LWM1054

Specification for Approval ( Version 1.0 ) Part No. : LWM1054 comments LUXPIA Co., Ltd. Designed by Checked by Approved by Approved by Approved by Approved by / / / / / / D at e : . . . D at e : . . . 948-1, Dunsan-Li Bongdong-Eup, Wanju-Gun, JeonBuk, Korea Tel 82-63-260-4500 Fax 82-63-261-8255 LUXPIA CO.,LTD. 1. Features CONTENTS - 2. Package Outline Dimensions and Materials 3. Absolute Maximum Ratings 4. Electro-Optical Characteristics 5. CIE Chromaticity Diagram 6. Materials 7. Taping 8. Packing 9. Reliability 10. Cautions 11. Warranty 12. Others 13. Characteristic Diagrams 1/14 1. Features • • • • Package : SMD Top View type (1 Chip in 1 PKG ) 5.0 × 5.0 × 1.5 mm (L×W×H) size surface mount type Viewing angle : extremely wide(120˚) Soldering methods : IR reflow soldering 2. Package Outline Dimensions and Recommended Solder Patterns 2/14 3. Absolute Maximum Ratings (Ta=25°C) item forward current pulse forward current reverse current 2) 1) symbol IF IFP IRDC PD Topr Tstg Tsol value 180 350 85 720 -30 to+85 -40 to +100 unit mA mA mA mW ℃ ℃ power dissipation operating temperature storage temperature reflow soldering temperature 1) 2) 240℃ for max 10sec IFP conditions : pulse width ≤ 10msec & duty ratio ≤ 1/10 IRDC rating : rating for zener diode 4. Electro-Optical Characteristics (Ta=25°c) item rank 1 2 3 4 5 1L12 1L15 1L20 1L25 1L30 1L35 - symbol condition min 3.0 3.2 3.4 3.6 3.8 12 15 20 25 30 35 - typ max 3.2 3.4 3.6 3.8 4.0 15 20 25 30 35 40 2.0 unit forward voltage 3) VF IF= 150mA V luminous flux 4) ΦV IF= 150mA - lm reverse voltage 3) 4) VR IR= 10mA V Forward voltages are tested at a current pulse duration of 10 ms and an accuracy within ±3%. The allowance of luminous flux measurement is within ±10%. 3/14 5. CIE Chromaticity Diagram 5) (IF=150mA, Ta=25℃) 0.41 0.39 0.37 0.35 C6 0.33 C4 C5 Y 0.31 C3 0.29 0.27 0.25 0.25 0.27 0.29 0.31 X 0.33 0.35 0.37 0.39 C3 x 0.301 0.293 0.305 0.311 5) C4 y 0.282 0.305 0.322 0.295 C5 y 0.295 0.322 0.337 0.306 C6 y 0.306 0.337 0.357 0.322 x 0.311 0.305 0.316 0.319 x 0.319 0.316 0.330 0.330 x 0.330 0.330 0.343 0.343 y 0.322 0.357 0.375 0.340 The allowance of color coordinates measurement is within ±0.01. (CIE1931 standard colorimetric system) 4/14 6. Materials item LED chip wire lead frame encapsulation heat-resistant polymer material InGaN gold copper alloy/Ni/Ag plating silicone + phosphor PPA 7. Tape 7.1. taping (material : PS conductive, 104~105Ω) (units : mm) 5/14 7.2. wheel (color : black, material : PS conductive, 109~1012Ω) (units : mm) - quantity per reel 7.3. label LWM1054 : 3,500pcs part no. LWM1054 C2-1L20-2 3,500ea size (L X W) : 85mm × 50mm color rank Φv rank VF rank 6/14 8. Packing • The LEDs are packed in cardboard boxes after taping. The label shows part number, lot number, rank, and quantity. • In order to protect the LEDs from mechanical shock, they are packed with cardboard boxes for transportation. • The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so cautions must be taken to prevent any possible damage. • The boxes are not water-resistant and, therefore, must be kept away from water and moisture. • When the LEDs are transported, it is recommended that the same packing method as Luxpia's is used. • If noticeable damage on a box appears upon arrival at the user’s warehouse, the user should submit a claim to Luxpia within one week after arrival of the products. 7/14 9. Reliability 9.1. test items and results NO Test Item Resistance to 1. Soldering Heat (Reflow Soldering) 2 Solderability (Reflow Soldering) Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 Test Conditions Tsld=260°c, 10sec. (Pre treatment 30°c,70%,12hrs) Tsld=215±5°c, 3sec (Lead Solder) -40℃~25℃~100℃ 3 Temperature Cycle JEITA ED-4701 100 105 ~25℃ 30min. 5min. 30min. 5min 4 High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State 7 Operating Life Condition 1 Steady State 8 Operating Life of High Temperature Steady State 9 Operating Life of High Humidity Heat Steady State 10 Operating Life of Low Temperature * Thermal resistance of LED with Luxpia standard circuit board : Rja ≒ 120℃/W Ta=-30℃, IF=150mA 1000 hrs 0/22 60℃, RH=90%, IF=100mA 500 hrs 0/22 Ta=85℃, IF=65mA 1000 hrs 0/22 