MASW-004240-13170W

MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch RoHS Compliant Rev. V1 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Frequency of Operation 10 ± 2GHz or 24 ± 2GHz Surface Mount Device Integrated Bias Network No Wire Bonds Required Low Current Consumption +12 mA for On State/0V for Off Condition Rugged, Glass Encapsulated Construction Fully Monolithic Polymer Scratch Protection Description The MASW-004240-13170W is a surface mount SP4T switch chip with integrated bias network. It utilizes M/A-COM's HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310, which allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. Patterned gold backside metal allows for manual or re-flow soldering without the need for wire bond connections to the RF and bias ports. The chip may be soldered using 80Au/20Sn, RoHS compliant solders or electrically conductive silver epoxy. The RF bond pads are labeled J1-J5 and are 375x375µM (15x15mils) square. The DC bias bond pads are labeled B2-B5 and are also 375x375µM (15x15mils) square. Yellow areas denote backside soldering points for bias and RF connections. Parameter Operating Temperature Storage Temperature Junction Temperature Applied Forward Current RF Incident Power Mounting Temperature Absolute Maximum -65oC to +125oC -65oC to +150oC +175oC +40mA +30dBm C.W. +280 C for 10 Seconds o Applications The MASW-004240-13170W has been designed for 24GHz automotive radar sensor applications and is also ideally suited for use at 10GHz. The switch is turned on by applying a forward current of +12mA at 4V to the appropriate bias port and is turned off at 0V. The RF bias network has been incorporated into the design for ease of use and space considerations. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch RoHS Compliant Rev. V1 MASW-004240-13170W (SP4T) Electrical Specifications @ TAMB = +25oC Parameter Frequency 10GHz & 24GHz Port 1 J1 J1 J1 J1 J1 J1 J1 J1 J1 J1 J1 J1 Port 2 J2 J3 J4 J5 J2 J3 J4 J5 J2 J3 J4 J5 Stimulus 12mA @ B2 12mA @ B3 12mA @ B4 12mA @ B5 12mA @ B2 12mA @ B3 12mA @ B4 12mA @ B5 12mA @ B2 12mA @ B3 12mA @ B4 12mA @ B5 Minimum Typical 2.5 2.5 2.5 2.5 50 50 50 50 14 14 14 14 Maximum 3.5dB 3.5dB 3.5dB 3.5dB Insertion Loss Isolation 10GHz & 24GHz 40dB 40dB 40dB 40dB Input Return Loss 10GHz & 24GHz 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch RoHS Compliant Rev. V1 TYPICAL INSERTION LOSS 0.0 -0.5 -1.0 -10 0 TYPICAL ISOLATION Insertion Loss (dB -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 - 5.0 0 5 10 15 20 25 30 Isolation (dB) -20 -30 -40 -50 -60 0 5 10 15 20 25 30 Frequency (GHz) Frequency (Ghz) TYPICAL INPUT RETURN LOSS 0 0 TYPICAL OUTPUT RETURN LOSS O utput Return Loss (dB ) 0 5 10 15 20 25 30 -2 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 0 5 10 15 20 25 30 Input Return Loss (dB) -4 -6 -8 -10 -12 -14 -16 -18 -20 Frequency (GHz) Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch RoHS Compliant Rev. V1 MASW-004240-13170W Schematic Operation of the MASW-004240-13170W Operation of the MASW-00420-13170W PIN diode switch is achieved by simultaneously applying a current of +12mA DC to the bias port of the on arm and 0V to the remaining isolated off arms. Driver Connections Control Level ( DC Current ) at Port B2 -12mA 0V 0V 0V 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. Condition of RF Output J1-J2 Low Loss Isolation Isolation Isolation J1-J3 Isolation Low Loss Isolation Isolation J1-J4 Isolation Isolation Low Loss Isolation J1-J5 Isolation Isolation Isolation Low Loss B3 0V -12mA 0V 0V B4 0V 0V -12mA 0V B5 0V 0V 0V -12mA changes to the product(s) or information contained herein without notice. MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch RoHS Compliant Rev. V1 Chip Dimensions and Pad Locations1,2,3 Dim A B C D E F G H Chip Dimensions Mils Millimeters Min. Max Min. Max 132.0 134.0 3.350 3.400 128.5 129.0 3.270 3.280 4.0 6.0 0.102 0.152 67.0 71.0 0.170 0.180 14.5 15.0 0.370 0.380 43.3 43.7 1.100 1.110 28.3 28.7 0.720 0.730 9.5 10.0 0.245 0.255 Dim J1 J2 J3 J4 J5 B2 B3 B4 B5 R.F. & DC ground Bond Pad Centers Mils Millimeters X Y X Y 0 -57 0 -1.450 -57 -57 1.450 -1.450 57 57 1.450 1.450 -57 57 -1.450 1.450 -57 -57 -1.450 -0.145 -57 15 1.450 0.380 12 57 0.313 1.450 -12 57 -0.313 1.450 -57 15 -1.450 0.380 Notes: 1. 2. 3. Backside metallization thickness is.01µM. Hatched areas indicate backside ohmic gold contacts Bond pad centers are referenced from chip center. 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch RoHS Compliant Rev. V1 Die Attachment and Handling Guidelines Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder or conductive epoxy attachment onto hard or soft substrates. The use of 60Pb/40Sn, 80Au/20Sn or any RoHS lead-free solder is recommended to achieve the lowest series resistance and optimum heat sink. . When soldering these devices a hot gas or oven re-flow process is preferred. We recommend utilizing a vacuum tip and applying a downward force of 40 - 60 grams to the top surface of the device. When soldering, position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the die. All mounting pads should be heated simultaneously so that the solder under the pads flows at the same time. Avoid soldering the pads one at a time as doing so would produce an un-equal heat flow and potentially create thermal stress to the chip. Solder reflow should not be performed by causing the heat to flow through the top surface of the die. Die should be uniformly heated in a re-flow oven. A typical heating profile and handling instructions are provided in Application Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the MA-COM website at www.macom.com Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the average power is