MT5470B-OR

3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT5470B-OR 5.2×4.6mm OVAL LED LAMP ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES MT5470B-OR Description 5.2×4.6mm OVAL LED LAMP This amber lamp is made with AlGaInP/GaAs chip and white diffused epoxy resin. 4.6 0.5 MAX. 5.2 2.54±0.1 A 1.5 TYP. K Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Description LED Chip Part No. Material AlGaInP/GaAs Emitting Color Amber 24.0 MIN. 7.8 Lens Color MT5470B-OR White diffused VER.: 01 Date: 2007/10/25 Page: 1/5 MT5470B-OR Absolute Maximum Ratings at Ta=25℃ Parameter Power Dissipation Reverse Voltage D.C. Forward Current Reverse (Leakage) Current Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature(1.6mm from body) 5.2×4.6mm OVAL LED LAMP Symbol PD VR If Ir If(Peak) Topr. Tstg. Tsol. Rating 125 5 50 100 200 -40 to +95 -40 to +100 Unit mW V mA μA mA ℃ ℃ Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse (Leakage) Current VERTICAL ViewingAngle HORIZONTAL Spectrum Line Halfwidth 2θ1/2 If=20mA If=20mA 60 17 nm Symbol IV Vf λp λd Ir 2θ1/2 Condition If=20mA If=20mA If=20mA If=20mA Vr=5V If=20mA Min. 770 Typ. 1100 1.9 610 Max. Unit mcd 2.5 V nm 600 605 609 100 nm µA 30 deg ∆λ Notes: 1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2007/10/25 Page: 2/5 MT5470B-OR 5.2×4.6mm OVAL LED LAMP Typical Electrical / Optical Characteristics Curves : 50 40 30 20 10 2500 Relative Luminous Intensity 1.6 2.0 2.4 2.8 3.2 Forward Current IF(mA) 2000 1500 1000 500 20.0 1.2 0.0 10.0 30.0 Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE Forward Current (mA) FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 100 80 R j-pin=220℃/W HORIZONTAL 10° 20° 30° VERTICAL Forward Current IF(mA) 40° 1.0 50° 60° 70° 80° 90° 0.5 0.3 0.1 0.2 0.4 0.6 60 40 20 R j-a=450 ℃/W 0.9 0.8 0.7 0 20 40 60 Temperature (℃) 80 100 FORWARD CURRENT VS. AMBIENT TEMPERATURE RADIATION DIAGRAM VER.: 01 Date: 2007/10/25 Page: 3/5 MT5470B-OR 5.2×4.6mm OVAL LED LAMP Specifications for Bin Grading: Iv(mcd) BIN S T U MIN. 770 1100 1520 MAX. 1100 1520 2130 Specifications for Vf Group: Vf(V) Group V1 V2 V3 V4 V5 MIN. 1.6 1.8 2.0 2.2 2.4 MAX. 1.8 2.0 2.2 2.4 2.6 *Majority VF bins are highlighted in Yellow. Specifications for Wavelength Group: λD(nm) @20mA Group X2 X3 X4 MIN. 600 603 606 MAX. 603 606 609 VER.: 01 Date: 2007/10/25 Page: 4/5 MT5470B-OR Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use 5.2×4.6mm OVAL LED LAMP Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) (2) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/10/25 Page: 5/5