LWH1025

LWH1025 - CONTENTS - 1. Features 2. Outline dimensions 3. Package material 4. Absolute Maximum Ratings 5. Electrical Optical Characteristics 6. Ranks 7. Taping 8. Packing Struction 9. Characteristic Diagrams 10. Precautions to taken 11. Reliability 12. Precautions in use 13. Revision history sheet Different and Better 1/14 LWH1025 1. Features • Package : SMD Side View Type • Yellow colored diffusion • 2.8 × 1.2 × 0.8 mm(L×W×H) small size surface mount type • Color Coordinates : x = 0.31, y = 0.32 acc. to CIE 1931, at If=20mA • Viewing angle : extremely wide(110˚) • Technology : InGaN • ESD Class(Mil Std-883d Methode 3015.7) based on Human Body Model(HBM) : 950V • Soldering methods : IR reflow soldering • Taping : 8 mm conductive black carrier tape & antistatic clear cover tape. 3,500pcs/reel, Φ180 mm wheel 2. Outline dimensions (unit : mm) General Tolerance : ±0.1 Different and Better 2/14 LWH1025 3. Package material (1) Material construction Number 1 2 3 4 5 Item LED Chip Au wire Lead Frame Encapsulation Heat-Resistant Polymer Material InGaN/Sapphire 1.0mil Gold Wire Copper Alloy/Ni/Ag plating Encapsulate + YAG phosphor PPA Different and Better 3/14 LWH1025 4. Absolute Maximum Ratings Parameter Power dissipation Forward Current *1Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature Symbol PD IF IFP VR Topr Tstg Tsol Value 120 30 100 5 -30∼+85 -40∼+100 260℃ for 10 seconds (TA = 25℃) Unit mW mA mA V ℃ ℃ *1.Duty ratio = 1/16, Pulse width = 0.1ms 5. Electrical - Optical Characteristics Characteristic ESD Check Forward Voltage Reverse Current *6Half Angle Symbol VF2 IR θ1/2 Test Condition IF= 10uA VR=5V IF= 20mA Min. 2.0 Typ. ±55 10 - (TA = 25℃) Max. Unit V uA deg *6. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity Different and Better 4/14 LWH1025 6. Ranks (1) Chromaticity Coordinates ranks Rank A x y 0.27 0.24 0.27 0.28 0.29 0.27 0.29 0.31 x y 0.29 0.27 (If=20mA, Ta=25℃) Rank B 0.29 0.31 0.31 0.30 0.31 0.34 Rank C x y 0.31 0.30 0.31 0.34 0.33 0.33 0.33 0.37 * The CIE(1931) standard colorimetric system * Chromaticity coordinates Measured : 0.01sr(CIE. LED_B) * Measurement Uncertainty of the Color Coordinates : ±0.01 Different and Better 5/14 LWH1025 (2) Luminous intensity ranks Iv RANK R S T R S T IF= 20mA IF= 15mA Test Condition Min. 291 405 583 360 500 720 Typ. Max. 405 583 810 (Ta=25℃) Unit mcd 500 720 1000 * Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±11%. * Luminous Intensity Measured : 0.01sr(CIE. LED_B) (3) Forward Voltage Test Condition IF= 15mA IF= 20mA Min. Typ. 3.26 3.4 Max. 3.45 V 3.6 (Ta=25℃) Unit * Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V. Different and Better 6/14 LWH1025 7. Taping (1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω) (Unit : mm) (2) Dimension of tape(Material : PS Conductive, 10E4~5Ω) (Unit : mm) Different and Better 7/14 LWH1025 (3) Details of CHIPLEDs loading on tape (End) more than 40mm unloaded tape mounted with LED (3,500ea) more than 40mm unloaded tape 150 ~ 380mm leading part (Start) (4) Loading quantity per reel : 3,500pcs 8. Packing Struction Different and Better 8/14 LWH1025 9. Characteristic Diagrams (1) Relative Luminous Intensity vs Forward Current (IF-Iv) Encapsulat 2.5 (2) Max. Permissible Forward Current 35 30 2 Relative Luminosity 1.5 Allowable If(mA) 25 20 15 10 5 ` 1 0.5 0 0 20 40 60 80 0 0 20 40 60 80 100 Forward Current(mA) Ambient Temp Ta(℃) (3) Forward Current vs Forward Voltage(If-Vf) (4) Ambient Temperature vs Relative Luminosity 100 10 Forward Current If(mA) Relative Luminosity 10 1 1 2.5 3 3.5 4 4.5 0.1 -40 -20 0 20 40 60 80 100 Forward Voltage(V) Ambient Temp(℃) Different and Better 9/14 LWH1025 (4) Relative Spectral Emission V(λ) = Standard eye response curve TA=25℃ , IF = 20mA (5) Radiation Characteristic TA=25℃ , IF = 20mA Different and Better 10/14 LWH1025 10. Precautions to taken (1) Reflow soldering (2) For manual solder Not more than 3sec @max350℃, under soldering iron (3) Recommendable soldering pattern(For reflow soldering) Different and Better 11/14 LWH1025 11. Reliability (1) The Reliability criteria of SMD LED Limit ITEM Forward Voltage Reverse Voltage Luminous intensity * I : Initial Value Symbol VF VR Iv Test Condition Min. IF = 20mA IR = 10㎂ IF = 20mA I.V × 0.8 LSL I.V × 0.7 Max. I.V × 1.2 I.V × 1.3 U : Upper Spec Limit L : Lower Spec Limit (2) Results of reliability Test NO Item Test Conditions Test Hours /Cycle 100 Cycle Sample Size Ac/Re 1 Temperature Cycle H : +100℃ 30min 25℃ 5min L : -40℃ 30min TEMP : 85℃ (IF=5mA) TEMP : -30℃ (IF=20mA) TEMP : 24℃ (IF=30mA) 60℃/90% RH, (IF=15mA) 260℃, 10sec. 21 pcs 0/1 2 High Temperature Operating Life Low Temperature Operating Life DC Operating Life High Humidity Heat Operating Life Solder Heat Test 1000HR’s 21 pcs 0/1 3 1000HR’s 21 pcs 0/1 4 500HR’s 21 pcs 0/1 5 500HR’s 21 pcs 0/1 6 2 Time 21 pcs 0/1 Different and Better 12/14 LWH1025 12. Precautions in use (1) Soldering Conditions 1) When soldering, leave minimum clearance between the resin and the soldering point. 2) Maximum allowable soldering conditions Soldering dipping : 260 degrees C max., 10 seconds max., 2 time. Soldering iron : 350 degrees C max., 3 seconds max., 1 time, power 40w max. 3) Contact between molten solder and the resin must be avoided. 4) Correction the soldered position after soldering must be avoided. 5) In soldering, do not apply any stress to the lead frame, particularly when heated. 6) When other SMD parts on the same circuit board and adhesive is to be cured, maximum allowable conditions are : 120 degrees C max., 60 seconds max. (2) Lead forming and cut 1) 2) 3) 4) Lead forming must be done below the tie bar cutting portion. When forming a lead, do not stress the resin case. Lead forming must be done before soldering. Cutting the lead frame at high temperature may result in personal injury. Cut the lead frame at room temperature. (3) Assembly 1) Do not apply any stress to the lead frame while assembling. 2) When mounting products onto PCBs, the pitch between the mounting holes must match the pitch of the LEDs. (4) Static Electricity 1) These products are sensitive, a high standard of care must be used. Particularly if an overcurrent and over-voltage which exceeds the Absolute Maximum Rating of Products is applied, the overflow in energy may cause damage to, or possibly result in destruction of, the Products. Customer shall take absolutely secure countermeasures against static electricity and surge when handling Products. 2) A protection device should be installed in the LED driving circuit, which dose not exceed the max. rating for surge current during on/off switching. 3) Proper grounding of Products, use of conductive mat, semiconductive working uniform and shoes, and semiconductive containers are considered to be effective as countermeasures against static electricity and surge. 4) A soldering iron with a grounded tip is recommended. An ionizer should also be installed where risk of static generation is high. (5) Safety Precautions 1) Users must comply with the laws and public regulations concerning safety. The light output of the products may cause injuries to human eyes in circumstances where the products are viewed directly with unshielded eyes for more than a few seconds. Different and Better 13/14 LWH1025 13. Revision history sheet Spec NO. Title Times 1 2 3 Date 2002. 12. 23 2003. 01. 10 2003. 03. 04 Specification for Approval Summary of revision 신규제정 Iv Rank 변경 색좌표 변경 및 IF=15mA 측정조건 추가 Remarks Different and Better 14/14