LMBR140FT1G

LMBR120FT1G thru LMBR1200FT1G Schottky Barrier Rectifiers Reverse Voltage 20 to 200V Forward Current 1.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low power loss,high efficiency * For use in low voltage high frequency inverters, free wheeling,and polarity protection applications * Guardring for over voltage protection * High temperature soldering guaranteed: 260°C/10 seconds at terminals Mechanical Data Case: SOD123-FL/MINI SMA molded plastic over sky die Terminals: Tin Plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0155 g Handling precautin:None We declare that the material of product is Haloggen free (green epoxy compound) 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol device marking code LMBR 120 FT1G LMBR 130 FT1G LMBR 140 FT1G LMBR 145 FT1G LMBR 150 FT1G LMBR 160 FT1G LMBR 180 FT1G LMBR 1100 FT1G LMBR 1150 FT1G LMBR 1200 FT1G 12 13 14 145 15 16 18 110 115 120 100 150 200 Unit Maximum repetitive peak reverse voltage VRRM 20 30 40 45 50 60 80 Maximum RMS voltage VRMS 14 21 28 31.5 35 42 56 70 105 140 V Maximum DC blocking voltage VDC 20 30 40 45 50 60 80 100 150 200 V Maximum average forward rectified current at TC = 75°C IF(AV) 1.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30 A Typical thermal resistance (Note 1) RθJA RθJC 110 40 °C/W TJ –55 to +150 °C TSTG –65 to +175 °C Operating junction temperature range storage temperature range V Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol LMBR 120 FT1G LMBR 130 FT1G 0.5 0.35 0.45 0.50 LMBR 140 FT1G LMBR 145 FT1G LMBR 150 FT1G LMBR 160 FT1G LMBR 180 FT1G LMBR 1100 FT1G LMBR 1150 FT1G LMBR 1200 FT1G 0.90 0.92 Unit Maximum instantaneous forward voltage at(IF = 0.1 A, TJ = 25°C) (IF = 0.7 A, TJ = 25°C) (IF = 1.0 A, TJ = 25°C) VF Maximum DC reverse current at rated DC blocking voltage TA = 25°C Tj = 125°C IR 0.5 10 mA Typical junction capacitance at 4.0V, 1MHz CJ 160 PF NOTES: 1. 8.0mm2 (.013mm thick) land areas 0.55 0.7 0.85 V LMBR120FT1G thru LMBR1200FT1G 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or Inductive Load 1.0 0.5 Peak forward surge current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 30 15 0 0 100 25 50 75 100 125 150 175 CASE TEMPERATURE:Tc(°C) Fig 3. – Typical Instantaneous Forward Characteristics TJ = 25°C Pulse width = 300µs 1% Duty Cycle 10 1.0 0.1 1 10 Tj=125 1.0 Tj=75 0.1 0.01 0.01 0.2 Tj=25 0.001 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) 0.4 0.6 0.8 1.0 Instantaneous Forward Voltage (V) Fig 5. –typical transient thermal impedance Fig 6. – Typical Junction Capacitance 1000 Junction Capacitance (pF) 100 10 Number of Cycles at 60Hz Fig 4. – Typical Reverse Characteristics Instantaneous Reverse Current (mA) Instantaneous Forward Current (A) 0 Transient thermal impedance(°C/W) TJ = TJ max 8.3ms Single Half Sine- 10 1.0 TJ = 25°C f = 1.0 MHz Vsig = 50 V 100 10 0.1 0.01 0.1 1.0 10 t,Pulse duration,sec 0.1 1 Reverse Voltage (V) 10 100 LMBR120FT1G thru LMBR1200FT1G 3. dimension: SOD123-FL MILLIMETERS MIN MAX 3.5 3.9 0.75 0.95 2.6 3.0 1.6 2.0 0.45Typ 0.9 1.2 0.12 0.22 0.8Typ DIM A B C D E H J K INCHES MIN MAX 0.138 0.159 0.029 0.037 0.103 0.119 0.063 0.079 0.018Typ 0.036 0.047 0.005 0.009 0.032Typ Suggested solder pad layout B C A Dimensions in inches and (millimeters) PACKAGE A B C SOD123-FL 0.044(1.10 0.040(1.00) 0.079(2.00) LMBR120FT1G thru LMBR1200FT1G 4.Packing information Unit：mm Symbol tolerance SOD123-FL Carrier width A 0.1 2.00 Carrier length B 0.1 3.85 Carrier depth C 0.1 1.10 Sprocket hole d 0.1 1.50 13" Reel outside diameter D 2.0 - 13" Reel inner diameter D1 min - 7" Reel outside diameter D 2.0 178.00 7" Reel inner diameter D1 min 62.00 Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 3.50 Punch hole pitch P 0.1 4.00 Spocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.00 Overall tape thickness T 0.1 0.23 Tape width W 0.3 8.00 Reel width W1 1.0 11.40 Item LMBR120FT1G thru LMBR1200FT1G Reel packing PACKAGE REEL SIZE SOD123-FL 7" REEL COMPONENT APPOX. BOX INNER BOX REEL DIA. CARTON SIZE CARTON (PCS) SPACING (mm) (pcs) (mm) (mm) (mm) (PCS) GROSS WEIGHT (kg) 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.7 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP)