MAS9078BTB4

DA9078.003 28 January 2004 MAS9078 AM Receiver IC • • • • • • • DESCRIPTION The MAS9078 AM-Receiver chip is a highly sensitive, simple to use AM receiver specially intended to receive time signals in the frequency range from 40 kHz to 100 kHz. Only a few external components are required for time signal receiver. The circuit has preamplifier, wide range automatic gain control, demodulator and output comparator built in. The output signal can be processed directly by an additional digital circuitry to extract the data from the received signal. The control for AGC (automatic gain control) can be used to switch AGC on or off if necessary. Unlike MAS1016A and MAS1016B, MAS9078 does not require AGC control procedure in WWVB and JJY systems. High Sensitivity Very Low Power Consumption Wide Supply Voltage Range Power Down Control Control for AGC On High Selectivity by Crystal Filter Fast Startup Feature FEATURES • • • • • • • • • • Highly Sensitive AM Receiver, 0.4 µVRMS typ. Wide Supply Voltage Range from 1.1 V to 3.6 V Very Low Power Consumption Power Down Control Fast Startup Only a Few External Components Necessary Control for AGC On Wide Frequency Range from 40 kHz to 100 kHz High Selectivity by Quartz Crystal Filter Die and TSSOP-16 Package APPLICATIONS • • Time Signal Receiver WWVB (USA), JJY (Japan), DCF77 (Germany) and MSF (UK) Receiver for ASK Modulated Data Signals BLOCK DIAGRAM QO QI AON (=AGC on) RFI AGC Amplifier Demodulator & Comparator OUT Power Supply/Biasing VDD VSS PDN AGC DEC 1 (10) DA9078.003 28 January 2004 PAD LAYOUT 1702 µm VSS RFI PDN AON DEC MAS 1778 µm 9078Bx VDD QO QI AGC OUT DIE size = 1.70 x 1.78 mm; PAD size = 100 x 100 µm Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Coordinates are pad center points where origin has been located in the center of VDD pad Note: The on-chip product code 9078Bx identifies internal compensation capacitance option. x has values 1, 2, 3, 4 or 5 refering to capacitance option described in the Table 2 on page 4. Pin Description Power Supply Voltage Quarz Filter Output Quarz Filter Input AGC Capacitor Receiver Output Demodulator Capacitor AGC On Control Power Down Input Receiver Input Power Supply Ground Name VDD QO QI AGC OUT DEC AON PDN RFI VSS X-coordinate 0 µm 306 µm 586 µm 866 µm 1109 µm 1109 µm 866 µm 549 µm 306 µm 16 µm Y-coordinate 0 µm 19 µm 19 µm 19 µm 19 µm 1428 µm 1428 µm 1428 µm 1428 µm 1407 µm Note 1 2 3 Notes: 1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated) - the output is a current source/sink with |IOUT| > 5 µA - at power down the output is pulled to VSS (pull down switch) 2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 µA which is switched off at power down 3) PDN = VSS means receiver on; PDN = VDD means receiver off - Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up (PDN=VSS) i.e. at the falling edge of PDN signal. 2 (10) DA9078.003 28 January 2004 ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Power Dissipation Operating Temperature Storage Temperature Symbol VDD-VSS VIN PMAX TOP TST Conditions Min -0.3 VSS-0.3 -20 -40 Max 5.0 VDD+0.3 100 70 120 Unit V V mW o C o C ELECTRICAL CHARACTERISTICS Operating Conditions: VDD = 1.4V, Temperature = 25°C Parameter Operating Voltage Current Consumption Stand-By Current Input Frequency Range Minimum Input Voltage Maximum Input Voltage Input Levels |lIN| 5 µA - at power down the output is pulled to VSS (pull down switch) 3) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 µA which is switched off at power down 4) PDN = VSS means receiver on; PDN = VDD means receiver off - Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up (PDN=VSS) i.e. at the falling edge of PDN signal. 