LMBR0520ET1G

LMBR0520ET1G thru LMBR0540ET1G Schottky Barrier Rectifiers Reverse Voltage 20 to 40V Forward Current 0.5A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low power loss,high efficiency * For use in low voltage high frequency inverters, free wheeling,and polarity protection applications * Guardring for over voltage protection * High temperature soldering guaranteed: 260°C/10 seconds at terminals Mechanical Data Case: SOD-323HE molded plastic over sky die Terminals: Plated leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0053 g Handling precautin:None We declare that the material of product is Haloggen free (green epoxy compound) 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol device marking code LMBR0520ET1G LMBR0530ET1G LMBR0540ET1G 052 053 054 Unit Maximum repetitive peak reverse voltage VRRM 20 30 40 V Maximum RMS voltage VRMS 14 21 28 V Maximum DC blocking voltage VDC 20 30 40 V Maximum average forward rectified current at TC = 75°C IF(AV) 0.5 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 22 A RθJA 210 RθJL 70 TJ –55 to +125 °C TSTG –55 to +150 °C Typical thermal resistance (Note 1) Operating junction temperature range storage temperature range °C/W Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. symbol LMBR0520ET1G LMBR0530ET1G LMBR0540ET1G Unit Maximum instantaneous forward voltage at (IF = 0.5 A, TJ = 25°C) VF 0.43 0.45 0.55 V Maximum DC reverse current at rated DC blocking voltage TA = 25℃ Tj = 100 ℃ IR 0.25 8 0.130 10 0.03 10 mA Typical junction capacitance at 4.0V, 1MHz CJ Parameter Symbol 160 PF NOTES: 1. 8.0mm2 (.013mm thick) land areas Nov,2016 Rev.C 1/5 LMBR0520ET1G thru LMBR0540ET1G 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or Inductive Load 0.5 Peak forward surge current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 0.25 TJ = TJ max 8.3ms Single Half Sine-wave (JEDEC Method) 22 11 0 0 1 100 25 50 75 100 125 150 175 Case Temperature, °C Fig 3. – Typical Instantaneous Forward Characteristics TJ = 25°C Pulse width = 300µs 1% Duty Cycle 10 1.0 0.1 1000 100 10 Tj=100℃ 1.0 Tj=75℃ 0.1 Tj=25℃ 0.01 0.001 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) 0.4 0.6 0.8 1.0 1.2 Instantaneous Forward Voltage (V) Fig 5. –typical transient thermal impedance Fig 6. – Typical Junction Capacitance 1000 Junction Capacitance (pF) Transient thermal impedance(℃/W) 0.01 0.2 10 Number of Cycles at 60Hz Fig 4. – Typical Reverse Characteristics Instantaneous Reverse Current (mA) Instantaneous Forward Current (A) 0 100 10 1 TJ = 25°C f = 1.0 MHz Vsig = 50mVp-p 100 10 0.01 0.1 1.0 10 t,Pulse duration,sec Nov,2016 100 0.1 1 10 Reverse Voltage (V) 100 Rev.C 2/5 LMBR0520ET1G thru LMBR0540ET1G 3. dimension: SOD323HE MIN MAX Typ. DIM A 2.30 2.70 2.55 B 1.20 1.35 1.25 C 1.75 1.95 1.90 D - - 0.30 E 0.55 0.75 0.67 F 0.10 0.20 0.15 G 0.45 0.65 0.50 I 0.40 0.70 0.50 J 1.15 1.55 1.40 K 0.80 All Dimensions in mm Suggested solder pad layout RECOMMENDED PAD SOD323HE COMPATIBLE PAD SOD323HE DIM (mm) DIM (mm) A 1.1 D 1.0 B 2.0 E 0.8 C 1.9 C 2.4 D 0.8 E 1.0 Nov,2016 Rev.C 3/5 LMBR0520ET1G thru LMBR0540ET1G 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device Pt Critical Zone TL to TP TP Ramp-up TL Temperature Ts max TL Ts min ts preheat Ramp-down 25 time t25℃ to Peak 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP)