DISCONTINUED MAR 2009 TB62725BPG/BFG/BFNG
TOSHIBA BiCMOS Integrated Circuit Silicon Monolithic
TB62725BPG, TB62725BFG, TB62725BFNG
8bit ConstantCurrent LED Driver of the 3.3V and 5V Power Supply Voltage Operation
The TB62725BPG/BFG/BFNG are comprised of constantcurrent drivers designed for LEDs and LED displays. The output current value can be set using an external resistor. As a result, all outputs will have virtually the same current levels. This driver incorporates an 8bit constantcurrent output, an 8bit shift register, an 8bit latch circuit and an 8bit ANDgate circuit. These drivers have been designed using the BiCMOS process. This devices are a product for the Pb free.
TB62725BPG
Features
Output current capability and number of outputs: 90 mA × 8 outputs Constant current range: 5 to 80 mA Application output voltage: 0.7 V (output current 5 to 80 mA) 0.4 V (output current 5 to 40 mA) For anodecommon LEDs Input signal voltage level: 3.3V and 5V CMOS level (Schmitt trigger input) Maximum output terminal voltage: 17 V Serial data transfer rate: 20 MHz (max, cascade connection) Operating temperature range: Topr = −40 to 85°C Package: Type BPG: Type BFG: Type BFNG: DIP16P3002.54A SSOP16P2251.00A SSOP16P2250.65B
TB62725BFG
TB62725BFNG
Package and pin layout: Pin layout and functionality are similar to those of the TB62705C series and TB62725A series. (Each characteristic value is different.) Constantcurrent accuracy (all outputs on)
Output Voltage > = 0.4 V > = 0.7 V Current Error between Bits ±6% Current Error between ICs ±15% Output Current 5 to 40 mA 5 to 90 mA
Weight DIP16P3002.54A: 1.11 g (typ.) SSOP16P2251.00A: 0.14 g (typ.) SSOP16P2250.65B: 0.07 g (typ.)
Company Headquarters 3 Northway Lane North Latham, New York 12110 Toll Free: 800.984.5337 Fax: 518.785.4725
Web: www.marktechopto.com | Email: info@marktechopto.com
California Sales Office: 950 South Coast Drive, Suite 225 Costa Mesa, California 92626 Toll Free: 800.984.5337 Fax: 714.850.9314
TB62725BPG/BFG/BFNG
Pin Assignment (top view)
Pin layout and functionality are similar to those of the TB62705C. (each characteristic value is different.)
GND SERIALIN CLOCK LATCH OUT0 OUT1 OUT2 OUT3 VDD REXT SERIALOUT ENABLE OUT7 OUT6 OUT5 OUT4
Block Diagram
OUT0
OUT1
OUT7
REXT
IREG
ENABLE Q L D LATCH Q L D L Q D
SERIALIN
D Q CK
D Q CK
D Q CK
SERIALOUT
CLOCK
Truth Table
CLOCK LATCH H L H X X ENABLE L L L L H SERIALIN Dn Dn + 1 Dn + 2 Dn + 3 Dn + 3 OUT0 OUT5 OUT7 Dn Dn - 5 Dn - 7 No change Dn + 2 Dn - 3 Dn - 5 Dn + 2 Dn - 3 Dn - 5 Off SERIALOUT Dn - 7 Dn - 6 Dn - 5 Dn - 5 Dn - 5
Note 1: OUT0 to OUT7 = On when Dn = H; to OUT0 to OUT7 = Off when Dn = L. In order to ensure that the level of the power supply voltage is correct, an external resistor must be connected between REXT and GND.
