MASW-001150-1316

MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Specified Bandwidth: 30MHz—2.5GHz Useable to 3.0GHz Low Loss 40dB High C.W. Incident Power, 50W at 500MHz Unique Thermal Terminal for Series Diode Surface Mount Device (No Wire Bonds) Rugged Silicon-Glass Construction Silicon Nitride Passivation Protective Polymer Scratch Protection RoHS Compliant V3 Description This device is a PIN diode series-shunt switch element with a unique integrated thermal terminal for dissipating heat in the series diode created by the DC and RF input power. The thermal terminal allows for optimum heat dissipation by providing a direct thermal path from the series diode to circuit thermal ground while also being electrically isolated. The chip is designed to provide a heat transfer conduit that does not interfere with the PIN diode anode (input) and cathode (output) electrical terminals, especially with respect to RF performance. The silicon-glass PIN diode chip is fabricated using M/A-COM Technology Solutions patented HMIC™ process. This device features silicon pedestals embedded in a low loss, low dispersion glass. Selective backside metallization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer to protect against damage during handling and assembly. Ordering Information 2 Part Number MASW-001150-13160W MASW-001150-13160P Package WAFFLE PACK POCKET TAPE 2. Reference Application Note M513 for reel size information. Absolute Maximum Ratings Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated RF & DC Power RF C.W. Incident Power Mounting Temperature ESD ESD ESD Absolute Maximum 100mA - 180V -55°C to +125°C -55°C to +150°C +175°C 500MHz, 4W 500MHz, 50W +260°C for 30 seconds Class 1A — HBM Class M3 — MM Class C3 — CDM Applications This PIN diode series-shunt switch element is particularly advantageous in higher average power, 50W switch applications from 30MHZ – 3000GHz. In addition, the backside RF, D.C., and thermal I/O ports allow for direct solder re-flow attachments to the micro-strip circuit for surface mount assembly. Of particular interest, is the thermal terminal which provides the power dissipating series diode a direct connection to the circuit thermal ground for unprecedented heat transfer. This thermal terminal is electrically isolated from the other I/O ports. The chip can be configured as either a reflective or an absorptive switch. 1 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Solutions has under development. Performance is based on engineering tests. Specifications are Visit www.macomtech.com for additional data sheets and product information. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal Electrical Specifications @ TAMB = +25°C Symbol CT Series CT Series CT Shunt CT Shunt RS Series RS Series RS Series RS Series RS Shunt RS Shunt VF VF IR RqJL TL 1 V3 Parameter Total Capacitance Total Capacitance Total Capacitance Total Capacitance Series Resistance Series Resistance Series Resistance Series Resistance Series Resistance Series Resistance Forward Voltage Forward Voltage Reverse Leakage Current Thermal Resistance Series Minority Carrier Lifetime Conditions -25V ,30MHz -25V, 1800MHz -25V, 30MHz -25V, 1800MHz 20mA, 30MHz 20mA,1800MHz 50mA, 30MHz 50mA,1800MHz 10mA, 30MHz 10mA, 1800MHz 20mA 50mA -180V Steady State IF 10mA/IR-6mA Units pF pF pF pF Ω Ω Ω Ω Ω Ω V V µA °C/W µs Typical 0.52 0.37 0.54 0.39 1.13 1.25 0.93 1.07 1.00 0.99 0.82 0.88 — 36.0 8.5 Maximum — — — — — — — — — — 0.85 0.90 -10.0 — — 1. Measured from 50% of control voltage to 90% of output voltage Parameter Units Insertion Loss dB Port 1 - 50mA - 50mA - 50mA - 50mA - 50mA - 50mA + 50mA + 50mA + 50mA Port 2 -25V -25V -25V -25V -25V -25V +25V +25V +25V Conditions 30MHz 1000MHZ 2500MHz 30MHz 1000MHZ 2500MHz 30MHz 1000MHZ 2500MHz -50mA / -25V F1 = 500MHz F2 = 505MHz PIN = +40dBm(each tone) 50mA / -25V 500MHz /+35dBm 50mA / -25V 500MHz /+35dBm Minimum — — — 36 18 11 60 40 29 — Typical 0.07 0.30 0.60 39 20 13 63 42 33 Maximum 0.10 0.45 0.80 — — — — — — Return Loss dB Isolation dB Input IP3 dBm - 50mA -25V -66 — 2nd Harmonic 3rd Harmonic 2 dBc dBc - 50mA - 50mA -25V -25V — — -46 -60 — — • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Solutions has under development. Performance is based on engineering tests. Specifications are Visit www.macomtech.com for additional data sheets and product information. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal V3 Typical RF Small Signal Performance MASW-001150-13160 Insertion Loss, Isolation, Return Loss From 45-3000 MHz Isolation_+5mA Return loss_-50 mA Insertion Loss_-50mA 0.0 -0.1 -0.2 Insertion Loss (dB) -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 0.0 0.5 1.0 1.5 Frequency (GHz) 2.0 2.5 3.0 0 -10 -20 -30 -40 -50 -60 -70 -80 Isolation & Return Loss (dB) 3 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Solutions has under development. Performance is based on engineering tests. Specifications are Visit www.macomtech.com for additional data sheets and product information. