MT4164S4-HR6-2-A

3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT4164S4-HR6-2-A 4.8mm ROUND LED LAMP WITH HOLDER MT4164S4-HR6-2-A Package Dimensions 4.8mm ROUND LED LAMP WITH HOLDER 7.0 0.70 11.3 4.1 12.0 0.5 4.8 1.6 2.70 26AWG 142 2 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted Description LED Chip Part No. Material GaAsP/GaP Emitting Color Hi-Effect Red Lens Color MT4164S4-HR6-2-A Red Diffused VER.: 01 Date: 2007/11/10 Page: 1/5 + _ MT4164S4-HR6-2-A Absolute Maximum Ratings at Ta=25 ℃ Parameter Power Dissipation Reverse Voltage D.C. Forward Current Peak Current(1/10Duty duty,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature(1.6mm from body) 4.8mm ROUND LED LAMP WITH HOLDER Symbol PD VR If If(Peak) Topr. Tstg. Tsol Rating 78 5 30 100 -25 to +85 -40 to +100 Unit mW V mA mA ℃ ℃ Dip Soldering: 260℃ for 5sec. Hand Soldering: 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Viewing Angle Spectrum Line Halfwidth Symbol IV Vf λp λd Ir 2θ1/2 Condition If=20mA If=20mA If=20mA If=20mA Vr=5V If=20mA If=20mA Min. 24.0 Typ. 40.0 2.1 642 629 Max. Unit mcd 2.6 V nm nm 100 38 35 µA deg nm ∆λ Note:The datas come from the SPEC. of LT6441R-81. VER.: 01 Date: 2007/11/10 Page: 2/5 MT4164S4-HR6-2-A 4.8mm ROUND LED LAMP WITH HOLDER Typical Electrical/Optical Characteristic Curves (25℃ Ambient Temperature Unless Otherwise Noted) 50 50 Forward Current IF(mA) Relative Luminous Intensity 40 30 20 10 40 30 20 10 0 1.2 1.6 2.0 2.4 2.8 3.2 0.0 10.0 20.0 30.0 Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE Forward Current (mA) FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 50 40 10° 20° 30° Forward Current IF(mA) 40° 30 1.0 20 10 0.9 0.8 50° 60° 70° 80° 90° 0.5 0.3 0.1 0.2 0.4 0.6 0 20 40 60 Temperature(。C) 80 100 0.7 FORWARD CURRENT VS. AMBIENT TEMPERATURE RADIATION DIAGRAM VER.: 01 Date: 2007/11/10 Page: 3/5 MT4164S4-HR6-2-A Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use 4.8mm ROUND LED LAMP WITH HOLDER Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) (2) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. Dip Soldering: Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/11/10 Page: 4/5