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Timing Diagram
n = 0 CLOCK
1
2
3
4
5
6
7
3.3 V/5 V 0 V 3.3 V/5 V
SERIALIN 0 V 3.3 V/5 V LATCH 0 V 3.3 V/5 V 0 V On OUT0 Off Off Off Off On
ENABLE
OUT1
Off
On
Off Off On
OUT3
Off
Off
Off Off
On OUT7 Off On Off Off 3.3 V/5 V SERIALOUT 0 V
Warning: Latch circuit is leveledlatch circuit. Be careful because it is not triggeredlatch circuit. Note 2: The latches circuit holds data by pulling the LATCH terminal Low. And, when LATCH terminal is a highlevel, latch circuit doesn’t hold data, and it passes from the input to the output. When ENABLE terminal is a lowlevel, output terminal OUT0 to OUT7 respond to the data, and on and off does. Attention: This IC can be used in 3.3 V or 5.0 V. However, use the VDD power supply and the input level in the same voltage system.
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Terminal Description
Pin No. 1 2 3 4 Pin Name GND SERIALIN CLOCK LATCH OUT0 to OUT7 GND terminal for control logic. Input terminal for serial data for data shift register. Input terminal for clock for data shift on rising edge. Input terminal for data strobe. When the LATCH input is driven High, data is latched. When it is pulled Low, data is hold. Constantcurrent output terminals. Input terminal for output enable. 13 ENABLE All outputs ( OUT0 to OUT7 ) be turned off, when the ENABLE terminal is driven High. And are turned on, when the terminal is driven Low. 14 15 16 SERIALOUT REXT VDD Output terminal for serial data input on SERIALIN terminal. Input terminal used to connect an external resistor. This regulated the output current. 3.3V and 5V supply voltage terminal. Function
5 to 12
Equivalent Circuits for Inputs and Outputs
ENABLE Terminal
R (UP) VDD 200 kW
LATCH Terminal
VDD
100 W GND
GND
R (DOWN)
CLOCK, SERIALIN Terminal
VDD
SERIALOUT Terminal
VDD
CLOCK, SERIALIN
250 kW
ENABLE
LATCH
100 W
100 W
SERIALOUT 100 W
GND
GND
OUT0 to OUT7 Terminals
OUT0 to OUT7 Parasitic Diode GND
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Maximum Ratings (Topr = 25°C)
Characteristics Supply voltage Input voltage Output current Output voltage BPGtype (when not mounted) BFG/BFNGtype (when not mounted) BFG/BFNGtype (on PCB) BPGtype (when not mounted) BFG/BFNGtype (when not mounted) BFG/BFNGtype (on PCB) Symbol VDD VIN IOUT VOUT Pd1 Rating 6 -0.2 to VDD + 0.2 90 -0.2 to 17 1.47 0.37 Pd2 0.78 Rth (ja) 1 Rth (ja) 2 Rth (ja) 3 Topr Tstg 85 330 160 -40 to 85 -55 to 150 °C °C °C/W W Unit V V mA/ch V
Power dissipation (Note 3)
Thermal resistance (Note 3)
Operating temperature Storage temperature
Note 3: BPGtype: Power dissipation is delated by 11.76 mW/°C if device is mounted on PCB and ambient temperature is above 25°C. BFG and BFNGtype: Power dissipation is delated by 7.69 mW/°C if device is mounted on PCB and ambient temperature is above 25°C. With device mounted on glassepoxy PCB of less than 40% Cu and of dimensions 50 mm ´ 50 mm ´ 1.6 mm
Recommended Operating Conditions (Topr = -40°C to 85°C unless otherwise specified)
Characteristics Supply voltage Output voltage Symbol VDD VOUT IOUT Output current IOH IOL VIH Input voltage VIL Clock frequency LATCH pulse width ENABLE pulse width (Note 4) CLOCK pulse width S etup time for CLOCK terminal H old time for CLOCK terminal S etup time for LATCH terminal t w ENABLE twCLOCK tSETUP1 tHOLD tSETUP2 ¾ 10 50 ¾ ¾ ¾ ¾ fCLK t w LATCH IOUT > 20 mA = IOUT < 20 mA Cascade Connected ¾ ¾ Each DC 1 circuit SERIALOUT SERIALOUT Test Condition ¾ ¾ Min 3 ¾ 5 ¾ ¾ 0.7 ´ VDD -0.15 ¾ 50 2000 3000 25 10 0.7 ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ Typ. Max 5.5 4 80 -1 1 VDD + 0.15 0.3 ´ VDD 20 ¾ ¾ ¾ ¾ ¾ ns MHz ns ns Unit V V mA/ch mA
mA
Note 4: When the pulse of the low level is inputted to the ENABLE terminal held in the high level.
