MASW6010G

MASW6010G V GaAs SPDT Switch DC - 6.0 GHz Rev. V5 Features • • • • Low Insertion Loss: 0.5 dB Typical @ 4 GHz Fast Switching Speed: 4 nS Typical Ultra Low DC Power Consumption Integral Static Protection Pad Layout Description M/A-COM’s MASW6010G is an SPDT GaAs MESFET MMIC. This part combines small size, low insertion loss and power consumption with high isolation. Ideal for many applications and module use. It will function well for designs below 6 GHz. This die includes full passivation for performance and reliability. Ordering Information1 Part Number MASW6010G 1. Die quantity varies. Bond Pad Dimensions Package Die Bond Pad RFC RF2, RF3 A, B GND1, GND2 DIE Size Dimension Inches (mm) 0.004 x 0.004 (0.100 x 0.100) 0.004 x 0.004 (0.100 x 0.100) 0.004 x 0.004 (0.100 x 0.100) 0.012 x 0.004 (0.300 x 0.100) 0.031 x 0.031 x 0.010 (0.80 x 0.80 x 0.25) Absolute Maximum Ratings 2 Parameter Control Voltage (A/B) Input RF Power Operating Temperature Storage Temperature Schematic Absolute Maximum -8.5 VDC +42 dBm (500 MHz - 6 GHz) +175°C -65°C to +175°C 2. Exceeding any one or combination of these limits may cause permanent damage to this device. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW6010G GaAs SPDT Switch DC - 6.0 GHz Electrical Specifications 3,4: TA = 25°C, Z0 = 50Ω Parameter Insertion Loss Rev. V5 Test Conditions DC - 1.0 GHz DC - 2.0 GHz DC - 6.0 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 6.0 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 6.0 GHz 10% to 90% RF and 90% to 10% RF 50% control to 90% RF, and 50% control to 10% RF In-Band Above 500 MHz, 0 to -5 V 100 MHz, 0 to -5 V Above 500 MHz, 0 to -8 V 100 MHz, 0 to -8 V Two Tone, +5 dBm/Tone, 5 MHz Spacing Above 500 MHz 100 MHz Two Tone, +5 dBm/Tone, 5 MHz Spacing Above 500 MHz 100 MHz VIN Low, 0 to -0.2 V VIN High, -5 V VIN High, -8 V Units dB dB dB dB dB dB Ratio Ratio Ratio nS nS mV dBm dBm dBm dBm dBm dBm dBm dBm µA µA µA Min. — — — 45 38 22 — — — — — — — — — — — — — — — — — Typ. — — — — — — — — — 2 4 10 +27 +21 +33 +26 +68 +62 +46 +40 — — — Max. 0.6 0.8 1.4 — — — 1.1:1 1.2:1 1.9:1 — — — — — — — — — — — 20 50 300 Isolation VSWR Trise, Tfall Ton, Toff Transients Input P1dB IP2 IIP3 Control Voltage (Complementary Logic) 3. All specifications apply with 50-ohm impedance connected to all RF ports, 0 and –8 VDC control voltages. 4. Loss changes 0.0025 dB/°C (From –55°C to +85°C). Handling Procedures Please observe the following precautions to avoid damage: Truth Table 5 Control Inputs A VIN Hi VIN Low Condition of Switch RF Common to each RF Port RF1 On Off Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. B VIN Low VIN Hi RF2 Off On 5. VIN Low = 0 to -0.2 V, VIN High = -5 to -8 V. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW6010G GaAs SPDT Switch DC - 6.0 GHz Typical Performance Curves Insertion Loss 1.4 +85°C +25°C -55°C Rev. V5 Isolation 80 1.2 70 1.0 60 0.8 50 0.6 40 0.4 30 0.2 0 1 2 3 4 5 6 7 20 0 1 2 3 4 5 6 7 Frequency (GHz) Frequency (GHz) VSWR 2.0 1.8 1.6 1.4 1.2 1.0 0 1 2 3 4 5 6 7 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW6010G GaAs SPDT Switch DC - 6.0 GHz Handling Procedures Permanent damage to the MASW6010G may occur if the following precautions are not adhered to: A. Cleanliness - The MASW6010G should be handled in a clean environment. DO NOT attempt to clean assembly after the MASW6010G is installed. B. Static Sensitivity - All die handling equipment and personnel should be DC grounded. C. Transients - Avoid instrument and power supply transients while bias is connected to the MASW6010G. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply voltage to either control port A/B or only when the other is grounded. Neither port should be allowed to “float”. E. General Handling - It is recommended that the MASW6010G chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers. Rev. V5 Wire Bonding A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermosonic wire bonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels to achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. Mounting The MASW6010G is back-metallized with Pd/Ni/Au (100/1,000/30,000Å) metallization. It can be diemounted using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C. When hot 90/10 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290°C. B. DO NOT expose the MASW6010G to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: A. Electrically conductive epoxy must be used. B. Apply a minimum amount of epoxy and place the MASW6010G into position. A thin epoxy fillet should be visible around the perimeter of the die. C. Cure epoxy per manufacturer’s recommended schedule. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.