TSHSCM-703-S-020-02-F-V-LF

8 7 6 4 5 2 3 1 Recommended P.C. Board Layout SCALE 8:1 Pin 1 Pin 1 F F .140 [3.55] .0394[1.00] .024[0.61] Pin 1 Single (M) Single (S) .095 [2.41] E E .235 [5.97] TSHSCM-7 XX - X - XX - XXX - XX - V - XXX - X - XX - X - XX - LF (A) (B) (C ) (D) (E) (F) (G) (H) (I) (J) (K) (L) APPLICATION .0394[1.00] .031 [0.80] A. Pins Per Row - 1 through 40 B. Row Specification - S= Single Row - D= Double Row C. Desired Post Height - Please Specify D. Pin Options - See Pin Options below E. Plating Options - See Plating Options below F. Vertical G. Polarized Position (Option only for the Double Row) - Leave blank if not needed - If required, specify empty pin position - e.g. 012 for Pin 12 H. Footprint (Option only for the Single Row) - S= Pin 1 right - M= Pin 1 left I. Packing Information - TR= Tape and Reel - TB= Tube J. Pad - P= Plastic - O= No Pad - If left blank, packaging at MLE’s discretion Pad may be metal, mylar or plastic K. Alignment Pin Option (Only available for the Double Row) - Leave blank if not needed - AP= With L. Lead Free .022[0.56] DOUBLE D .0394[1.00]X No. of Positions .011[0.27] 40 C 01 .039[1.00] POST .050 [1.27] .012[0.30] Sq. SINGLE (M) ROW .051 [1.29] .039[1.00] Plating options T -Matte Tin all Over F -Gold Flash over Entire Pin .0394[1.00]X No. of Spaces 01 B SINGLE (S) ROW .039 [1.00] A 01 .023 [0.60] .039 [1.00] UNLESS OTHERWISE SPECIFIED: 79 PROPRIETARY AND CONFIDENTIAL .205[5.20] 8 DOUBLE ROW 7 6 5 B Tails may be clipped to acheive specific dimensions. Products cut to specific sizes are uncancellable/ nonreturnable. Parts are subject to change without notice. .0394 .122 [1.00] [3.10] .051 [1.29] Pin Options Max. Post .075[1.90] 02 .100[2.54] 04 .150[3.81] 06 .200[5.08] 08 Materials: Contact Material: Phosphor Bronze Insulator Material: LCP, UL94V-0 80 02 C Specifications: Current Rating: 1.0 Ampere Insulation Resistance: 1000M Ohms Min. Dielectric Withstanding: 300V AC Contact Resistance: 20M Ohms Max. Operation Temperature: -40°C to +105°C Max. Process Temperature Wave Solder: Solder Temp 260 ±5°C Immersion period: 5 ±5 secs. Reflow Solder: Pre-Heat Temp: 100- 150°C for 60 secs max Temperature: min. 210°C for 30 secs max. Peak Temperature: 260 ±5°C, 10 ±5 secs. Manual Solder: 245 ±3°C 3-5 secs. .098[2.50] 40 D THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF Major League Electronics. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF Major League Electronics IS PROHIBITED. 4 DIMENSIONS ARE IN INCHES TOLERENCES: ONE DECIMALS ±.100 TWO DECIMAL ±.100 THREE DECIMAL ±.005 FOUR DECIMAL ±.002 3 01/14/15 CHECKED GWE 01/14/15 A MFG APPR. INTERPRET GEOMETRIC TOLERANCING PER: MATERIAL USED ON APPLICATION DATE EOW ENG APPR. FINISH NEXT ASSY NAME DRAWN ADDRESS: 2533 Centennial Blvd. Jeffersonville, In 47130 Phone: 812-670-4174 Fax: 812-670-4175 E-Mail: mle@mlelectronics.com DO NOT SCALE DRAWING 2 TITLE: TSHSCM-7-V SERIES SIZE DWG. NO. REV B C SCALE 12:1 SHEET 1 OF 1 1