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Electrical Characteristics (VDD = 5 V, Ta = 25°C unless otherwise specified)
Characteristics Supply voltage Symbol VDD IOUT1 IOUT2 Output current IOUT3 IOUT4 DIOUT1 DIOUT2 Output leakage current IOZ VIH Input voltage VIL SOUT terminal VOL ¾ IOH = 1.0 mA, VDD = 3.3 V IOH = 1.0 mA, VDD = 5 V IOL = -1.0 mA, VDD = 3.3 V IOH = 1.0 mA, VDD = 5 V VDD = 3 V ® 5.5 V ENABLE terminal LATCH terminal VOUT = 15.0 V VOUT = 15.0 V, All outputs OFF VOUT = 15.0 V, All outputs OFF VOUT = 0.7 V, All outputs ON REXT = OPEN REXT = 490 W REXT = 250 W REXT = 490 W Test Condition Normal operation VOUT = 0.4 V, VDD = 3.3 V VOUT = 0.4 V, VDD = 5 V VOUT = 0.7 V, VDD = 3.3 V VOUT = 0.7 V, VDD = 5 V VOUT = 0.4 V, All outputs ON VOUT = 0.7 V, All outputs ON VOUT = 15 V ¾ REXT = 490 W REXT = 250 W REXT = 490 W REXT = 250 W REXT = 490 W REXT = 250 W Min 4.5 29.84 29.58 58.40 57.55 ¾ ¾ ¾ 0.7 VDD GND ¾ ¾ 3 4.7 ¾ 100 125 ¾ 1 3 ¾ ¾ ¾ REXT = 250 W ¾ ¾ 29 Typ. 5 35.10 34.80 68.70 67.70 ±1.5 ±1.5 1 ¾ ¾ ¾ ¾ ¾ ¾ ±1.5 200 250 0.1 3 6 6 ¾ 12 Max 5.5 40.36 40.02 mA 79.00 77.85 ±6 % ±6 5 VDD V 0.3 VDD 0.3 V 0.3 ¾ ¾ ±5.0 400 500 0.5 5 8 9 15 17 mA % kW kW V m A Unit V
Output current Error between bits
Output voltage Output current Supply voltage Regulation Pullup resistor Pulldown resistor
VOH
%/VDD R (Up) R (Down) IDD (OFF) 1 IDD (OFF) 2 IDD (OFF) 3
Supply current IDD (ON) 1
Same as the above, Topr = -40°C VOUT = 0.7 V, All outputs ON Same as the above, Topr = -40°C
IDD (ON) 2
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Switching Characteristics (Topr = 25°C unless otherwise specified)
Characteristics Symbol Test Condition CLK to OUTn , LATCH = “H”, ENABLE = “ L” LATCH to OUTn , ENABLE = “ L” ENABLE to OUTn , LATCH = “ H” CLK to SERIAL OUT CLK to OUTn , LATCH = “H”, ENABLE = “ L” LATCH to OUTn , ENABLE = “ L” ENABLE to OUTn , LATCH = “ H” CLK to SERIAL OUT 10 to 90% of voltage waveform 90 to 10% of voltage waveform Cascade connection isn’t guarantee. (Note 5) ¾ ¾ ¾ 2 40 40 ¾ ¾ ¾ ¾ ¾ 2 Min Typ. Max Unit
tpLH1 tpLH2 tpLH3 Propagation delay time tpLH tpHL1 tpHL2 tpHL3 tpHL Output rise time Output fall time Maximum clock rise time Maximum clock fall time tor tof tr tf
150 140 140 5 170 170 170 5 85 70 ¾ ¾
300 300 300 ¾ 340 340 340 ¾ 150 150 5 5 ns ns us us ns
Conditions: (refer to test circuit.) Topr = 25°C, VDD = VIH = 5 V, VOUT = 0.7 V, VIL = 0 V, REXT = 490 W, VL = 5.0 V, RL = 100 W, CL = 10.5 pF Note 5: If the device is connected in a cascade and tr/tf for the waveform is large, it may not be possible to achieve the timing required for data transfer. Please consider the timings carefully.
