MT5470E-UR

3 Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : 0T(-85 5.2×4.6mm OVAL LED LAMP ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 5.2×4.6mm OVAL LED LAMP 0T7(-85 Description This hyper red lamp is made with AlGaInP/GaP chip and red diffused epoxy resin. 5.2 24.0 MIN. 1.5 TYP. 7.8 0.5 MAX. 4.6 2.54±0.1 A K Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Description LED Chip Part No. 07(85 Material Emitting Color AlGaInP/GaP Hyper red VER.: 01 Lens Color Red diffused Date: 2012/12/19 Page: 1/5 5.2×4.6mm OVAL LED LAMP 0T7(-85 Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 130 mW Reverse Voltage VR 5 V D.C. Forward Current If 50 mA Reverse (Leakage) Current Ir 100 μA If(Peak) 200 mA Operating Temperature Range Topr -40to +95 ℃ Storage Temperature Range Tstg -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity IV If=20mA 2130 2300 Forward Voltage Vf If=20mA 1.8 Peak Wavelength λp If=20mA Dominant Wavelength λd If=20mA Reverse (Leakage) Current Ir Vr=5V 2θ1/2 If=20mA Vertical Max. mcd 2.4 632 618 625 Unit V nm 630 nm 100 µA 40 Viewing Angle deg Horizontal Spectrum Line Halfwidth 2θ1/2 If=20mA 70 ∆λ If=20mA 20 nm Notes:1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2012/12/19 Page: 2/5 5.2×4.6mm OVAL LED LAMP 0T7(-85 Typical Electrical / Optical Characteristics Curves : Relative Luminous Intensity(mcd) Forward Current IF(mA) 50 40 30 20 10 1.2 1.6 2.0 2.4 2.8 5000 4000 3000 2000 1000 3.2 0.0 FORWARD CURRENT VS.APPLIED VOLTAGE 30.0 FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 100 Forward Current IF(mA) 20.0 10.0 Forward Current (mA) Applied Voltage (V) 20° 10° 30° HORIZONTAL 80 VERTICAL R j-pin=250℃/W 40° 60 1.0 50° 0.9 40 60° 0.8 70° 80° 90° 20 R j-a=520 ℃/W 0.7 0 20 40 60 Temperature (℃) 80 100 FORWARD CURRENT VS. AMBIENT TEMPERATURE 0.5 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM VER.: 01 Date: 2012/12/19 Page: 3/5 0T7(-85 5.2×4.6mm OVAL LED LAMP Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. V 2130 3000 W 3000 4180 Specifications for Vf Group: Vf(V) Group MIN. MAX. V2 1.8 2.0 V3 2.0 2.2 V4 2.2 2.4 VER.: 01 Date: 2012/12/19 Page: 4/5 0T7(-85 5.2×4.6mm OVAL LED LAMP Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2012/12/19 Page: 5/5