SODSF16-SH

SODSF11-SH thru SODSF18-SH Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 600V Forward Current 1.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * Typical IR less than 1.0µA * High temperature soldering guaranteed: 260°C/10 seconds Mechanical Data Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE We declare that the material of product is Terminals: Tin Plated, solderable per Halogen free (green epoxy compound) MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0155 g Handling precautin:None Electrical Characteristic 1.Maximum & Thermal Characteristics Ratings Parameter Symbol symbol Device marking code at 25°C ambient temperature unless otherwise specified. SOD SOD SOD SOD SOD SOD SOD SOD SF11-SH SF12-SH SF13-SH SF14-SH SF15-SH SF16-SH SF17-SH SF18-SH Unit SF11 SF12 SF13 SF14 SF15 SF16 SF17 SF18 Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 500 600 Maximum RMS voltage VRMS 35 70 105 140 210 280 350 420 V Maximum DC blocking voltage VDC 50 100 150 200 300 400 500 600 V V Maximum average forward rectified current lead length at TC = 75°C(Note 2) IF(AV) 1.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30 A trr 35 ns Operating junction temperature range RθJA RθJC TJ 110 40 –55 to +150 storage temperature range TSTG –65 to +175 Typical reverse recovery time (Note 1) Typical thermal resistance (Note 2) °C/W °C °C Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol SOD SOD SOD SOD SOD SOD SOD SOD SF11-SH SF12-SH SF13-SH SF14-SH SF15-SH SF16-SH SF17-SH SF18-SH 0.95 1.25 1.7 Unit Maximum instantaneous forward voltage at 1.0A VF Maximum DC reverse current at rated DC blocking voltage TA = 25℃ Tj = 100℃ IR 5.0 100 µA Typical junction capacitance at 4.0V, 1MHz (Note 2) CJ 15.0 PF NOTES: 1. IF = 0.5A, IR = 1.0A, IRR = 0.25A 2. 8.0mm2 (.013mm thick) land areas V SODSF11-SH thru SODSF18-SH 2. Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or Inductive Load 1.0 0.5 0.375" (9.5mm) Lead Length 0 10 25 50 75 100 125 150 175 15 0 1 Fig 4. – Typical Reverse Characteristics SODSF15~SODSF16 1.0 SODSF17~SODSF18 0.1 TJ = 25°C Pulse width = 300µs 1% Duty Cycle 0.9 1.1 1.3 1.5 Instantaneous Forward Voltage (V) 1.7 10 Tj=75℃ 0.1 Tj=25℃ 0.01 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance 100 100 Junction Capacitance (pF) Transient thermal impedance(°C/W) Tj=125℃ 1.0 Fig 5. –typical transient thermal impedance 10 1.0 0.1 0.01 100 100 SODSF11~SODSF14 0.001 0.7 10 Number of Cycles at 60Hz Fig 3. – Typical Instantaneous Forward Characteristics 0.01 TJ = TJ max 8.3ms Single Half Sine-wave (JEDEC Method) 30 CASE TEMPERATURE:Tc(°C) Instantaneous Reverse Current (µA) Instantaneous Forward Current (A) 0 Average Forward Rectified Current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 0.1 1.0 t,Pulse duration,sec 10 100 10 1.0 0.1 TJ = 25°C f = 1.0 MHz Vsig = 50mVp-p 1 10 Reverse Voltage (V) 100 SODSF11-SH thru SODSF18-SH 3. dimension: E B SOD123-FL A D J C DIM A B C D E H J K H K K MILLIMETERS MIN MAX 3.5 3.9 0.75 0.95 2.6 3.0 1.6 2.0 0.45Typ 0.9 1.2 0.12 0.22 0.8Typ INCHES MIN MAX 0.138 0.159 0.029 0.037 0.103 0.119 0.063 0.079 0.018Typ 0.036 0.047 0.005 0.009 0.032Typ Suggested solder pad layout B C A Dimensions in inches and (millimeters) PACKAGE A B C SOD123-FL 0.044(1.10 0.040(1.00) 0.079(2.00) Title : DOC NO.