MAS9283AGTG00

DA9283.006 13 July 2006 MAS9283 IC FOR 10.00 – 56.00 MHz VCXO This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. • • • • • • Low Power Wide Supply Range CMOS (Square Wave) Output Very Low Phase Noise Low Cost Divider Function DESCRIPTION MAS9283 is an integrated circuit well suited to build a VCXO for telecommunication and other applications. To build a VCXO only one additional component, a crystal, is needed. FEATURES • • • • • Very small size Minimal current consumption W ide operating temperature range Phase noise < -130 dBc/Hz at 1 kHz offset CMOS (Square wave) output APPLICATIONS • • • VCXO for telecommunications systems VCXO for set-top boxes VCXO for MPEG BLOCK DIAGRAM Figure 1. Block diagram of MAS9283. 1 (14) DA9283.006 13 July 2006 PIN DESCRIPTION Pin Description Crystal Oscillator Output Voltage Control Input Power Supply Ground Crystal/Varactor Oscillator Input Output Buffer Power Down Control Power Supply Voltage Buffer Output Symbol X2 VC VSS X1 PD VDD OUT x-coordinate 186 372 543 149 330 500 919 y-coordinate 142 142 142 920 920 920 920 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location. However, the distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Pin Voltage Power Dissipation (max) Storage Temperature ESD Rating Symbol VDD - VSS PMAX TST HBM Conditions Min -0.3 VSS -0.3 -55 Max 5.5 VDD + 0.3 100 150 2 Unit V V mW o C kV Note RECOMMENDED OPERATION CONDITIONS Parameter Supply Voltage Symbol VDD IDD TOP ZVC,LINE S CL Conditions For 3.3 V / 5.0 V versions For 3.3 V versions VDD = 2.8 V Min 2.5 2.5 -40 1 30 10 Typ 3.3 3.3 3.2 Max 5.3 4.0 +85 mA o C M ppm/pF pF Unit V Note 1) 1, 2) 3) Supply Current Operating Temperature Voltage Control Line Impedance Crystal Pulling Sensitivity Crystal Load Capacitance VC = 1.65 V 4) Note 1: It is recommended to connect a 1 nF capacitor between the VDD and VSS pins. Note 2: For 3.3 V versions MAS9283AA-AE, MAS9283AN-AR. Note 3: Value at 15MHz. At 40MHz IDD is typically 5.8 mA. Note 4: MAS9283AG – AL has a typical crystal load capacitance of 8.5 pF when VC = 2.5 V. MAS9283AT – AX has a typical crystal load capacitance of 9 pF when VC = 2.5 V. 2 (14) DA9283.006 13 July 2006 ELECTRICAL CHARACTERISTICS Parameter Crystal Frequency Range Voltage Control Range Voltage Control Sensitivity MAS9283AN – AR Voltage Control impedance Output Current (VDD = 3 V) MAS9283 (RL=10kΩ) MAS9283 (RL=1 kΩ) MAS9283 (RL=250Ω) MAS9283 (RL=50Ω) Output Current (VDD = 5 V) MAS9283 (RL=10kΩ) MAS9283 (RL=1 kΩ) MAS9283 (RL=250Ω) MAS9283 (RL=50Ω) Rise and Fall Time (10 - 50 pF) Output Symmetry Startup Time Output Buffer Enabled Disabled TSTART 1.6 0 Symbol fo VC VCSENS ZVC IOUT 0.3 3.2 12.1 42.6 IOUT 0.5 4.9 18.7 42.6 10 45 48-52 2 VDD 0.55 55 ns % ms V 3) mA Min 10.00 0 90 1.3 Typ Max 56 VDD Unit MHz V ppm/V M mA 2) Note 1) Note 1: An RS < 15 crystal provides 56 MHz maximum frequency (i.e. negative resistance typically 30 ). With an RS = 70 crystal the maximum frequency is typically 40 MHz (i.e. negative resistance typically 110 ). Note 2: VC sensitivity value depends on the crystal used. With a 30 ppm/pF crystal typical values are MAS9283AN – AR > 90 ppm/V, MAS9283AA – AE > 75 ppm/V, MAS9283AG – AL > 60 ppm/V, MAS9283AT – AX > 50 ppm/V. Note 3: If the PD pin is floating the output buffer is active. Oscillator is always running. IC OUTLINES Figure 2. IC outline of MAS9283. Note 1: MAS9283 pads are round with 80 µm diameter at opening. Note 2: Die map reference is the actual left bottom corner of the sawn chip. 3 (14) DA9283.006 13 July 2006 EXTERNAL COMPONENT SELECTION MAS9283 requires a minimum number of external components for proper operation. Quartz Crystal The MAS9283 VCXO function consists of