MASW20000

MASW20000 GaAs SPDT Switch DC - 20 GHz Features • • • • • • • Very Broadband Performance Low Insertion Loss: 1.75 dB Typical @ 18 GHz High Isolation: 50 dB Typical @ 18 GHz Fast Switching Speed: 2 ns Typical Reflective Configuration Ultra Low DC Power Consumption Via Hole Grounding Rev. V5 Pad Layout GND RF GND GND GND RF1 RF2 Description M/A-COM’s MASW20000 is a versatile, high isolation SPDT switch. Designed on M/A-COM’s mature 1-micron MESFET process, this parts is ideal for modules or other packaging for use in the Cellular, GPS, LAN and infrastructure markets. Demonstrating performance up to 20 GHz, the MASW20000 will perform well in many types of applications within that range. GND GND A1 B2 B1 A2 Bond Pad Dimensions Bond Pad RF, RF1, RF2 Dimension Inches (mm) 0.004 x 0.004 (0.100 x 0.100) 0.004 x 0.004 (0.100 x 0.100) 0.083 x 0.035 x 0.004 (2.10 x 0.89 x 0.10) Ordering Information Part Number MASW20000 1. Die quantity varies. 1 A1, A2, B1, B2 Package Die DIE Size Schematic Absolute Maximum Ratings2 Parameter Control Voltage (A1/B2 or A2/B1) Input RF Power Operating Temperature Storage Temperature Absolute Maximum -8.5 VDC +34 dBm +175°C -65°C to +175°C 2. Exceeding any one or combination of these limits may cause permanent damage to this device. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW20000 GaAs SPDT Switch DC - 20 GHz Electrical Specifications3: TA = 25°C, Z0 = 50Ω, +25°C 4 Parameter Insertion Loss Test Conditions 10 GHz 18 GHz 20 GHz 10 GHz 18 GHz 20 GHz 10 GHz 18 GHz 20 GHz 10% to 90% RF and 90% to 10% RF 50% control to 90% RF, and 50% control to 10% RF In-Band 0.5 - 20 GHz, 0 to -5 V 0.05 GHz, 0 to -5 V Two Tone, +5 dBm/Tone, 5 MHz Spacing, >50 MHz 0.5 - 20 GHz Two Tone, +5 dBm/Tone, 5 MHz Spacing, >50 MHz 0.5 - 20 GHz 0.05 GHz VIN Low, 0 to -0.2 V VIN High, -5 V Units dB dB dB dB dB dB Ratio Ratio Ratio ns ns mV dBm dBm dBm dBm dBm µA µA Min. — — — 50 42 40 — — — — — — — — — — — — — Typ. 1.4 1.75 2.0 59 49 47 — — — 2 3 20 25 18 +59 +43 +27 — — Max. 1.7 2.1 2.5 — — — 1.6:1 1.8:1 2.0:1 — — — — — — — — 5 50 Rev. V5 Isolation VSWR Trise, Tfall Ton, Toff Transients Input P1dB IP2 IIP3 Control Voltage (Complementary Logic) 3. All specifications apply with 50 Ω impedance connected to all RF ports, 0 and –5 VDC control voltages. 4. Loss changes 0.0025 dB/°C (From –55°C to +85°C). Truth Table 5,6 Control Inputs A1/B2 VIN Hi VIN Low A2/B1 VIN Low VIN Hi Condition of Switch RF1 On Off RF2 Off On Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 5. VIN Low = 0 to –0.2 V, VIN Hi = -5V 6. For normal SPDT operation A1 is connected to B2 and A2 is connected to B1. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW20000 GaAs SPDT Switch DC - 20 GHz Typical Performance Curves Insertion Loss 2.5 Rev. V5 Isolation 80 2.0 65 1.5 50 1.0 35 0.5 0 2 4 6 8 10 12 14 16 18 20 20 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Frequency (GHz) VSWR 2.00 1.75 Input Output 1.50 1.25 1.00 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW20000 GaAs SPDT Switch DC - 20 GHz Handling Procedures Permanent damage to the MASW20000 may occur if the following precautions are not adhered to: A. Cleanliness - The MASW20000 should be handled in a clean environment. DO NOT attempt to clean assembly after the MASW20000 is installed. B. Static Sensitivity - All die handling equipment and personnel should be DC grounded. C. Transients - Avoid instrument and power supply transients while bias is connected to the MASW20000. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply voltage to either control port A1/B2 or A2/B1 only when the other is grounded. Neither port should be allowed to “float”. E. General Handling - It is recommended that the MASW20000 chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers. Rev. V5 Wire Bonding A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Gold ribbon (3.0 mil x 0.5 mil) may also be used. Thermo sonic wire bonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels to achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. Mounting The MASW20000 is back-metallized with Pd/Ni/Au (100/1,000/30,000Å) metallization. It can be die-mounted using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C. When hot 90/10 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290°C. B. DO NOT expose the MASW20000 to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MASW20000 into position. A thin epoxy fillet should be visible around the perimeter of the die. B. Cure epoxy per manufacturer’s recommended schedule. C. Electrically conductive epoxy is recommended but is not required. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.