Dissipation on FR-5 Board (Note 1)
@ TA=25℃
PD
150
mW
Junction and Storage Temperature Range
TJ,TSTG
-55 to 150
℃
Lead Solder Temperature – Maximum (10
Second Duration)
TL
260
℃
Stresses exceeding Maximum Ratings may damage the device. Maximum Rating are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to
stresses above the Recommended Operating Conditions may affect device reliability.
1. FR-5 = 1.0*0.75*0.62 in.
Rev.A 1/4
LESHAN RADIO COMPANY, LTD.
LESD9D5.0T5G , S-LESD9D5.0T5G
ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted, VF=0.9V Max. @ IF=10Ma for all types)
VRWM
(V)
IR
(μA)
@
VRWM
Max
Max
Min
LES D9D3.3T5G
3.3
2.5
5.0
1.0
LES D9D5.0T5G
5.0
1.0
6.2
LES D9D12T5G
12
1.0
13.5
Device
VBR
IT
IPP
(V)
(mA)
(A)
@ IT
(Note 2)
(Note 3)
VC
(V)
@ Max IPP
(Note 3)
PPK
(W)
(8*20 μs)
C
(pF)
Max
Typ
Typ
9.8
10.4
102
80
1.0
8.7
12.3
107
30
1.0
5.9
23.7
140
30
Max
Other voltage available upon request.
2. VBR is measured with a pulse test current IT at an ambient temperature of 25℃
3. Surge current waveform per Figure 3.
Rev.A 2/4
LESHAN RADIO COMPANY, LTD.
LESD9D5.0T5G , S-LESD9D5.0T5G
TYPICAL CHARACTERISTICS
Figure 1. Typical Breakdown Voltage
versus Temperature
Fig 2. Typical Leakage Current versus
Temperature
13
12
Clamping Voltage - VC (V)
11
10
9
8
7
6
5
Waveform
Parameters:
tr = 8µs
td = 20µs
4
3
2
0
Figure 3.
8*20 μs Pulse Waveform
Figure 5. Positive 8kV contact per IEC
61000-4-2-LESD9D5.0T5G
5
10
Peak Pulse Current - IPP (A)
15
20
Fig 4. Normalized Junction Capacitance
Voltage vs. Reverse Voltage
Fig 6. Negative 8kV contact per IEC
61000-4-2-LESD9D5.0T5G
Rev.A 3/4
LESHAN RADIO COMPANY, LTD.
LESD9D5.0T5G , S-LESD9D5.0T5G
SOD−923
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
−Y−
E
1
b
2
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
A
c
L
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.05
0.10
0.15
MIN
0.013
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.016
0.010
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
Rev.A 4/4
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