MASW-008902-000DIE_V4

MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Features • 802.11b/g and Bluetooth Applications • Insertion Loss: 0.60 dB typical • Isolation: 31 dB typical (RX Path) 22 dB typical (TX / BT paths) • Flip-chip configuration • RoHS* Compliant Rev. V4 Die Bump Pad Layout (bump side up) Description The MASW-008902-000DIE is a bumped single band GaAs pHEMT MMIC SP3T switch. Typical applications are for single band 2.4 GHz WLAN (802.11 b/g) and Bluetooth applications. The MASW-008902-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. The MASW-008902-000DIE is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for WLCSP applications. Die Bump Pad Configuration Name VC1 BT GND TX Description Voltage Control 1 Blue Tooth TX/RX Port Ground 2.5 GHz TX Port Voltage Control 3 2.5 GHz RX Port Voltage Control 2 Antenna Port Ordering Information 1,2 Part Number MASW-008902-000DIE MASW-008902-000D3K MASW-008902-001SMB Package Separated Die on Grip Ring Die in 3000 piece reel Sample Board SP3T VC3 RX VC2 RFC Absolute Maximum Ratings 3,4 Parameter Input Power @ 3 V Control Input Power @ 5 V Control Operating Voltage Operating Temperature Storage Temperature Absolute Maximum +32 dBm +35 dBm +8 volts -40°C to +85°C -65°C to +150°C 1. Die quantity varies. 2. Die on Grip Ring not available with orientation mark. 3. Exceeding any one or combination of these limits may cause permanent damage to this device. 4. M/A-COM Technology does not recommend sustained operation near these survivability limits. * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Electrical Specifications5: TA = 25°C, Z0 = 50 Ω, VC = 0/3V, PIN = 0 dBm Parameter Insertion Loss Isolation Return Loss IP3 Input P1dB Test Conditions RFC to TX/RX/BT, 2.4 GHz RFC to TX, 2.4 GHz RFC to RX, 2.4 GHz RFC to BT, 2.4 GHz 2.4 - 2.5 GHz RF to TX/RX/BT, 2.4 GHz, 20 dBm Total Power, 1 MHz Spacing RF to TX, 2.4 - 2.5 GHz RF to RX, 2.4 - 2.5 GHz RF to BT, 2.4 - 2.5 GHz RF to TX, 2.4 - 2.5 GHz, 20 dBm 50% control to 90% RF 50% control to 10% RF |VC| = 3 V Units dB dB dB dBm dBm Min. — 20 30 20 — — — — — — — — — Typ. 0.60 23.5 31.0 21.0 15 55 32 28 32 -75 165 25 50 wafers, tested per electrical specifications: Freq. = 2.4 GHz, TA = 25°C, Z0 = 50 Ω, VC = 0/3V, PIN = 0 dBm 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Typical Performance Curves (plots = chip on board assembly) TX Insertion Loss 0.85 +25°C -40°C +85°C Rev. V4 TX Isolation 35 0.80 30 +25°C -40°C +85°C 0.75 25 0.70 20 0.65 2.40 2.42 2.44 2.46 2.48 2.50 15 2.40 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) Frequency (GHz) RX Insertion Loss 0.85 +25°C -40°C +85°C RX Isolation 35 0.80 30 0.75 25 +25°C -40°C +85°C 0.70 20 0.65 2.40 2.42 2.44 2.46 2.48 2.50 15 2.40 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) Frequency (GHz) BT Insertion Loss 0.85 BT Isolation 35 0.80 +25°C -40°C +85°C 30 +25°C -40°C +85°C 0.75 25 0.70 20 0.65 2.40 2.42 2.44 2.46 2.48 2.50 15 2.40 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) Frequency (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Die Dimensions (Top and Side Views) PCB Top Metal / Solder Mask Rev. V4 Die Bump Pad Layout - Top View (bump side up) Die Bump Pad Layout - Bottom View (bump side down - as installed on board) 10.Orientation mark is only on material that is shipped in tape and reel. The mark is not available on die shipped on grip ring. 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.