SEMICONDUCTOR TECHNICAL DATA
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The RF Line
NPN Silicon RF Power Transistor
. . . designed primarily for wideband large–signal driver and predriver amplifier stages in 200–500 MHz frequency range. • Guaranteed Performance at 400 MHz, 28 Vdc Output Power = 10 Watts Power Gain = 12 dB Min Efficiency = 50% Min • 100% Tested for Load Mismatch at all Phase Angles with 30:1 VSWR • Gold Metallization System for High Reliability • Computer–Controlled Wirebonding Gives Consistent Input Impedance
MRF321
10 W, 400 MHz RF POWER TRANSISTOR NPN SILICON
MAXIMUM RATINGS
Rating Collector–Emitter Voltage Collector–Base Voltage Emitter–Base Voltage Collector Current — Continuous Collector Current — Peak Total Device Dissipation @ TA = 25°C (1) Derate above 25°C Storage Temperature Range Symbol VCEO VCBO VEBO IC PD Tstg Value 33 60 4.0 1.1 1.5 27 160 –65 to +150 Unit Vdc Vdc Vdc Adc Watts mW/°C °C
CASE 244–04, STYLE 1
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Case Symbol RθJC Max 6.4 Unit °C/W
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = 20 mAdc, IB = 0) Collector–Emitter Breakdown Voltage (IC = 20 mAdc, VBE = 0) Collector–Base Breakdown Voltage (IC = 20 mAdc, IE = 0) Emitter–Base Breakdown Voltage (IE = 2.0 mAdc, IC = 0) Collector Cutoff Current (VCB = 30 Vdc, IE = 0) V(BR)CEO V(BR)CES V(BR)CBO V(BR)EBO ICBO 33 60 60 4.0 — — — — — — — — — — 1.0 Vdc Vdc Vdc Vdc mAdc
ON CHARACTERISTICS
DC Current Gain (IC = 500 mA, VCE = 5.0 Vdc) hFE 20 — 80 —
NOTE: (continued) 1. This device is designed for RF operation. The total device dissipation rating applies only when the device is operated as an RF amplifier.
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ELECTRICAL CHARACTERISTICS — continued (TC = 25°C unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
DYNAMIC CHARACTERISTICS
Output Capacitance (VCB = 28 Vdc, IE = 0, f = 1.0 MHz) Cob — 10 12 pF
FUNCTIONAL TESTS (Figure 1)
Common–Emitter Amplifier Power Gain (VCC = 28 Vdc, Pout = 10 W, f = 400 MHz) Collector Efficiency (VCC = 28 Vdc, Pout = 10 W, f = 400 MHz) Load Mismatch (VCC = 28 Vdc, Pout = 10 W, f = 400 MHz, VSWR = 30:1 all phase angles) GPE η ψ No Degradation in Output Power 12 50 13 60 — — dB %
5V
+ -
R2 D1
R3 R4 C9 L3 L1 Z3 DUT C10 C11
L4 C12 + C8 + 28 V -
C13
Z4
RF OUTPUT
RF INPUT
Z1
Z2
L2 C5 R1 C6 C7
C1
C2
C3
C4
C1, C2, C3 — 1.0–20 pF Johanson Trimmer (JMC 5501) C3, C4 — 47 pF ATC Chip Capacitor C5, C10 — 0.1 µF Erie Redcap C7 — 0.5–10 pF Johanson Trimmer (JMC 5201) C8 — 0.018 µF Vitramon Chip Capacitor C9 — 200 pF UNELCO Capacitor C11, C12 — 680 pF Feedthru C13 — 1.0 µF, 50 Volt Tantalum Capacitor D1 — 1N4001 L1 — 0.33 µH Molded Choke with Ferroxcube Bead L1 — (Ferroxcube 56–590–65/4B) on Ground End of Coil L2 — 4 Turns #20 Enamel, 1/8″ ID
L3 — 6 Turns #20 Enamel, 1/4″ ID L4 — Ferroxcube VK200–19/4B R1 — 5.1 Ω, 1/4 Watt R2 — 120 Ω, 1.0 Watt R3 — 20 Ω, 1/2 Watt R4 — 47 Ω, 1/2 Watt Z1 — Microstrip 0.1″ W x 1.35″ L Z2 — Microstrip 0.1″ W x 0.55″ L Z3 — Microstrip 0.1″ W x 0.8″ L Z4 — Microstrip 0.1″ W x 1.75″ L Board — Glass Teflon, εR = 2.56, t = 0.062″ Input/Output Connectors — Type N
Figure 1. 400 MHz Test Circuit Schematic
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12 Pout , OUTPUT POWER (WATTS) Pout , OUTPUT POWER (WATTS) 10 8 6 4 VCC = 28 V 2 100 200 300 400 0.1 W f, FREQUENCY (MHz)
12 10 8 6 4
f = 200 MHz
400
500
Pin = 1 W 0.7 W 0.5 W 0.4 W 0.3 W 0.2 W 500 600
VCC = 28 V 2 0 300 600 900 1200 1500
Pin, INPUT POWER (mW)
Figure 2. Output Power versus Frequency
Figure 3. Output Power versus Input Power
12 10 8 6 4 f = 400 MHz 2 10 14 18 22 26 30 Pin = 0.5 W G PE , COMMON EMITTER AMPLIFIER POWER GAIN (dB) Pout , OUTPUT POWER (WATTS)
22 18 14 10 6 2 Po = 10 W VCC = 28 V
0.35 W
200
300
400
500
VCC, SUPPLY VOLTAGE (VOLTS)
f, FREQUENCY (MHz)
Figure 4. Output Power versus Supply Voltage
Figure 5. Power Gain versus Frequency
3
0 -5 -10
f = 200 MHz
400 Zin 500
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Po = 10 W, VCC = 28 V f MHz 200 400 500 500 400 Zin Ohms 0.68 - j0.75 0.89 + j2.7 1.3 + j4.3 ZOL* Ohms 14.2 - j22 9.8 - j14.4 9.3 - j13
5
10
15
ZOL*
20
f = 200 MHz
25
ZOL* = Conjugate of the optimum load impedance into which the device output operates at a given output power, ZOL* = voltage and frequency.
Figure 6. Series Equivalent Impedance
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PACKAGE DIMENSIONS
2 3 4 1
D K M
DIM A B C D E G J K M P S T U STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 7.06 7.26 6.20 6.50 14.99 16.51 5.46 5.96 1.40 1.65 1.52 --0.08 0.17 11.05 --45_NOM --1.27 3.00 3.25 1.40 1.77 2.92 3.68 INCHES MIN MAX 0.278 0.286 0.244 0.256 0.590 0.650 0.215 0.235 0.055 0.065 0.060 --0.003 0.007 0.435 --45 _NOM --0.050 0.118 0.128 0.055 0.070 0.115 0.145
T
A
J
F
SEATING PLANE
P
8-32 NC 2A
U
S
C
WRENCH FLAT
E B
EMITTER BASE EMITTER COLLECTOR
CASE 244–04 ISSUE J
Specifications subject to change without notice. n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
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