MAS6179

DA6179.000 22 January, 2007 MAS6179 This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. AM Receiver IC • Tri Band Receiver IC • High Sensitivity • Very Low Power Consumption • Wide Supply Voltage Range • Power Down Control • Control for AGC On • High Selectivity by Crystal Filter • Fast Startup Feature DESCRIPTION The MAS6179 AM-Receiver chip is a highly sensitive, simple to use AM receiver specially intended to receive time signals in the frequency range from 40 kHz to 100 kHz. Only a few external components are required for time signal receiving. The circuit has preamplifier, wide range automatic gain control, demodulator and output comparator built in. The output signal can be processed directly by an additional digital circuitry to extract the data from the received signal. The control for AGC (automatic gain control) can be used to switch AGC on or off if necessary. MAS6179 supports up to three frequency band operation by switching between three crystal filters and two additional antenna tuning capacitors. MAS6179 has differential input and two internal compensation capacitor options for compensating shunt capacitances of different crystals (See ordering information on page 10). FEATURES • • • • • • • • • • • Tri Band Receiver IC Highly Sensitive AM Receiver, 0.4 µVRMS typ. W ide Supply Voltage Range from 1.1 V to 3.6 V Very Low Power Consumption Power Down Control Fast Startup Only a Few External Components Necessary Control for AGC On W ide Frequency Range from 40 kHz to 100 kHz High Selectivity by Quartz Crystal Filter Differential Input APPLICATIONS • Multi Band Time Signal Receiver WWVB (USA), JJY (Japan), DCF77 (Germany), MSF (UK), HBG (Switzerland) and BPC (China) BLOCK DIAGRAM VDD QO3 RFIP VDD QO2 QO1 QI AON Demodulator & Comparator OUT AGC Amplifier RFIM RFI2 RFI3 Power Supply/Biasing VDD VSS PDN1 PDN2 AGC DEC 1 (10) DA6179.000 22 January, 2007 PAD LAYOUT MAS6179Ax, x=1, 2 VDD QO2 QO1 QO3 QI AGC PDN2 OUT VSS RFI2 RFIM RFIP RFI3 PDN1 AON DEC 1420 µm DIE size = 1.42 x 1.80 mm; rectangular PAD 80 µm x 80 µm Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left floating. Please make sure that VSS is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die. Pad Identification Power Supply Voltage Quartz Filter Output for Crystal 2 Quartz Filter Output for Crystal 1 Quartz Filter Output for Crystal 3 Quartz Filter Input for Crystals AGC Capacitor Power Down/Frequency Selection Input 2 Receiver Output Demodulator Capacitor AGC On Control Power Down/Frequency Selection Input 1 Receiver Input 3 (for Antenna Capacitor 3) Positive Receiver Input Negative Receiver Input Receiver Input 2 (for Antenna Capacitor 2) Power Supply Ground Name VDD QO2 QO1 QO3 QI AGC PDN2 OUT DEC AON PDN1 RFI3 RFIP RFIM RFI2 VSS X-coordinate 154 µm 154 µm 154 µm 154 µm 154 µm 154 µm 154 µm 154 µm 1266 µm 1266 µm 1266 µm 1266 µm 1266 µm 1266 µm 1266 µm 1266 µm Y-coordinate 1580 µm 1393 µm 1207 µm 1021 µm 835 µm 648 µm 462 µm 276 µm 276 µm 462 µm 648 µm 835 µm 1021 µm 1207 µm 1393 µm 1580 µm Note 1800 µm 1 2 3 1 4 4 Notes: 1) PDN1 = PDN2 = VDD means receiver off - Fast start-up is triggered when the receiver is after power down controlled to power up 2) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated) - the output is a current source/sink with |IOUT| > 5 µA - at power down the output is pulled to VSS (pull down switch) 3) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 µA which is switched off at power down 4) Receiver inputs RFIP and RFIM have both 600 kΩ biasing resistors towards VDD 2 (10) DA6179.000 22 January, 2007 ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Power Dissipation Operating Temperature Storage Temperature Symbol VDD-VSS VIN PMAX TOP TST Conditions Min -0.3 VSS-0.3 -40 -55 Max 5.5 VDD+0.3 100 +85 +150 Unit V V mW o C o C ELECTRICAL CHARACTERISTICS Operating Conditions: VDD = 1.5V, Temperature = 25° unless otherwise noted C Parameter Operating Voltage Current Consumption Symbol VDD IDD Conditions VDD=1.5 V, Vin=0 µVrms VDD=1.5 V, Vin=20 mVrms VDD=3.6 V, Vin=0 µVrms VDD=3.6 V, Vin=20 mVrms Min 1.10 40 24 Typ 55 40 58 43 Max 3.6 80 65 Unit V µA Stand-By Current Input Frequency Range Minimum Input Voltage Maximum Input Voltage Receiver Input Resistance Receiver Input Capacitance RFI2 Switch On Resistance RFI2 Switch Off Capacitance RFI3 Switch On Resistance RFI3 Switch Off Capacitance Input Levels |lIN| 5 µA - at power down the output is pulled to VSS (pull down switch) 4) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 µA which is switched off at power down 5) Receiver inputs RFIP and RFIM have both 600 kΩ biasing resistors towards VDD 9 (10) DA6179.000 22 January, 2007 ORDERING INFORMATION Product Code MAS6179A1TC00 MAS6179A2TC00 Product Tri Band AM-Receiver IC with Differential Input Tri Band AM-Receiver IC with Differential Input Description EWS-tested wafer, Thickness 400 µm. EWS-tested wafer, Thickness 400 µm. Capacitance Option CC = 0.75 pF CC = 1.3 pF Contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 10 (10)