MASW-004103-1365

MASW-004103-1365 HMICTM Silicon PIN Diode SP4T Switch 50 MHz - 20 GHz Features • • • • • • • • • • • Specified from 50 MHz to 20 GHz Usable up to 26 GHz Low Insertion Loss High Isolation Low Parasitic Capacitance and Inductance RoHS Compliant Surmount™ Package Rugged, Fully Monolithic Glass Encapsulated Construction Up to +38 dBm C.W. Power Handling1 @ +25°C Silicon Nitride Passivation Polymer Scratch Protection Preliminary - Rev. V2P Functional Schematic Description MA-COM’s MASW-004103-1365 is a Surmount™ broadband monolithic SP4T switch using series and shunt connected silicon PIN diodes. This part is designed for use as a moderate signal, high performance switch in applications up to 20 GHz. This Surface Mount chipscale configuration is optimized for broadband performance with minimal associated parasitics usually associated with hybrid MIC designs incorporating beam lead and PIN diodes that require chip and wire assembly. The MASW-004103-1365 is fabricated using M/ACOM’s patented HMIC™ (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through low millimeter frequencies. Selective backside metalization is applied producing a Surface Mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode airbridge during handling and assembly. 1. 1 Power Handling Testing performed @ 2GHz 3. J3 J4 J2 J1 Pin Configuration 2 Pin J1 Function RFC RF1 RF2 RF3 RF4 J5 Ordering Information 2 J3 J4 J5 2. J2 The exposed pad centered on the chip bottom must be connected to RF and DC ground. Ordering Information 3 Part Number MASW-004103-13650G MASW-004103-13650P Package GEL PACK POCKET TAPE Reference Application Note M513 for reel size information. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004103-1365 HMICTM Silicon PIN Diode SP4T Switch 50 MHz - 20 GHz Electrical Specifications: TA = 25°C, PIN = 0 dBm, Z0 = 50 Ω, 20mA/-15V Parameter Insertion Loss Conditions 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz — — 2 GHz Units dB Min. — — — — — — — — — — — — — — — Typ. 0.5 0.8 1.2 56 41 33 22 18 16 53.5 41.5 31.5 20 — 36 Max. — — — — — — — — — — — — — 80 — Preliminary - Rev. V2P Isolation dB Input Return Loss dB Output to Output Isolation Switching Speed4 Voltage Rating5 Input 0.1dB Compression Point 4. 5. dB ns V dB Typical Switching Speed measured from 10% to 90 % of detected RF signal driven by TTL compatible drivers. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 uA maximum @ -80 volts. Functional Schematic J3 J4 Absolute Maximum Ratings 6,7 Parameter Operating Temperature Storage Temperature Junction Temperature Applied Reverse Voltage RF CW Incident Power Bias Current +25°C Absolute Maximum -65 °C to +125 °C -65 °C to +150 °C +175 °C |-80 V| 38dBm CW @ 2GHz, 25°C 33dBm CW @ 20GHz, 25°C ± 50 mA J2 J1 J5 Max Operating Conditions for combination RF Pwr, DC Bias, & Temp: 33dBm CW @ 20mA per Diode @ 85ºC @ 2GHz 6. 7. Exceeding any one or combination of these limits may cause permanent damage to this device. M/A-COM does not recommend sustained operation near Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity These devices are rated at Class 1A Human Body. Proper ESD control techniques should be used when handling these devices. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. 2 changes to the product(s) or information contained herein without notice. MASW-004103-1365 HMICTM Silicon PIN Diode SP4T Switch 50 MHz - 20 GHz Typical Performance Curves In s e rtio n L o s s @ 20 m A -1 5 V R F In p u t to R F O u tp u ts (J 1 to J 2 , J 3 , J4 , J5 ) 0 .0 J1 J1 J1 J1 TO TO TO TO J2 J3 J4 J5 Preliminary - Rev. V2P Is o la tio n @ 2 0 m A -1 5 V R F In p u t to R F O u tp u ts (J 1 to J 2 , J 3 , J4 , J5 ) 0 J1 J1 J1 J1 TO TO TO TO J2 J3 J4 J5 -2 0 -0 .5 Insertion Loss (dB) Isolation (dB) -4 0 -1 .0 -6 0 -1 .5 -8 0 -2 .0 0 5 10 15 20 25 30 -1 0 0 0 5 10 15 20 25 30 F re q u en c y (G H z ) F re q u en c y (G H z ) In p u t R e tu rn L o s s @ 2 0 m A -1 5 V R F In p u t to R F O u tp u ts (J 1 to J 2 , J 3 , J4 , J5 ) 0 J1 J1 J1 J1 TO TO TO TO J2 J3 J4 J5 O u tp u t R e tu rn L o s s @ 20 m A -15 V R F In p u t to R F O u tp u ts (J 1 to J 2 , J 3 , J4 , J5 ) 0 J1 J1 J1 J1 TO TO TO TO J2 J3 J4 