Test Circuit
IDD
VIH , VHL
ENABLE CLOCK
VDD
RL OUT0 CL
Function generator
IOL LATCH SERIALIN SERIALOUT REXT GND CL Iref VL OUT7
Logic input waveform
VDD = VIH = 5 V VIL = 0 V tr = tf = 10 ns (10% to 90%)
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Timing Waveforms
1. CLOCK, SERIALIN, SERIALOUT
twCLK CLOCK 50% tSETUP1 SERIALIN 50% tHOLD SERIALOUT 50% tpLH/tpHL 50% 50%
2. CLOCK, SERIALIN, LATCH , ENABLE , OUTn
CLOCK
50%
SERIALIN tSETUP2 LATCH 50% twLAT ENABLE tSETUP3 50% 50% twENA 50%
OUTn tpHL1/LH1 tpHL2/LH2
50%
tpHL3/LH3
3. OUTn
90% OUTn 10% tof 10% tof ON 90% OFF
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Output Current – Duty (LED turnon rate)
IOUT – DUTY On PCB ( recommended )
100 100
IOUT – DUTY On PCB (recommended)
80
80
IOUT (mA)
40
IOUT (mA)
BFG/BFNG BPG 40 60 80 100
60
60
40
Topr = 25°C 20 VDD = 5.0 V VCE = 1.0 V Tj = 120°C (max) 0 0 20
Topr = 55°C 20 VDD = 5.0 V VCE = 1.0 V Tj = 120°C (max) 0 0 20 40 60
BFG/BFNG BPG 80 100
DUTY – Turn on rate (%)
DUTY – Turn on rate (%)
Pd –Topr
1.6 100 1.4
IOUT – DUTY On PCB (recommended)
Power dissipation PD (W/IC)
1.2 BPG (Free air) 1.0
80
IOUT (mA)
60
0.8 0.6 0.4 0.2 0 0 BFG/BFNG (mounted PCB)
40
Topr = 85°C 20 VDD = 5.0 V VCE = 1.0 V 20 40 60 80 100 Tj = 120°C (max) 0 0 20 40 60
BFG/BFNG BPG
80
100
Ambient temperature Ta (°C)
DUTY – Turn on rate (%)
IOUT – REXT
90 IOUT (mA) = (1.15 ¸ REXT (W)) ´ 14.9 80 70 60
IOUT (mA)
50 40 Topr = 25°C 30 20 10 VCE = 0.7 V 0 100
500
1000
5000
10000
REXT (W )
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Application Circuit (example 1): The general composition in static lighting of LED.
More than VLED (V) > Vf (total max) +0.7 is recommended with the following application circuit with the LED power supply VLED. = r1: The setup resistance for the setup of output current of every IC. r2: The variable resistance for the brightness control of every LED module.
Example) TD62M8600: 8bit multichip PNP transistor array, which is not used in static lighting system.
VLED
SCAN O1 SERIALIN C.U. ENABLE LATCH CLOCK TB62725BPG/BFG/BFNG 8bit SIPO, Latches and Constantsinkcurrent drivers O2 O5 O6 O7 SERIALOUT SERIALIN ENABLE LATCH CLOCK TB62725BPG/BFG/BFNG 8bit SIPO, Latches and Constantsinkcurrent drivers O1 O2 O5 O6 O7 SERIALOUT
r2
r1 = 100 W (min)
10
r1 = 100 W (min)
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Application Circuit (example 2): When the condition of VLED is VLED > 17 V.
