MTB10000-PG-A

3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MTB10000-PG-A 10 SEGMENT LIGHT BAR MTB10000-PG-A Dimensions 22.86 1.78 8.0 10 SEGMENT LIGHT BAR 0.25 5.08 10.16 7.62 2.54 25.27 MARK 0.5 3.5 MIN. 2.54X9=22.86 Notes: 1. The slope angle of any PIN may be ±5.0° Max. 2. All dimensions are in mm, tolerance is ±0.25mm unless otherwise noted. Internal Circuit Diagram MTB10000-PG-A PIN. 1 2 3 4 5 6 7 8 9 10 A B C D E F G H I J PIN. 20 19 18 17 16 15 14 13 12 11 VER.: 01 Date: 2007/10/04 Page: 1/5 MTB10000-PG-A 10 SEGMENT LIGHT BAR Description LED Chip Part No. Material Emitting Color Face Color Surface Segments MTB10000-PG-A GaAsP/GaP Green Grey White Absolute Maximum Ratings at Ta=25 ℃ Parameter Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip Reverse (Leakage)Current Per Chip Reverse Voltage Per Chip Operating Temperature Range Storage Temperature Range Soldering Temperature. Symbol PD IFP IF Ir VR Topr. Tstg. Tsol. Rating 78 100 30 100 5 -25 to +85 -40 to +100 Unit mW mA mA uA V ℃ ℃ Dip Soldering: 260℃ for 5 sec. Hand Soldering: 350℃ for 3 sec. VER.: 01 Date: 2007/10/04 Page: 2/5 MTB10000-PG-A Electrical and Optical Characteristics: Parameter Luminous Intensity Per Segment Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Per Chip (Leakage Current Per Chip) Spectrum Line Halfwidth Response Time 10 SEGMENT LIGHT BAR Symbol IV Vf λp λd Ir Condition If=10mA/seg. If=20mA/seg. If=20mA/seg. If=20mA/seg. Vr=5V If=20mA/seg. ----------- Min. 1.15 Typ. 3.4 2.1 555 562 Max. Unit mcd 2.6 V nm nm 100 25 250 µA nm ns ∆λ T Note: Customer’s special requirements are also welcome. VER.: 01 Date: 2007/10/04 Page: 3/5 MTB10000-PG-A Typical Electrical/Optical Characteristic Curves (25℃ Ambient Temperature Unless Otherwise Noted) Ratio of Maximum Operating Peak Current to Temperature Derated DC Current 1.0 10 SEGMENT LIGHT BAR 100 Relative Intensity OPERATION IN THIS REGION REOUIRES TEMPERATURE DERATING OF IDC MAXIMUM 0.5 10 IF PEAK IDC MAX 0 10 KH 10 HZ 1K H 3K 0 30 HZ HZ Z 495 565 635 705 1 1 Wavelength (nm) 10 1000 100 tp - Pulse Duration - μs Fig.1 RELATIVE INTENSITY VS. WAVELENGTH 50 Forward Current IF(mA) Fig.2 MAXIMUM TOLERABLE PEAK CURRENT VS. PULSE DURATION Z 10000 50 Forward Current IF(mA) 40 30 20 10 40 30 20 10 0 20 40 60 80 100 1.6 1.8 2.0 2.2 2.4 Forward Voltage VF(V) 2.6 Fig .3 FORWARD CURRENT VS. FORWARD VOLTAGE PER CHIP Ambient Temperature Ta (°C) Fig.4 FORWARD CURRENT VS. DERATING CURVE 10 Relative Luminous Intensity Normalized at 10mA Relative Luminous Intensity 8 6 4 2 2.0 1.0 0.5 0.2 0.1 -30 -20 -10 0 10 20 30 40 50 60 70 0 10 20 30 40 Forward Current (mA) Fig.5 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Ambient Temperature Ta (°C) Fig.6 LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE VER.: 01 Date: 2007/10/04 Page: 4/5 MTB10000-PG-A Precautions in Use: 10 SEGMENT LIGHT BAR PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO DEVICE TO HIGH RELIABILITY 1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip. When bending is unavoidable, strictly follow the cautionary instruction below. (1)Bend the leads before soldering. (2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part. (3) The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)When a pin is tested for its endurance, bending degree should be 45∘and repeated no more than two times. 2. Setting a product by using tool such as a holder should be avoided. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc. 3. The hole pitch of a circuit board must fit into the lead pitch of products. 4. When soldering, care the followings: (1)Do not heat a product under any stress (i.e.: twist) to leads. (2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part. (3 The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)Soldering with PC Board should be conducted with following conditions. (a) For dip soldering Pre-heating : 90℃ Max. for within 60 Sec. Soldering Max. : 260±5℃(Solder Temp.) for within 5 Sec. (b) Soldering iron : 350℃(Soldering iron tip) for within 3 Sec. 5. Flux could corrode the leads.Use flux that contains as little chlorine as possible (RA, RMA, less than 0.2 wt%) and need not be washed way. When, however, washing is necessary, partially wash around the leads, instead of the entire LED, by the following conditions. Cleaning agent : Methyl Alcohol Cleaning temp : 45℃Max. Cleaning time : 30Sec. Max. 6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion. 7. The following may damage products or LED chips: Attachment or contact of residual flux solvent onto the product surface or to LED chips, or invasion of the same into the product. VER.: 01 Date: 2007/10/04 Page: 5/5