LSMBC-102-D-02-T-LF

8 7 6 4 5 2 3 1 Recommended P.C. Board Layout SCALE 4:1 SURFACE MOUNT 02 PASS THRU ENTRY SURFACE MOUNT 02 TOP ENTRY .050[1.27] 2X .051 [1.30] F .050[1.27] Pin 1 2x 0.51 [1.30] .303 .039 [1.00] F [7.70] .079[2.00] .100[2.54] .100[2.54]X No. of Positions - .200[5.08] .008[0.20] E .035[0.90] Pin 1 .300 [7.62] .055 [1.40] LSMBC-1 XX - X - XX - XX - V - XXX - XX - X - XX - LF (A) (B) (C ) (D) (E) (F) (G) (H) (I) (J) .100[2.54] THRU HOLE OPTION 06 ENTRY THRU HOLE OPTION 04 ENTRY APPLICATION D Point of Contact .037[0.95] SURFACE MOUNT OPTION THRU HOLE OPTION 04 THRU HOLE OPTION 06 G T GT H F FT C .138 [3.50] .145 [3.65] .055 [1.40] 2X 0.043[1.10] .019[0.50] x .009[0.25] .122 [3.10] .300[7.62] .100 [2.54] .100[2.54]X No. of Positions + .010[0.254] .100[2.54]X No. of Spaces - .039[0.99] .008[0.20] .100 [2.54] 01 79 .100[2.54] PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF Major League Electronics. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF Major League Electronics IS PROHIBITED. 8 7 6 5 Mates With: BSTC TSHCR BSTCM TSHCRE BSTCR TSHCRSM BSTCRSM TSHR BSTS TSHRE LBSTCM TSHS LTSHCR TSHSCM LTSHCRE TSHSM LTSHR ULTSHSM LTSHRE ULTSHC LTSHSM ULTHSCR TSHC B Tails may be clipped to acheive specific dimensions. Products cut to specific sizes are uncancellable/ nonreturnable. Parts are subject to change without notice. .200 [5.08] UNLESS OTHERWISE SPECIFIED: A C Materials: Contact Material: Phosphor Bronze Insulator Material: Polyester, UL94V-0, LCP+30%G.F., Black Plating: Au or Sn over 50µ” (1.27) Ni 02 80 D Plating options -10µ Gold on Contact Area/ Flash on Tail -Matte Tin all Over -10µ Gold on Contact Area/ Matte Tin on Tail -30µ Gold on Contact Area/ Matte Tin on Tail -Gold Flash over Entire Pin - Gold Flash on Contact Area/ Matte Tin on Tail Specifications: Insertion Depth: .070[1.78] to .135[3.43] .102[2.59] for bottome entry Insertion Force- Per Contact- H Plating: 2oz.[0.56N] avg with .025[0.64mm] Sq. pin Withdrawal Force- Per Contact- H Plating: 1.6oz.[0.44N] avg. with .025[0.64mm] Sq. pin Current Rating: 3.0 Ampere Insulation Resistance: 1000M Ohms Min. Dielectric Withstanding: 600V AC Contact Resistance: 20M Ohms Max. Operation Temperature: -40°C to +105°C Max. Process Temperature Peak: 260°C up to 20 secs. Process: 230°C up to 30 secs. Reflow: 260°C up to 10 secs. .090[2.29] .260[6.60] B E A. Pins Per Row - 1 through 40 B. Row Specification - D= Dual Row C. Style - 02= Surface mount option - 04= Thru hole .100[2.54] option - 06= Thru hole .300[7.62] option D. Plating Options - See Plating Options below E. V= Vertical F. Polarized Position - Leave blank if not needed - If required, specify empty pin position - e.g. 012 for Pin 12 G. Packing Information (Only for 02 option) - TR= Tube and Reel - TB= Tube H. Pad - P= Plastic - K= Kapton - O= No Pad - If left blank, packaging at MLE's discretion Pad may be metal, mylar or plastic I. Alignment Pin ( Only for 02 option) - Leave blank if not needed - AP= With J. Lead Free .030 [0.76] .030 [0.76] 4 DIMENSIONS ARE IN INCHES TOLERENCES: ONE DECIMALS ±.100 TWO DECIMAL ±.100 THREE DECIMAL ±.005 FOUR DECIMAL ±.002 3 01/19/15 CHECKED GWE 01/19/15 A MFG APPR. INTERPRET GEOMETRIC TOLERANCING PER: MATERIAL USED ON APPLICATION DATE EOW ENG APPR. FINISH NEXT ASSY NAME DRAWN ADDRESS: 2533 Centennial Blvd. Jeffersonville, In 47130 Phone: 812-670-4174 Fax: 812-670-4175 E-Mail: mle@mlelectronics.com DO NOT SCALE DRAWING 2 TITLE: LSMBC-1 SERIES SIZE DWG. NO. REV C D SCALE 8:1 SHEET 1 OF 1 1