LBW1000

LBW1000 - CONTENTS - 1. Features 2. Outline dimensions 3. Package material 4. Absolute Maximum Ratings 5. Electrical Optical Characteristics 6. Ranks 7. Taping 8. Packing Structure 9. Characteristic Diagrams 10. Precautions to taken 11. Reliability 12. Precautions in use 13. Revision history sheet Different and Better 1/14 LBW1000 1. Features • Package : SMD package1000 • 1.6×0.8×0.4 mm(L×W×H) small size surface mount type • Color Coordinates : x = 0.22, y = 0.18 acc. to CIE 1931, at If=3mA • Viewing angle : extremely wide(160˚) • Technology : InGaN • Soldering methods : IR reflow soldering • Taping : 8 mm conductive black carrier tape & antistatic clear cover tape. 5000pcs/reel, Φ180 mm wheel 2. Outline dimensions (unit : mm) Different and Better 2/14 LBW1000 3. Package material (1) Material construction Number 1 2 3 4 5 Item PCB Die adhesive LED chip wire Mold epoxy Material C3965 Epoxy InGaN Gold Wire Epoxy Resin Different and Better 3/14 LBW1000 4. Absolute Maximum Ratings Parameter Power dissipation Forward Current *1Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature *2Soldering Temperature Symbol PD IF IFP VR Topr Tstg Tsol Value 70 20 100 5 -30∼+85 -40∼+100 240℃ for 5 seconds (Ta = 25℃) Unit mW mA mA V ℃ ℃ *1.Duty ratio ≦ 1/10, Pulse Width ≦ 10msec. *2.Mounted on PC board FR4(pad size ≥ 16 ㎟) 5. Electrical Optical Characteristics Characteristic ESD Check Forward Voltage Reverse Current *6Half Angle Symbol VF2 IR θ1/2 Test Condition IF= 10uA VR=5V IF= 20mA Min. 2.0 Typ. ±80 3.0 10 - (Ta = 25℃) Max. Unit V uA deg *6. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity Different and Better 4/14 LBW1000 6. Ranks (1) Chromaticity Coordinates ranks (○) Color RANK Test Condition x 0.175 0.175 A 0.200 0.200 IF= 3mA 0.200 0.200 B 0.225 0.225 0.180 0.120 0.120 0.180 0.160 0.100 Y 0.100 0.150 (Ta=25℃) * The CIE(1931) standard colorimetric system * Chromaticity coordinates Measured : 0.01sr(CIE. LED_B) * Measurement Uncertainty of the Color Coordinates : ±0.02 Different and Better 5/14 LBW1000 (2) Luminous intensity ranks Iv RANK B C D IF= 3mA Test Condition Min. 12 18 28 Typ. Max. 18 28 40 mcd (Ta=25℃) Unit * Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±11%. * Intensity Measured : 0.01sr(CIE. LED_B) (3) Forward Voltage VF RANK 0 1 2 3 4 IF= 3mA Test Condition Min. 2.60 2.70 2.80 2.90 3.00 Typ. Max. 2.70 2.80 2.90 3.00 3.10 (Ta=25℃) Unit V * Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V. Different and Better 6/14 LBW1000 7. Taping (1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω) (Unit : mm) (2) Dimension of tape(Material : PS Conductive, 10E4~5Ω) (Unit : mm) Different and Better 7/14 LBW1000 (3) Details of CHIP LEDs loading on tape (End) more than 40mm unloaded tape mounted with LED more than 40mm unloaded tape 150 ~ 380mm leading part (Start) (4) Loading quantity per reel : 5,000pcs 8. Packing Structure Different and Better 8/14 LBW1000 9. Characteristic Diagrams Fig. 1 IF-VF Ta=25℃ 80 Fig. 2 IV-IF Ta=25℃ 1.5 60 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Relative Luminous Intensity 70 Forward Current IF[mA] 1.0 0.5 0 5 10 15 20 25 30 Forward Voltage VF[V] Forward Current IF[mA] Fig. 3 IF-Ta Ta=25℃ Fig. 4 Spectrum Distribution Ta=25℃ Forward Current IF[mA] Ambient Temperature Ta[℃] Relative Intensity[%] Wavelength λ [nm] Different and Better 9/14 LBW1000 Fig. 5 Relative Spectral Emission V(λ) = Standard eye response curve Ta=25℃ , IF = 3mA Fig.6 Radiation Characteristic Ta=25℃ , IF = 20mA 1.0 0.8 Relative Intensity(%) 0.6 0.4 0.2 0 20 40 60 80 100 120 Angular Displacement(˚) Different