Ta=25℃, IF=150mA 1000 hrs 0/22 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Ta=100℃ 1000 hrs 0/22 100 cycles 0/22 1 time over 95% 0/22 1 time 0/22 Note Number of Damaged 5 Ta=60℃, RH=90% 1000 hrs 0/22 6 Ta=-40℃ 1000 hrs 0/22 8/14 9.2. criteria for judging the damage item forward voltage luminous intensity 6) 7) symbol VF IV test condition IF = 150mA IF = 150mA criteria for judgement min - max U.S.L.6) × 1.2 - L.S.L.7) × 0.7 U.S.L. : upper standard level L.S.L. : lower standard level 10. Cautions White LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of White LEDs is subject to change a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture-Proof Package • When moisture is absorbed into the SMT package it may vaporize and expand products during soldering. There is a possibility that this may cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture-proof package is used to keep moisture to a minimum in the package. • A package of a moisture-absorbent material (silica gel) is inserted into the shielding bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage • Storage Conditions - Before opening the package : The LEDs should be kept at 30℃ or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture-proof packaging with moisture-absorbent material (silica gel) is recommended. - After opening the package : The LEDs should be kept at 30℃ or less and 70%RH or less. The LEDs should be soldered within 72 hours (3 days) after opening the package. If unused LEDs remain, they should be stored in moisture-proof packages, such as sealed containers with packages of moisture-absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture-proof bag and to reseal the moisture-proof bag again. • If the moisture-absorbent material (silica gel) has faded away or the LEDs have exceeded the rocommended storage time, baking treatment should be performed using the following conditions. - Baking treatment : more than 24 hours at 65±5℃ • Luxpia's LED electrode sections are comprised of a silver-plated copper alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid condition which may cause diff iculty during soldering operations. It is recommended that the User use the LEDs as soon as possible. • Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. 9/14 (3) Heat Generation • Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when the system is designed. The coeff icient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in the specif ication. • The operating current should be decided after considering the ambient maximum temperature of LEDs. (4) Soldering Conditions • The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any guarantee on the LEDs after they have been assembled using the dip soldering method. • The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any guarantee on the LEDs after they have been assembled using the dip soldering method. • Recommended soldering conditions Reflow Soldering Lead Solder pre-heat pre-heat time peak temperature soldering time condition 120~150℃ 120sec max 240℃ max 10sec max refer to prof ile ① Lead-free Solder 180~200℃ 120sec max 260℃ max 5sec max refer to prof ile ② temperature soldering time 350℃ max 3sec max (one time only) Hand Soldering * After reflow soldering, rapid cooling should be avoided. [temperature-prof ile (surface of circuit board)] Use the conditions shown to the following f igures. 3~ 5 ℃ / se c 2~ 3 ℃ / se c T e m p [ ℃ ] Time [ s e c] 1 20se c Max 60se c Max Pre -he at ing 120 ~ 1 50℃ 24 0℃ Max 10 se c Max 2~ 5 ℃ / se c T e m p [ ℃ Pre -he at ing 200~ 220℃ 1~ 5℃ / s e c 45s e c Max 260℃ Max 5s e c Max 120 se c Max Room T e mp Room T e mp 10/14 ] T ime [ s e c] • Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. • Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a doublehead soldering iron should be used. It should be conf irmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. • Reflow soldering should not be done more than two times. • When soldering, do not put stress on the LEDs during heating. • After soldering, do not warp the circuit board. (5) Cleaning • It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be conf irmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to conf irm whether any damage to the LEDs will occur. (6) Static Electricity • Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an antielectrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be properly grounded. It is recommended that measurements be taken against surge voltage to the equipment that mounts the LEDs. • When inspecting the f inal products in which LEDs were assembled,it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to f ind static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). • Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. 