The unnecessary voltage is one effective technique as to making the voltage descend with the zennor diode.
Example) TD62M8600: 8bit multichip PNP transistor array, which is not used in static lighting system.
VLED
SCAN O1 SERIALIN C.U. ENABLE LATCH CLOCK TB62725BPG/BFG/BFNG 8bit SIPO, Latches and Constantsinkcurrent drivers O2 O5 O6 O7 SERIALOUT SERIALIN ENABLE LATCH CLOCK TB62725BPG/BFG/BFNG 8bit SIPO, Latches and Constantsinkcurrent drivers O1 O2 O5 O6 O7 SERIALOUT
r2
r1 = 100 W
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r1 = 100 W
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Application Circuit (example 3): When the condition of VLED is Vf + 0.7 < VLED < 17 V.
VOUT = VLED - Vf = 0.7 to 1.0 V is the most suitable for VOUT. Surplus VOUT causes an IC fever and the useless consumption electric power. It is the one way of being effective to build in the r3 in this problem. r3 can make a calculation to the formula r3 (ohms) = surplus VOUT/IOUT. Though the resistance parts increase, the fixed constant current performance is kept.
Example) TD62M8600: 8bit multichip PNP transistor array, which is not used in static lighting system.
r3
r3
VLED = 15 V
SCAN O1 SERIALIN C.U. ENABLE LATCH CLOCK
O2
O5
O6
O7 SERIALOUT SERIALIN ENABLE LATCH
O1 O2
O5 O6 O7 SERIALOUT
8bit SIPO, Latches and Constantsinkcurrent drivers
8bit SIPO, Latches and Constantsinkcurrent drivers
TB62725BPG/BFG/BFNG
CLOCK
TB62725BPG/BFG/BFNG
r2
r1 = 100 W
12
r1 = 100 W
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Notes
Operation may become unstable due to the electromagnetic interference caused by the wiring and other phenomena. To counter this, it is recommended that the IC be situated as close as possible to the LED module. If overvoltage is caused by inductance between the LED and the output terminals, both the LED and the terminals may suffer damage as a result. There is only one GND terminal on this device when the inductance in the GND line and the resistor are large, the device may malfunction due to the GND noise when output switching by the circuit board pattern and wiring. To achieve stable operation, it is necessary to connect a resistor between the REXT terminal and the GND line. Fluctuation in the output waveform is likely to occur when the GND line is unstable or when a capacitor (of more than 50 pF) is used. Therefore, take care when designing the circuit board pattern layout and the wiring from the controller. This application circuit is a reference example and is not guaranteed to work in all conditions. Be sure to check the operation of your circuits. This device does not include protection circuits for over voltage, over current or over temperature. If protection is necessary, it must be incorporated into the control circuitry. The device is likely to be destroyed if a shortcircuit occurs between either of the power supply pins and any of the output terminals when designing circuits, pay special attention to the positions of the output terminals and the power supply terminals (VDD and VLED), and to the design of the GND line.
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Package Dimensions
Weight: 1.11 g (typ.)
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Package Dimensions
Weight: 0.14 g (typ.)
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Package Dimensions
Weight: 0.07 g (typ.)
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About solderability, following conditions were confirmed Solderability Use of Sn63Pb solder Bath ∙ solder bath temperature = 230°C ∙ dipping time = 5 seconds ∙ the number of times = once ∙ use of Rtype flux Use of Sn3.0Ag0.5Cu solder Bath ∙ solder bath temperature = 245°C ∙ dipping time = 5 seconds ∙ the number of times = once ∙ use of Rtype flux
RESTRICTIONS ON PRODUCT USE
000707EBA
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. The information contained herein is subject to change without notice.
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