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal V3 Note: The bias circuits provided in the schematic above assumes current sources are available. If only voltage sources are available, a resistor will need to be added to the RF Input (J1) Bias Return Network. When using a D.C. voltage of 25V, a 500Ω resistor must be used to draw 50mA of current into the switch. 4 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Solutions has under development. Performance is based on engineering tests. Specifications are Visit www.macomtech.com for additional data sheets and product information. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal V3 Note: The bias circuits provided in the schematic above assumes current sources are available. If only voltage sources are available, a resistor will need to be added to the RF Input (J1) Bias Return Network. When using a D.C. voltage of 25V, a 500Ω resistor must be used to draw 50mA of current into the switch. 5 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Solutions has under development. Performance is based on engineering tests. Specifications are Visit www.macomtech.com for additional data sheets and product information. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal V3 RF , DC, and Thermal Circuit Footprint ( Topview ) 22 +0/-2 mil (4) PL RF Output Trace Direction RF Output 22 +0/-2 mil (4) PL RF Input RF Input Trace Direction 20 ±1 mil (4) PL Thermal Terminal Shunt Cathode Return Thermal Circuit Vias D.C Ground or RF Trace Direction 6 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Solutions has under development. Performance is based on engineering tests. Specifications are Visit www.macomtech.com for additional data sheets and product information. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal Chip Outline and Port Designations V3 Top View Dimension A B C D E F G Inches min. max. 0.0665 0.0673 0.0665 0.0673 0.0045 0.0053 0.0195 0.0205 0.0195 0.0205 0.0195 0.0205 0.0195 0.0205 Millimeters min. max. 1.69 1.71 1.69 1.71 0.115 0.135 0.495 0.520 0.495 0.520 0.495 0.520 0.495 0.520 Ports 1 2 3 4 Function RF Input Thermal Terminal for Series Diode (Electrically isolated from other ports) Shunt Diode (Cathode Return) RF Output / D.C. bias Notes: Backside Metal: 2.5μm thick Au Hatched yellow areas are I/O ports (die solder pads) Bottom View Ordering Information Part Number MASW-001150-13160W MASW-001150-13160P 7 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Solutions has under development. Performance is based on engineering tests. Specifications are Visit www.macomtech.com for additional data sheets and product information. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Packaging Waffle Tray Pocket Tape MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal V3 Component C1, C2 C3, C4 L1, L2, L3, L4 Value 0.01μF 100pF 390nH Case Size 0402 0402 0603 Manufacturer Murata Murata Coilcraft Ordering Information for Test Board Part Number MASW-001150-001SMB 8 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Solutions has under development. Performance is based on engineering tests. Specifications are Visit www.macomtech.com for additional data sheets and product information. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal V3 Assembly Guidelines Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder or conductive epoxy attachment onto hard or soft substrates. The use of 60/40, Pb/Sn, 80/20, Au/Sn or any RoHS lead-free solder is recommended to achieve the lowest series resistance and optimum heat sink. The thermal terminal is not electrically conductive and may be soldered directly to any appropriate heat sink without affecting RF performance. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the die. All mounting pads should be heated simultaneously so that the solder under the pads flows at the same time. Avoid soldering the pads one at a time as doing so would produce an un-equal heat flow and potentially create thermal stress to the chip. Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be uniformly heated in a re-flow oven. Proper flow is easily determined looking down from the top since the HMIC glass is transparent and the edges of the mounting pads can be visually inspected through the die after attachment is complete. A typical soldering process profile and handling instructions are provided in Application Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the MA-COM Technology Solutions website at www.macomtech.com Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the average power is