and Better 10/14 LBW1000 10. Precautions to taken (1) Reflow soldering (2) For manual solder Not more than 5sec @max300℃, under soldering iron (3) Recommendable soldering pattern(For reflow soldering) Different and Better 11/14 LBW1000 11. Reliability (1) The Reliability criteria of SMD LED Limit ITEM Forward Voltage Reverse Current Luminous intensity * I.V : Initial Value Symbol VF IR Iv Test Condition Min. IF = 20mA VR = 5V IF = 20mA I.V × 0.8 I.V × 0.7 LSL : Lower Spec Limit Max. I.V × 1.2 USL I.V × 1.3 USL : Upper Spec Limit (2) Results of reliability Test NO Item Test Conditions Test Hours /Cycle 100 cycle 500HR’s 500HR’s 500HR’s 500HR’s Sample Size Ac/Re 1 Temperature Cycle H : +100℃ 30min ∫ 5min L : -30℃ 30min TEMP : 80℃ TEMP : -30℃ IF : 20mA 85℃/85% RH 45 pcs 0/1 2 3 4 5 High Temperature Storage Low Temperature Storage DC Operating Life High Temperature/ High Humidity 45 pcs 45 pcs 45 pcs 45 pcs 0/1 0/1 0/1 0/1 Different and Better 12/14 LBW1000 12. Precautions in use (1) Soldering Conditions 1) When soldering, leave minimum clearance between the resin and the soldering point. 2) Maximum allowable soldering conditions Soldering dipping : 260 degrees C max., 5 seconds max., 1 time. Soldering iron : 350 degrees C max., 5 seconds max., 1 time, power 40w max. 3) Contact between molten solder and the resin must be avoided. 4) Correction the soldered position after soldering must be avoided. 5) In soldering, do not apply any stress to the lead frame, particularly when heated. 6) When other SMD parts on the same circuit board and adhesive is to be cured, maximum allowable conditions are : 120 degrees C max., 60 seconds max. (2) Lead forming and cut 1) 2) 3) 4) Lead forming must be done below the tie bar cutting portion. When forming a lead, do not stress the resin case. Lead forming must be done before soldering. Cutting the lead frame at high temperature may result in personal injury. Cut the lead frame at room temperature. (3) Assembly 1) Do not apply any stress to the lead frame while assembling. 2) When mounting products onto PCBs, the pitch between the mounting holes must match the pitch of the LEDs. (4) Static Electricity 1) These products are sensitive, a high standard of care must be used. Particularly if an overcurrent and over-voltage which exceeds the Absolute Maximum Rating of Products is applied, the overflow in energy may cause damage to, or possibly result in destruction of, the Products. Customer shall take absolutely secure countermeasures against static electricity and surge when handling Products. 2) A protection device should be installed in the LED driving circuit, which dose not exceed the max. rating for surge current during on/off switching. 3) Proper grounding of Products, use of conductive mat, semiconductive working uniform and shoes, and semiconductive containers are considered to be effective as countermeasures against static electricity and surge. 4) A soldering iron with a grounded tip is recommended. An ionizer should also be installed where risk of static generation is high. (5) Safety Precautions 1) Users must comply with the laws and public regulations concerning safety. The light output of the products may cause injuries to human eyes in circumstances where the products are viewed directly with unshielded eyes for more than a few seconds. Different and Better 13/14 LBW1000 13. Revision history sheet Spec NO. Title Times 1 2 3 4 Date 2002. 2003. 2003. 2004. 02. 02. 11. 04. 08 26 17 22 Specification for Approval Summary of revision 신규 제정 자재 변경 특성 변경 VF, Iv 변경 Remarks Different and Better 14/14