SSHS-502-D-02-T-LF

8 7 6 4 5 2 3 Recommended P.C. Board Layout SCALE 6:1 Single Row 1 (06) OPTION (04) OPTION 04 Option .050[1.27] F F .050[1.27] .050[1.27] .026[0.66] .079 [2.00] .228 [5.79] .038[0.97] .026 [0.65] Point of Contact .044[1.12] SSHS-5 XX - X - XX - XX - XXX - XX - X - XX - LF (A) (B) (C ) (D) (E) (F) (G) (H) (I) 06 Option E A. Pins Per Row - 1 through 40 B. Row Specification - S= Single Row - D= Double Row C. Mount Option - 04= Thru Hole - 06= Surface Mount D. Plating Options - See Plating Options below E. Polarized Position - Leave blank if not needed - If required, specify empty pin position - e.g. 012 for Pin 12 F. Packing Information - TR= Tape and Reel - TB= Tube G. Pad - P= Plastic - K= Kapton - O= No Pad - If left blank, packaging at MLE's discretion Pad may be metal, mylar or plastic H. Alignment Pin Option - Leave blank if not needed - AP= With I. Lead Free .050[1.27]X No. of Positions .169 [4.30] .071 [1.80] 01 D 40 .090 [2.30] .016[0.42] x .006[0.15] 80 02 .173 [4.40] G T GT H F FT .050 [1.27] C 79 01 (04) OPTION (06) OPTION .050[1.27]X No. of Spaces 02 B .122 [3.10] .181 [4.60] 79 UNLESS OTHERWISE SPECIFIED: .189 [4.80] PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF Major League Electronics. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF Major League Electronics IS PROHIBITED. 8 7 Plating options -10µ Gold on Contact Area/ Flash on Tail -Matte Tin all Over -10µ Gold on Contact Area/ Matte Tin on Tail -30µ Gold on Contact Area/ Matte Tin on Tail -Gold Flash over Entire Pin - Gold Flash on Contact Area/ Matte Tin on Tail 6 5 C B Tails may be clipped to acheive specific dimensions Products cut to specific sizes are uncancellable/ nonreturnable. Parts are subject to change without notice. .016 x .028 [0.41] [0.71] A D Materials: Contact Material: Phosphor Bronze Insulator Material: Nylon 6T Plating: Au or Sn over 50µ” (1.27) Ni 01 .050[1.27]X No. of Spaces - .050[1.27] .047 [1.19] Mates with: BSTC. BSTCM. BSTS. TBSTC. TBSTCM. TBSTS. TSHC. TSHR. TSHS. TSHSCM. TTSHC. TTSHR. TTSHS. TTSHSM. Specifications: Insertion Depth: .050[1.27] Min. Insertion Force- Per Contact- H Plating: 3.8oz. [1.05N] avg. with .016[0.41] Sq. pin Withdrawal Force- Per Contact- H Plating: 2.0oz. [0.65N] avg. with 0.16 [0.41] Sq. pin Current Rating: 1.5 Ampere Insulation Resistance: 1000M Ohms Min. Dielectric Withstanding: 300V AC Contact Resistance: 20M Ohms Max. Operation Temperature: -40°C to +105°C Max. Process Temperature Peak: 260°C up to 10 secs. Process: 230°C up to 60 secs. Wave: 260°C up to 6 secs. Reflow: 260°C up to 10 secs. Manual Solder: 350°C up to 5 secs. .050[1.27] 80 E 4 DIMENSIONS ARE IN INCHES TOLERENCES: ONE DECIMALS ±.100 TWO DECIMAL ±.100 THREE DECIMAL ±.005 FOUR DECIMAL ±.002 3 10/01/15 CHECKED GWE 10/01/15 A MFG APPR. INTERPRET GEOMETRIC TOLERANCING PER: MATERIAL USED ON APPLICATION DATE EOW ENG APPR. FINISH NEXT ASSY NAME DRAWN ADDRESS: 2533 Centennial Blvd. Jeffersonville, In 47130 Phone: 812-670-4174 Fax: 812-670-4175 E-Mail: mle@mlelectronics.com DO NOT SCALE DRAWING 2 TITLE: SSHS-5 SERIES SIZE DWG. NO. REV E C SCALE 12:1 SHEET 1 OF 1 1