1.8V at IF=0.5㎂ - criteria : VF > (7) Others • Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. • The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. • Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. 11. Warranty (1) Luxpia warrants that its LEDs conform to the foregoing specif ications and that Luxpia will convey good title to all LEDs sold. (2) LUXPIA disclaims all other warranties including the implied warranties of merchantability and f itness for a particular purpose. (3) In the event any LED supplied by Luxpia is found not to conform to the foregoing specif ications within ninety days of receipt, Luxpia will repair or replace the LED, at Luxpia’s discretion, provided that the User (a) promptly notif ies Luxpia in writing of the details of the defect (b) ships the LEDs at the User’s expense to Luxpia for examination, and (c) the defect is due to the negligence of Luxpia and not mishandling or misuse by the User. (4) Luxpia will not take responsibility for any trouble that is caused by using the LEDs at conditions exceeding our specif ications. (5) These specif ications are applied only when a LED stands alone and it is strongly recommended that the User of the LEDs conf irms the properties upon assembly. Luxpia is not responsible for failures caused during and after assembling. It will be excepted from the rule if the failure would caused undoubtedly by Luxpia. (6) A claim report stating details about the defect shall be made when returning defective LEDs. Luxpia will investigate the report immediately and inform the user of the results. 11/14 (7) The LEDs described in the specif ication are intended to be used for ordinary electronic equipment (such as off ice equipment, communications equipment, on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traff ic control equipment, life support systems and safety devices) (8) LUXPIA’s liability for defective lamps shall be limited to replacement and in no event shall LUXPIA be liable for consequential damage or lost prof its. 12. Others (1) The warranties of quality set forth herein are exclusive. All previous negotiations and agreements not specif ically incorporated herein are superseded and rendered null and void. (2) Both parties shall sincerely try to f ind a solution when any disagreement occurs regarding these specif ications. (3) User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Luxpia. When defective LEDs are found, the User shall inform Luxpia directly before disassembling or analysis. (4) These specif ications can be revised upon mutual agreement. (5) Luxpia understands that the User accepts the content of these specif ications, if the User does not return these specif ications with signatures within 3 weeks after receipt. 13. Characteristic Diagrams8) (1) forward voltage vs. forward current (Ta=25℃) (2) forward current vs.luminous flux (Ta=25℃) forward voltage VF[V] relative luminous flux [a.u.] forward current IF [mA] forward current IF[mA] 12/14 (3) ambient temperature vs. allowable forward current allowable forward current IAF[mA] (4) ambient temperature vs. luminous flux ambient temperature Ta[℃] relative luminous flux [a.u.] ambient temperature Ta[℃] (5) ambient temperature vs. chromaticity diagram (6) forward current vs. chromaticity diagram (Ta=25℃) y y x 8) x Test condition : LED with Luxpia standard circuit board 13/14 (7) relative spectral emission V(λ) = standard eye response curve 1.2 (Ta=25℃, IF=150mA) 1 0.8 Inten s ity 0.6 0.4 0.2 0 380 430 480 530 580 wa ve le ngth (nm) 630 680 730 780 (8) radiation characteristics (Ta=25℃, IF=150mA) 100 50 0 50 100 14/14