MAS9081A3TC00

DA9081.006 1 August, 2005 MAS9081 • Dual Band Receiver IC • High Sensitivity • Very Low Power Consumption • Wide Supply Voltage Range • Power Down Control • Control for AGC On • High Selectivity by Crystal Filter • Fast Startup Feature DESCRIPTION The MAS9081 AM-Receiver chip is a highly sensitive, simple to use AM receiver specially intended to receive time signals in the frequency range from 40 kHz to 100 kHz. Only a few external components are required for time signal receiving. The circuit has preamplifier, wide range automatic gain control, demodulator and output comparator built in. The output signal can be processed directly by an additional digital circuitry to extract the data from the received signal. The control for AGC (automatic gain control) can be used to switch AGC on or off if necessary. MAS9081 supports dual band operation by switching between two crystal filters and an additional antenna tuning capacitor. MAS9081 has differential input and different internal compensation capacitor options for compensating shunt capacitances of different crystals (See ordering information on page 12). FEATURES • • • • • • • • • • Dual Band Receiver IC Highly Sensitive AM Receiver, 0.4 µVRMS typ. W ide Supply Voltage Range from 1.1 V to 5 V Very Low Power Consumption Power Down Control Fast Startup Only a Few External Components Necessary Control for AGC On W ide Frequency Range from 40 kHz to 100 kHz High Selectivity by Quartz Crystal Filter APPLICATIONS • Dual Band Time Signal Receiver WWVB (USA), JJY (Japan), DCF77 (Germany), MSF (UK), HGB (Switzerland) and BPC (China) BLOCK DIAGRAM QO2 RFIP RFIM AGC Amplifier Demodulator & Comparator OUT QO1 QI AON RFI2 Power Supply/Biasing VDD VSS PDN1 PDN2 AGC DEC 1 (12) DA9081.006 1 August, 2005 MAS9081 PAD LAYOUT 9081Ax, x=1, 3, 4 or 5 VDD QO2 QO1 QI AGC PDN2 OUT VSS RFI2 RFIM RFIP PDN1 AON DEC 1494 µm DIE size = 1.49 x 1.69 mm; PAD size = 80 x 80 µm Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die. Pad Identification Power Supply Voltage Quartz Filter Output for Crystal 2 Quartz Filter Output for Crystal 1 Quartz Filter Input for Crystals AGC Capacitor Power Down/Frequency Selection Input 2 Receiver Output Demodulator Capacitor AGC On Control Power Down/Frequency Selection Input 1 Positive Receiver Input Negative Receiver Input Receiver Input 2 (for Antenna Capacitor 2) Power Supply Ground Name VDD QO2 QO1 QI AGC PDN2 OUT DEC AON PDN1 RFIP RFIM RFI2 VSS X-coordinate 174 µm 174 µm 174 µm 174 µm 174 µm 174 µm 175 µm 1318 µm 1318 µm 1318 µm 1318 µm 1318 µm 1318 µm 1318 µm Y-coordinate 1452 µm 1247 µm 1043 µm 839 µm 633 µm 430 µm 224 µm 240 µm 444 µm 648 µm 853 µm 1057 µm 1262 µm 1466 µm Note 1688 µm 3 1 2 3 4 4 Notes: 1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated) - the output is a current source/sink with |IOUT| > 5 µA - at power down the output is pulled to VSS (pull down switch) 2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 µA which is switched off at power down 3) PDN1 = VDD and PDN2 = VDD means receiver off - Fast start-up is triggered when the receiver is after power down controlled to power up 4) Receiver inputs RFIP and RFIM have both 600 kΩ biasing resistances against ground 2 (12) DA9081.006 1 August, 2005 FREQUENCY SELECTION The frequency selection and power down control is accomplished via two digital control pins PDN1 and PDN2. The control logic is presented in table 1. Table 1 Frequency selection and power down control PDN1 PDN2 RFI2 Switch Selected Crystal Output High High Low Low High Low High Low Open Open Closed Closed QO1 QO2 QO2 Description Power down Frequency 1 Frequency 2, RFI2 capacitor connected in parallel with antenna Frequency 2, RFI2 capacitor connected in parallel with antenna If frequency 2 is selected then RFI2 switch is closed to connect CANT2 in parallel with ferrite antenna and tune it to frequency 2. Then only crystal output QO2 is active. Frequency 2 is lower frequency of the two selected frequencies. It is recommended to switch the device to power down for 50ms before switching to another frequency. This guarantees fast startup in switching to another frequency. The 50ms power down period is used to discharge AGC capacitor and to initialize fast startup conditions. The internal antenna tuning capacitor switch (RFI2) and crystal filter output switches (QO1, QO2) are controlled according table 1. See switch in block diagram on page 1. If frequency 1 is selected the RFI2 switch is open and only crystal output QO1 is active. Antenna frequency is determined by antenna inductor LANT (see Typical Application on page 5), antenna capacitor CANT1 and parasitic capacitances related to antenna inputs RFI1, RFI2 and RFI3 (see Antenna Tuning Considerations below). Frequency 1 is the higher frequency of two selected frequencies. ANTENNA TUNING CONSIDERATIONS The ferrite bar antenna having inductance LANT and parasitic coil capacitance CCOIL is tuned to two reception frequencies f1 and f2 by parallel capacitors CANT1 and CANT2. The receiver input stage and internal antenna capacitor switch have capacitances (CRFI1, COFF2) which affect the resonance Frequency f1 (higher frequency): CTOT1=CCOIL+CANT1+CRFI1+COFF2=CCOIL+CANT1+6.5pF+37pF=CCOIL+CANT1+ 43.5pF, f 1 = Frequency f2 (lower frequency): CTOT2=CCOIL+CANT1+CANT2+CRFI1=CCOIL+CANT1+CANT2+ 6.5pF, f 2 = frequencies. COFF2 is switch capacitance when switch is open. When the switch is closed this capacitance is shorted by on resistance of the switch and is effectively eliminated. Following relationships can be written into two tuning frequencies. 1 2π L ANT ⋅ C TOT 1 1 2π L ANT ⋅ C TOT 2 3 (12) DA9081.006 1 August, 2005 ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Power Dissipation Operating Temperature Storage Temperature Symbol VDD-VSS VIN PMAX TOP TST Conditions Min -0.3 VSS-0.3 -40 -55 Max 6 VDD+0.3 100 +85 +150 Unit V V mW o C o C ELECTRICAL CHARACTERISTICS Operating Conditions: VDD = 1.4V, Temperature = 25° C Parameter Operating Voltage Current Consumption Symbol VDD IDD Conditions VDD=1.4 V, Vin=0 µVrms VDD=1.4 V, Vin=20 mVrms VDD=3.6 V, Vin=0 µVrms VDD=3.6 V, Vin=20 mVrms Min 1.10 Typ 64 37 67 40 Max 5 Unit V µA 31 27 40 Stand-By Current Input Frequency Range Minimum Input Voltage Maximum Input Voltage Receiver Input Resistance Receiver Input Capacitance RFI2 Switch On Resistance RFI2 Switch Off Resistance RFI2 Switch Off Capacitance Input Levels |lIN| 5 µA - at power down the output is pulled to VSS (pull down switch) 3) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 µA which is switched off at power down 4) Receiver inputs RFIP and RFIM have both 600 kΩ biasing MOSFET-transistors towards ground 7 (12) DA9081.006 1 August, 2005 PIN CONFIGURATION & TOP MARKING FOR PLASTIC TSSOP-16 PACKAGE VDD QO2 QO1 NC QI AGC PDN2 OUT VSS RFI2 RFIM RFIP NC PDN1 AON DEC 9081Az YYWW Top Marking Definitions: z = Version Number YYWW = Year Week PIN DESCRIPTION Pin Name VDD QO2 QO1 NC QI AGC PDN2 OUT DEC AON PDN1 NC RFIP RFIM RFI2 VSS Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Type P AO AO AI AO DI DO AO DI DI AI AI AI G Function Positive Power Supply Quartz Filter Output for Crystal 2 Quartz Filter Output for Crystal 1 1 Quartz Filter Input for Crystal and External Compensation Capacitor AGC Capacitor Power Down/Frequency Selection Input 2 Receiver Output Demodulator Capacitor AGC On Control Power Down/Frequency Selection Input 1 Positive Receiver Input Negative Receiver Input Receiver Input 2 (for Antenna Capacitor 2) Power Supply Ground Note 2 3 4 4 A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected Notes: 1) Pin 4 between quartz crystal filter pins must be connected to VSS to eliminate package leadframe parasitic capacitances disturbing the crystal filter performance. All other NC (Not Connected) pins are also recommended to be connected to VSS to minimize noise coupling. 2) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated) - the output is a current source/sink with |IOUT| > 5 µA - at power down the output is pulled to VSS (pull down switch) 3) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up (to AGC on) with current < 1 µA which is switched off at power down 4) Differential input versions A1..A5 have 600 kΩ biasing MOSFET-transistors towards ground from both receiver inputs RFIP and RFIM. Asymmetric input versions AB..AF have input pin RFIM unconnected. 8 (12) DA9081.006 1 August, 2005 PACKAGE (TSSOP-16) OUTLINES C E D Seating Plane B A O Pin 1 Detail A F G H B B L I I1 K P Section B-B J1 J M N Detail A Dimension A B C D E F G H I I1 J J1 K L M (The length of a terminal for soldering to a substrate) N O P Min 6.40 BSC 4.30 5.00 BSC 0.05 0.19 0.65 BSC 0.18 0.09 0.09 0.19 0.19 0° 0.24 0.50 Max 4.50 0.15 1.10 0.30 0.28 0.20 0.16 0.30 0.25 8° 0.26 0.75 Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm 1.00 REF 12° 12° mm Dimensions do not include mold flash, protrusions, or gate burrs. All dimensions are in accordance with JEDEC standard MO-153. 9 (12) DA9081.006 1 August, 2005 SOLDERING INFORMATION N For Pb-Free, RoHS Compliant TSSOP-16 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish According to RSH test IEC 68-2-58/20 260°C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Matte Tin EMBOSSED TAPE SPECIFICATIONS Tape Feed Direction P0 D0 P2 A E1 F1 W D1 A P A0 Tape Feed Direction T Section A - A B0 S1 K0 Dimension A0 B0 D0 D1 E1 F1 K0 P P0 P2 S1 T W Min 6.50 5.20 1.50 +0.10 / -0.00 1.50 1.65 7.20 1.20 11.90 4.0 1.95 0.6 0.25 11.70 2.05 0.35 12.30 1.85 7.30 1.40 12.10 Pin 1 Designator Max 6.70 5.40 Unit mm mm mm mm mm mm mm mm mm mm mm mm mm 10 (12) DA9081.006 1 August, 2005 REEL SPECIFICATIONS W2 A D B Tape Slot for Tape Start C N W1 2000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative Carrier Tape Cover Tape End Start Trailer Dimension A B C D N W1 (measured at hub) W2 (measured at hub) Trailer Leader Min Components Max 330 1.5 12.80 20.2 50 12.4 13.50 Leader Unit mm mm mm mm mm mm mm mm mm 14.4 18.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 W eight g 11 (12) DA9081.006 1 August, 2005 ORDERING INFORMATION Product Code MAS9081A1TC00 MAS9081A3TC00 MAS9081A4TC00 MAS9081A5TC00 MAS9081A1UC06 Product Dual Band AM-Receiver IC with Differential Input Dual Band AM-Receiver IC with Differential Input Dual Band AM-Receiver IC with Differential Input Dual Band AM-Receiver IC with Differential Input Dual Band AM-Receiver IC with Differential Input Description EWS-tested wafer, Thickness 400 µm. EWS-tested wafer, Thickness 400 µm. EWS-tested wafer, Thickness 400 µm. EWS-tested wafer, Thickness 400 µm. TSSOP-16, Pb-free, RoHS compliant, Tape & Reel Capacitance Option CC = 0.75 pF CC = 1.25 pF CC = 1.5 pF CC = 3.875 pF CC = 0.75 pF Contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 12 (12)