MASW2040

MASW2040 GaAs DPDT Switch DC - 2.0 GHz Features • • • • • Cascadable Low Insertion Loss Low DC Power Consumption Low Distortion Operation (Quiet Mode) Useful as a Building Block for -Digital Attenuators -Digital Delay Lines -Digital Phase Shifters -Digital Switched Filter Elements Rev. V3 Pad Layout RFA1 RFA2 Description M/A-COM’s MASW2040 is a GaAs MMIC DPDT switch die. The MASW2040 is ideally suited for use where low power consumption is required. Typical applications include transmit/receive switching, switch matrices, and switched filter banks in systems such as radio and cellular equipment, PCM, GPS, fiber optic modules, and other battery powered radio equipment. RFB1 RFB2 Die Size—Inches (mm) 0.043 x 0.037 x 0.010 (1.10 x 0.94 x 0.25) Ordering Information Part Number MASW2040 Bond Pad Dimensions Package DIE Bond Pad RF1, RF2 RFA1, RFB1 Dimensions - Inches (mm) 0.004 x 0.007 (0.102 x0.182) 0.005 x 0.004 (0.133 x 0.100) 0.005 x 0.004 (0.133 x 0.100) 0.004 x 0.004 (0.100 x 0.100) Absolute Maximum Rating 1,2 Parameter Control Value (A or B) Max Input RF Power Storage Temperature Max Operating Temperature RFA2, RFB2 A, B, Ac, Bc Absolute Maximum -8.5 Vdc +34 dBm -65°C to +175°C +175°C Schematic 1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. M/A-COM does not recommend sustained operation near these survivability limits. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2040 GaAs DPDT Switch DC - 2.0 GHz Electrical Specifications: 0 / -5 Vdc, -55°C to +85°C Parameter Insertion Loss Rev. V3 Test Conditions DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz 0.05 GHz (0 / -5 V, 0 / -8V) 0.5 - 2.0 GHz (0 / -5 V, 0 / -8V) Two Tone Input Power up to +5 dBm 0.05 GHz 0.5 - 2.0 GHz Two Tone Input Power up to +5 dBm 0.05 GHz 0.5 - 2.0 GHz VIN Low (0 to -0.2 V) VIN High (-5 V @ 25 µA Typ to -8 V) 10% to 90% RF and 90% to 10% RF 50% control to 90% RF, and 50% control to 90% RF In Band Units dB dB dB dB dB dB Ratio Ratio Ratio dBm dBm dBm dBm dBm dBm µA µA ns ns mV Min. — — — 25 20 15 — — — — — — — — — — — — — — Typ. — — — — — — — — — +24, +25 +30, +33 +62 +68 +39 +46 — — 3 6 20 Max. 0.4 0.4 0.6 — — — 1.1:1 1.2:1 1.2:1 — — — — — — 9 75 — — — Isolation VSWR Input P-1dB IP2 IP3 Control Current T-rise, T-fall TON, TOFF Transients Truth Table 3 Control A 1 0 Handling Procedures Condition of Switch Please observe the following precautions to avoid damage: RF2RFB2 On Off B 0 1 RF1RFA1 Off On RF1RFB1 On Off RF2RFA2 Off On Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 3. 0 = 0 to –0.2 V, 1 = -5 V. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2040 GaAs DPDT Switch DC - 2.0 GHz Typical Performance @ 25°C Insertion Loss vs. Frequency 1.0 Rev. V3 VSWR vs. Frequency 1.5 0.75 1.4 1.3 0.50 1.2 0.25 1.1 0.0 0.0 0.5 1.0 1.5 2.0 1.0 0.0 0.5 1.0 1.5 2.0 Frequency (GHz) Frequency (GHz) Isolation vs. Frequency 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2040 GaAs DPDT Switch DC - 2.0 GHz Handling Precautions Permanent damage to the MASW2040 may occur if the following precautions are not adhered to: A. Cleanliness - The MASW2040 should be handled in a clean environment. DO NOT attempt to clean unit after the MASW2040 is installed. B. Static Sensitivity - All chip handling equipment and personnel should be DC grounded. C. Transient - Avoid instrument and power supply transients while bias is applied to the MASW2040. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply Voltage to either control port A or B only when the other is grounded. Neither port should be allowed to “float.” E. General Handling - It is recommended that the MASW2040 chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers. Rev. V3 Wire Bonding A. Ball or wedge with 1.0 mil diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended. Mounting The MASW2040 is back-metallized with Pd/Ni/Au (100/1,000/10,000Å) metallization. It can be diemounted with AuSn eutectic performs or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C. When not 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290°C. B. DO NOT expose the MASW2040 to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds for scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MASW2040 into position. A thin epoxy fillet should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer’s recommended schedule. C. Electrically conductive epoxy may be used by is not required. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.