： Power Diode SMD Package Pa cking Spec Version: 5 WI-258 Modification: 0 Page: 2 5.1 、SMD Packing Reel Spec & Packing Quantity 5.1.1 Reel Packing A. Reel Spec unit：mm SPEC SMA 7" reel SMA13" reel SMA-FL13" reel TO277 13" reel SOD123FL 7" reel SOD323HE 7" reel SMB-FL 13" reel A 177.0±2.0 330.0±2.0 330.0±2.0 330.0±2.0 177.0±2.0 177.0±2.0 330.0±2.0 B 54.0±0.5 75.0±0.5 75.0±0.5 75.0±0.5 50.0±0.5 50.0±0.5 75.0±0.5 C 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 W 13.2±0.2 13.2±0.2 13.2±0.2 13.2±0.2 9.4±1.5 9.4±1.5 13.2±0.2 Quantity/Reel 2K 5K 5K 5K 3K 3K 5K B. 13" reel packing box unit：mm A 335±5.0 size B 335±2.0 as per above packing Spec SMA13" reel TO277 13" reel SMB-FL 13" reel Q'ty/Box 10K 10K 10K C 40±1.0 Title : Power Diode SMD Package Packing Spec DOC NO.： WI-258 DOC NO.： WI-258 Page: 3 C. 7" reel packing box unit：mm B 188±2.0 C 138±2.0 186±2.0 139±2.0 as per above packing Q'ty/Box 16K SMA/SMA-FL SOD123FL 30K SOD323HE 30K 185±2.0 SMA/SMA-FL A 188±2.0 SOD123FL SOD323HE D. reel packing carton unit：mm A 350±2.0 size B 340±2.0 C 350±2.0 as per above packing Spec SMA/SMA-FL 7" reel SMA13"reel SMA-FL13"reel TO277 13" reel SMB-FL 13" reel Q'ty/Carton 80K 80K 80K 80K 80K unit：mm SOD123FL SOD323HE A B C 455±2.0 400±2.0 410±2.0 as per above packing Spec SOD123-FL 7" reel SOD323HE 7" reel 5.1.2 Tape Spec A. Cover Tape unit：mm A SMA /SMA-FL SMB-FL /TO277 B 9.5±0.10 SOD123FL 5.4±0.10 SOD323HE 0.062±0.007 Q'ty/Carton 360K 360K Title : DOC NO.： Power Diode SMD Package Packing Spec Version: 5 WI-258 Modification: 0 Page: 4 B. Carrier Tape Do P2 Po t P1 A D1 A' Bo W F E B' B SEC.:B-B' Cathode(tape hole side） Ko Ao SEC.:A-A' Item W P1 E F D0 D1 P0 P2 10P0 A0 B0 K0 SOD323HE 8±0.3 4±0.1 1.75±0.1 3.5±.05 1.55±0.05 1.1±0.1 4±0.1 2±0.05 40±0.2 1.45±0.1 2.75±0.1 0.80±0.1 SOD123FL 8±0.3 4±0.1 1.75±0.1 3.5±.05 1.55±0.05 1.1±0.1 4±0.1 2±0.05 40±0.2 1.95±0.1 3.95±0.1 1.30±0.1 SMA 12±0.3 4±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 2.79±0.1 5.33±0.1 2.36±0.1 T 0.25±0.05 0.25±0.05 0.25±0.05 SMA-FL 12±0.3 4±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 2.83±0.1 4.75±0.1 1.42±0.1 SMB-FL TO277 12±0.3 12±0.3 8±0.1 8±0.1 1.75±0.1 1.75±0.1 5.5±0.05 5.5±.05 1.55±0.05 1.55±0.05 1.55±0.05 1.5±0.1 4±0.1 4±0.1 2±0.05 2±0.05 40±0.2 40±0.2 4.3±0.1 3.8±0.1 5.75±0.1 6.8±0.1 1.35±0.1 1.4±0.1 0.25±0.05 0.25±0.05 0.25±0.05 Title : DOC NO.： Power Diode SMD Package Packing Spec Version: 5 WI-258 Modification: 0 Page: 5 5.2、SMD Power Diode General Packing Spec A. 7" reel all labels will be at cathode side of reel ； Ｂ C A C side front A:LRC label; B:Environment Label C:Halide free label B. 13" reel A Ｂ C Ｂ C A A:LRC label; B:Environment Labe C:Halide free label C.Tape lead: face anode side of the reel,upper side is the tape lead position. All labels are at cathode side of the reel. 标题: DOC NO.： Power Diode SMD Package Packing Spec Version: 5 Modification: 0 Page: C. Label Content ： LRC Label WI-258 6 Two-dimension code Manufacturing it P/N ` Lot No. Date code Maker Quantity lot: 140106049X: 140106---2014/1/6；049----lot number:49；X：product code Environment Label Halide-free Label Green SODSF11-SH thru SODSF18-SH Reel packing PACKAGE REEL SIZE REEL (PCS) COMPONENT SPACING (mm) BOX (pcs) INNER BOX (mm) REEL DIA. (mm) CARTON SIZE (mm) CARTON (PCS) APPOX. GROSS W EIGHT (kg) SOD123-FL 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.7 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP)