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SPECIFICATION
PART NO. : MT5470-UY 5.2×4.6mm OVAL LED LAMP
ATTENTION
OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES
MT5470-UY
Description
5.2×4.6mm OVAL LED LAMP
This yellow lamp is made with AlGaInP/Si chip and yellow diffused epoxy resin.
4.6 0.5 MAX.
5.2
2.54±0.1
A
1.5 TYP.
K
Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted.
Description
LED Chip Part No.
Material AlGaInP/Si Emitting Color Yellow
24.0 MIN.
7.8
Lens Color
MT5470-UY
Yellow diffused
VER.: 01 Date: 2007/03/22 Page: 1/5
MT5470-UY
Absolute Maximum Ratings at Ta=25℃
Parameter
Power Dissipation Reverse Voltage D.C. Forward Current Reverse (Leakage) Current Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature(1.6mm from body) Electrostatic discharge
5.2×4.6mm OVAL LED LAMP
Symbol
PD VR If Ir If(Peak) Topr Tstg Tsol ESD
Rating
130 5 50 100 200 -40 to +95 -40 to +100
Unit
mW V mA μA mA ℃ ℃
Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. 6000 V
Electrical and Optical Characteristics:
Parameter
Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse (Leakage) Current VERTICAL ViewingAngle HORIZONTAL Spectrum Line Halfwidth 2θ1/2 If=20mA If=20mA 70 15 nm
Symbol
IV Vf λp λd Ir 2θ1/2
Condition
If=20mA If=20mA If=20mA If=20mA Vr=5V If=20mA
Min.
770
Typ.
1300 2.1 591
Max.
Unit
mcd
2.6
V nm
584
589
596 100
nm µA
40 deg
∆λ
Notes:1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome.
VER.: 01 Date: 2007/03/22 Page: 2/5
MT5470-UY
5.2×4.6mm OVAL LED LAMP
Typical Electrical / Optical Characteristics Curves :
Relative Luminous Intensity(mcd)
50 40 30 20 10
2000 1600 1200 800 400
Forward Current IF(mA)
1.2
1.6
2.0
2.4
2.8
3.2
0.0
10.0
20.0
30.0
Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE
Forward Current (mA)
FORWARD CURRENT VS. LUMINOUS INTENSITY
100 80
R j-pin=240℃/W
HORIZONTAL
0°
10°
20° 30°
VERTICAL
Forward Current IF(mA)
60
40° 1.0 50° 60° 70° 80° 90° 0.5 0.3 0.1 0.2 0.4 0.6
40 20
R j-a=500 ℃/W
0.9 0.8
0
20 40 60 Temperature (℃)
80
100
0.7
FORWARD CURRENT VS. AMBIENT TEMPERATURE
RADIATION DIAGRAM
VER.: 01 Date: 2007/03/22 Page: 3/5
MT5470-UY
Specifications for Bin Grading: Iv(mcd) BIN S T U MIN. 770 1100 1520
5.2×4.6mm OVAL LED LAMP
MAX. 1100 1520 2130
Specifications for Vf Group: Vf(V) Group V1 V2 V3 V4 V5 MIN. 1.6 1.8 2.0 2.2 2.4 MAX. 1.8 2.0 2.2 2.4 2.6
*Majority VF bins are highlighted in Yellow.
Specifications for Wavelength Group: λD(nm) @20mA Group X2 X3 X4 X5 MIN. 584 587 590 593 MAX. 587 590 593 596
VER.: 01 Date: 2007/03/22 Page: 4/5
MT5470-UY
5.2×4.6mm OVAL LED LAMP
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) (2) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) 3. 4. Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds.
Insertion Pitch of the LED leads and pitch of mounting holes need to be same. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature.
VER.: 01 Date: 2007/03/22 Page: 5/5
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