J5 -2 0 Output Return Loss (dB) Input Return Loss (dB) -1 0 -1 0 -2 0 -3 0 -3 0 -4 0 0 5 10 15 20 25 30 -4 0 0 5 10 15 20 25 30 F re q u en c y (G H z ) F re q u en c y (G H z ) O u tp u t to O u tp u t Is o la tio n @ 2 0 m A , -1 5 V J 2 to J 3 a n d J 4 to J 5 0 J2 T O J 3 12 10 In p u t P o w e r (W a tts) 8 MASW-004103-1365 Maximum Input Power Curve Baseplate Temperature fixed @ 25degC Output to Output Isolation (dB) J4 T O J 5 -2 0 2GHz, 6.4W 6 4 2 20GHz, 2W 10GHz, 3.1W -4 0 -6 0 0 -8 0 0 5 10 15 20 25 30 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Insertion Loss (dB) 3 F re q u en c y (G H z ) ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004103-1365 HMICTM Silicon PIN Diode SP4T Switch 50 MHz - 20 GHz Bias Control Optimal operation of the MASW-004103-1365 is achieved by simultaneous application of negative DC voltage and current to the low loss switching arm and positive DC voltage and current to the remaining switching arms as shown in the applications circuit below. DC return is achieved via R2 on the RFC path. In the low loss state, the series diode must be forward biased with current and the shunt diode reverse biased with voltage. In the isolated arm, the shunt diode is forward biased with current and the series diode is reverse biased with voltage. Preliminary - Rev. V2P Driver Connections Control Level (DC Currents and Voltages) J2 -15V at -20mA 8 +20mA +20mA +20mA J3 +20mA -15V at -20mA 8 +20mA +20mA J4 +20mA +20mA -15V at -20mA 8 +20mA J5 +20mA +20mA +20mA -15V at -20mA 8 Condition of RF Output J1-J2 Low Loss Isolation Isolation Isolation Condition of RF Output J1-J3 Isolation Low Loss Isolation Isolation Condition of RF Output J1-J4 Isolation Isolation Low Loss Isolation Condition of RF Output J1-J5 Isolation Isolation Isolation Low Loss 8. The voltage applied to the off arm can vary as long as 20mA is applied through the shunt diode on the off arm. Application Circuit 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004103-1365 HMICTM Silicon PIN Diode SP4T Switch 50 MHz - 20 GHz Outline Drawing Footprint Preliminary - Rev. V2P Top View 2245 Side View 125 Backside View Backside view shows the back metal that is the foot print of the chip and all dimension are +/-0.5um Ground radius is 200um centered on the I/O Pad. MASW-004103-1365 DIM MIN Width Length Thickness 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. 0.06220 0.08740 0.00394 1605 Units in µm Inches MAX 0.06417 0.08937 0.00591 MIN 1.580 2.220 0.100 mm MAX 1.630 2.270 0.150 changes to the product(s) or information contained herein without notice. MASW-004103-1365 HMICTM Silicon PIN Diode SP4T Switch 50 MHz - 20 GHz Handling Procedures Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ≤ 1W, conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150°C. When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum tip pick-up tool and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recommended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die so that its mounting pads are aligned with the circuit board mounting pads. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , “Surface Mounting Instructions“ and can viewed on the MA-COM Technology Solutions website @ www.macomtech.com Preliminary - Rev. V2P 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004103-1365 HMICTM Silicon PIN Diode SP4T Switch 50 MHz - 20 GHz Pocket Tape Information Preliminary - Rev. V2P Carrier Tape Dimensions .157 ± .004 4.00 ± 0.10 .079 ± .002 2.00 ± 0.05 .157 ± .004 4.00 ± 0.10 Ф .059 ± .004 THRU 1.5 ± .069 ± .004 1.75 ± 0.10 +.012 +0.30 8.00 - 0.10 .093 ± .002 2.36 ± 0.05 Ф 0.035 THRU TYP. Ф 0.89 .138 3.5 ± 0.05 .012 ± .001 0.30 ± 0.03 5° MAX. .012 ± .002 0.30 ± 0.05 POCKET DEPTH .066 ± .002 1.80 ± 0.05 Chip Orientation in Tape 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004103-1365 HMICTM Silicon PIN Diode SP4T Switch 50 MHz - 20 GHz Reel Information Preliminary - Rev. V2P A DIM A B C D INCHES MIN. MAX. 6.980 .059 .504 .795 7.019 .098 .520 .815 MM MIN. 177.3 1.5 MAX. 178.3 2.5 12.8 20.2 13.2 20.7 N W1 W2 2.146 .331 —- 2.185 .337 .567 54.5 8.4 —- 55.5 8.55 14.4 8 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.