MAS6282

DA6282.001 9 January 2007 This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. IC FOR 6.50 – 40.00 MHz VCTCXO • • • • • • Min. Supply Voltage 2.6 V Max. Frequency 40 MHz True Sine Wave Output Frequency Stability ±2.0 ppm Suitable for Ultra Small VCTCXO Very Low Phase Noise MAS6282 DESCRIPTION The MAS6282 is an integrated circuit well suited to build VCTCXO for mobile communication. Temperature calibration is achieved in three calibration temperatures only. The trimming is done through a serial bus and the calibration information is stored in an internal PROM. This means no rework for trimming is needed. To build a VCTCXO only a crystal is required in addition to MAS6282. The compensation method is fully analog, working continuously without generating any steps or other interference. Output is true sine wave resulting in lower harmonics than with clipped sine wave output. FEATURES • • • • • • Very small size Minimum Vdd 2.6V No voltage reference capacitor needed Programmable VC-sensitivity Divider option selectable by a PROM bit Output peak voltage (amplitude) option selectable by a PROM bit APPLICATIONS • • VCTCXO for mobile phones VCTCXO for other applications BLOCK DIAGRAM DA TFRPROM TEST(2:0) INF(4:0) LIN(7:0) CUB(3:0) SCALE(4:0) SENS(2:0) CDACF(5:0) CDACC(3:0) DIV(0:0) AMPL(0:0) POLYNOMIAL Thermal sensor VREF TEST MUX TIN MOUT CLK f(T) = Ax3+Bx+C OUT FILTER PV VC_SENS VC V divider VDD To all blocks CDACC CDACF XO core f | f/2 Buffer+ divider OUT VSS XIN XOUT 1 (5) DA6282.001 9 January 2007 PIN DESCRIPTION Pin Description MAS6282A Crystal/Varactor Oscillator Input Power Supply Voltage Serial Bus Data Input Serial Bus Clock Input Buffer Output Voltage Control Input Crystal Oscillator Output Temperature Output Programming Input Test Multiplexer Output Power Supply Ground Symbol XIN VDD DA CLK OUT VC XOUT TIN PV MOUT VSS x-coordinate 185 436 1071 1342 1612 209 477 780 1071 1335 1612 y-coordinate 1229 1229 1229 1229 1229 152 152 152 152 152 152 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. Note: Test Multiplexer Output is for testing only and must not be connected in module. ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Power Dissipation Storage Temperature ESD Rating; HBM Latchup Current Limit Symbol VDD – VSS VIN PMAX TST ILUT Min –0.3 VSS -0.3 –55 ±2 ±100 Max 5.5 VDD + 0.3 20 150 Unit V V mW o C kV mA Note 1) 2) 3) Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not operate under these conditions, but it will not be destroyed Note 1: Not valid for programming pin PV Note 2: Value depends on a thermal resistance of the used packade Note 3: In pins XIN and XOUT maximum ESD rating is 1 kV. 2 (5) DA6282.001 9 January 2007 RECOMMENDED OPERATION CONDITIONS Parameter Supply voltage Supply current Supply current Operating temperature Crystal load capacitance Crystal pulling sensitivity Crystal Rs Symbol VDD ICC ICC TOP CL S RS Conditions Vdd = 2.8 V, fc =26 MHz Vdd = 2.8 V, fc =40 MHz –40 8 18 20 30 50 Min 2.6 Typ 2.8 1.3 1.5 Max 4.0 Unit V mA mA o C pF ppm/pF Note +85 1) Note 1: CDACF = 32 and CDACC = 8 ELECTRICAL CHARACTERISTICS Parameter Crystal frequency range for MAS6282 Voltage control range Voltage control sensitivity (SENS=7) Frequency vs. supply voltage Frequency vs. load change Output voltage (10 k || 10 pF) Power Consumption Harmonic distortion Compensation range ±2.0 ppm Compensation range linear part Compensation inflection point Compensation range cubic part Fine compensation CDACF (6 Bit) Coarse compensation CDACC (4 Bit) Start-up time @ 10Hz @ 100Hz Phase noise @ 1kHz @ 10kHz @ 100kHz Symbol fc VC VCSENS dfo dfo Vout P TC a1 INF a3 CXOUT CXOUT TSTART Min 13.00 0 Typ 1.3 10 Max 40.00 VDD ±0.2 ±0.2 0.6 0.8/1.0 8 -25 –30 –0.7 20.5 95 C10 C20 2 –90 –113 –136 –148 –155 C10 + 0.95 C20 + 6.75 85 0.0 36 Unit MHz V ppm/V ppm ppm Vpp mW dBc o C ppm/K o C 23 ppm /K pF pF ms Note 1) 2) 3) 4) 5) 8) 6) 6) n dBc/Hz 7) Note 1: Frequency division by two is selected by PROM bit DIV: 0=no division, 1=div by 2 Thus IC output frequency range is 6.5 MHz – 40 MHz. Note 2: Depending on crystal pulling Note 3: VDD±5% Note 4: R=10 k ±10%, C=10 pF±10% Note 5: 0.8 V / 1.0 V output is selected by PROM bit AMPL: 0=0.8 Vpp, 1=1.0Vpp Note 6: Typically C10 = 3.1 pF at CDACF=0, CDACC=0 Note 7: Not measured in production testing; guaranteed by design Note 8: Max power consumption is 8 mW when VDD is 4V 3 (5) DA6282.001 9 January 2007 IC OUTLINE XIN VDD DA CLK OUT Y = 1380 m MAS6282A Die map reference VC XOUT TIN PV MOUT VSS X = 1840 m Note 1: MAS6282 pads are round with 80 µm diameter at opening. Note 2: Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to VSS or left floating and pin TIN must be left floating in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. Note 4: See coordinates in pin description on page 2. SAMPLES IN SBDIL 20 PACKAGE 1 2 3 4 20 19 OUT 18 GND 17 MAS6282 YYWW XXXXX.X MOUT PV TIN XOUT VC XIN Top marking: YYWW = Year, Week XXXXX.X = Lot number CLK 5 DA 6 7 16 15 14 13 12 11 VDD 8 9 10 4 (5) DA6282.001 9 January 2007 ORDERING INFORMATION Product Code MAS6282A1TG00 Product IC for 6.5MHz to 40MHz VCTCXO Package EWS Tested wafers 215 µm Comments Die Size 1.840 x 1.380 mm Contact Micro Analog Systems Oy for other wafer thickness options. N The formation of product code Product name MAS6282 Design version A1 Package type TG = 215 m thick EWS tested wafer Delivery format 00 = bare wafer LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND http://www.mas-oy.com Tel. (09) 80 521 Tel. Int. +358 9 80 521 Telefax +358 9 805 3213 Email: info@mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 5 (5)