5 (10) DA9078.003 28 January 2004 PIN CONFIGURATION & TOP MARKING FOR PLASTIC TSSOP-16 PACKAGE VDD NC QO NC QI AGC NC OUT VSS NC RFI NC PDN AON NC DEC YYWW 9078 Top Marking Definitions: YYWW = Year Week PIN DESCRIPTION Pin Name VDD NC QO NC QI AGC NC OUT DEC NC AON PDN NC RFI NC VSS Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Type P AO AI AO DO AO DI AI AI G Function Positive Power Supply Quartz Filter Output 1 Quartz Filter Input AGC Capacitor Receiver Output Demodulator Capacitor AGC On Control Power Down Input Receiver Input Power Supply Ground 2 Note 3 4 Notes: 1) Pin 4 between quartz crystal filter pins must be connected to VSS to eliminate package leadframe parasitic capacitances disturbing the crystal filter performance. All other NC (Not Connected) pins are also recommended to be connected to VSS to minimize noise coupling. 2) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated) - the output is a current source/sink with |IOUT| > 5 µA - at power down the output is pulled to VSS (pull down switch) 3) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up (to AGC on) with current < 1 µA which is switched off at power down 4) PDN = VSS means receiver on; PDN = VDD means receiver off - Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up (PDN=VSS) i.e. at the falling edge of PDN signal. 6 (10) DA9078.003 28 January 2004 PACKAGE (TSSOP16) OUTLINES C D Seating Plane B A F G H E O Pin 1 Detail A B B L I I1 K P Section B-B J1 J M N Detail A Dimension A B C D E F G H I I1 J J1 K L M (The length of a terminal for soldering to a substrate) N O P Min 6.40 BSC 4.30 5.00 BSC 0.05 0.19 0.65 BSC 0.18 0.09 0.09 0.19 0.19 0° 0.24 0.50 1.00 REF 12 ° 12 ° Max 4.50 0.15 1.10 0.30 0.28 0.20 0.16 0.30 0.25 8° 0.26 0.75 Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm mm Dimensions do not include mold flash, protrusions, or gate burrs. All dimensions are in accordance with JEDEC standard MO-153. 7 (10) DA9078.003 28 January 2004 SOLDERING INFORMATION Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish According to RSH test IEC 68-2-58/20 2*220°C 240°C 2 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% EMBOSSED TAPE SPECIFICATIONS Tape Feed Direction P0 D0 P2 A E1 F1 W D1 A P A0 Tape Feed Direction T Section A - A B0 S1 K0 Dimension A0 B0 D0 D1 E1 F1 K0 P P0 P2 S1 T W Min 6.50 5.20 1.50 +0.10 / -0.00 1.50 1.65 7.20 1.20 11.90 4.0 1.95 0.6 0.25 11.70 2.05 0.35 12.30 1.85 7.30 1.40 12.10 Pin 1 Designator Max 6.70 5.40 Unit mm mm mm mm mm mm mm mm mm mm mm mm mm 8 (10) DA9078.003 28 January 2004 REEL SPECIFICATIONS W2 A D B Tape Slot for Tape Start C N W1 2000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative Carrier Tape Cover Tape End Start Trailer Dimension A B C D N W1 (measured at hub) W2 (measured at hub) Trailer Leader Min Components Max 330 1.5 12.80 20.2 50 12.4 13.50 14.4 18.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 Leader Unit mm mm mm mm mm mm mm mm mm Weight g 9 (10) DA9078.003 28 January 2004 ORDERING INFORMATION Product Code MAS9078BTB1 MAS9078BTB2 MAS9078BTB3 MAS9078BTB4 MAS9078BTB5 MAS9078BTC1 MAS9078BTC2 MAS9078BTC3 MAS9078BTC4 MAS9078BTC5 MAS9078BUA1-T Product AM-Receiver IC AM-Receiver IC AM-Receiver IC AM-Receiver IC AM-Receiver IC AM-Receiver IC AM-Receiver IC AM-Receiver IC AM-Receiver IC AM-Receiver IC AM-Receiver IC Package EWS-tested wafer, Thickness 480 µm EWS-tested wafer, Thickness 480 µm EWS-tested wafer, Thickness 480 µm EWS-tested wafer, Thickness 480 µm EWS-tested wafer, Thickness 480 µm EWS-tested wafer, Thickness 400 µm EWS-tested wafer, Thickness 400 µm EWS-tested wafer, Thickness 400 µm EWS-tested wafer, Thickness 400 µm EWS-tested wafer, Thickness 400 µm TSSOP-16, Tape & Reel Capacitance Option CC = 0.75 pF (Nominal) CC = 1.25 pF CC = 1.625 pF CC = 2.5 pF CC = 3.875 pF CC = 0.75 pF CC = 1.25 pF CC = 1.625 pF CC = 2.5 pF CC = 3.875 pF CC = 0.75 pF (Nominal) Contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 10 (10)