the external crystal and the integrated VCXO oscillator circuit. To assure the best system performance (frequency pull range) and reliability, a crystal device with the recommended parameters (shown below) must be used, and the layout guidelines in the following section must be followed. The frequency of the oscillation of a quartz crystal is determined by its “cut” and by the load capacitors connected to it. MAS9283 incorporates on-chip variable load capacitors that “pull” (change) the frequency of the crystal. The crystal specified for use with the MAS9283 is designed to have zero frequency error when the total of on-chip + stray capacitance is 10 pF. See Note 3 on page 2 for other capacitance options. The external crystal must be connected as close to the chip as possible and should be on the same side of the PCB as the MAS9283. There should be no vias between the crystal pins and the X1 and X2 device pins. There should be no signal traces underneath or close to the crystal. Recommended Crystal Parameters: Parameter Initial Accuracy at 25° C Temperature Stability Crystal Load Capacitance Crystal Shunt Capacitance (Typical) C0/C1 Ratio (Typical) CL C0 Symbol Typ ±20 ±30 10 2 ≤ 300 Unit ppm ppm pF pF 1) Note Note 1. If the crystal with a load other than 10 pF is used with MAS9283, the crystal has to have frequency offset in order to have the nominal frequency at VC = 1.65 V. Please see table below for offset frequencies vs. crystal load. (Values are for a typical crystal with S = 30 ppm/pF.) Parameter Crystal frequency Crystal load Offset / ppm (MAS9283AA – AE, AN – AR, VC=1.65 V) Offset / ppm (MAS9283AG – AR, VC= 2.5V) 27 8 +30 0 27 9 0 -30 27 12.5 -105 -135 27 15 -180 -210 Unit MHz pF For example: When the desired nominal frequency of the application and the crystal load are 27.00 MHz and 12.5 pF, the crystal nominal frequency has to be,  27.00 MHz    × (− 105) = 26.997165 MHz . 27.00 MHz +    10 6      4 (14) DA9283.006 13 July 2006 VOLTAGE CONTROL SENSITIVITY MAS9283AA, MAS9283AG and MAS9283AN Voltage control sensitivity graphs have been measured by using 26.996220MHz crystal (CL 14.6pF, C1 17.0fF, C0 3.9pF). For offset see note 1 page 4. MAS9283AA, AG, AN VC-sensitivity with 27MHz output. 270 250 230 210 190 170 150 130 110 90 70 50 30 10 -10 -30 -50 -70 -90 -110 -130 -150 -170 -190 -210 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 VC-voltage (V) 3 3.2 3.4 3.6 3.8 4 4.2 4.4 4.6 4.8 5 Frequency change (ppm) MAS9283AA MAS9283AG MAS9283AN Figure 3. Control voltage sensitivity of MAS9283. 5 (14) DA9283.006 13 July 2006 MODULATION RESPONSE MAS9283AA Modulation Response 2,00 0,00 -2,00 Gain (dB) -4,00 -6,00 -8,00 -10,00 0,1 1 Frequency (kHz) 10 100 Figure 4. Modulation response of MAS9293. 3dB point is typically at 20.4 kHz. Measurement has been done using typical modulation connection described below. MODULATION MEASUREMENT Figure 5. Modulation response measurement setup. 6 (14) DA9283.006 13 July 2006 SAMPLES IN SB20 DIL PACKAGE X2 1 2 20 19 18 PD 17 X1 3 4 VC 5 VSS 6 7 8 9 10 16 VDD 15 14 13 12 11 OUT Top marking: YYWW = Year, Week XXXXX.X = Lot number DEVICE OUTLINE CONFIGURATION MAS9283 YYWW XXXXX.X p in 1 X1 X2 PD V DD O UT T op View YWW 9283 AX VC VSS A = p roduct version X = M AS internal code Y = year W W= week M SOP8/TSSOP8 7 (14) DA9283.006 13 July 2006 PACKAGE (MSOP-8) OUTLINE Gage plane E1 E F Land Pattern Recommendation P Q L N e D A2 A1 b Symbol A A1 A2 b b1 c c1 D E E1 e F G L (Terminal length for soldering) M N P Q R R1 Min 0 0.75 0.22 0.22 0.08 0.08 Nom Max 1.10 0.15 0.95 0.38 0.33 0.23 0.18 Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm R A R1 A c G A M b1 (b) Section A - A c1 0.85 0.30 0.40 3.00 BSC 4.90 BSC 3.00 BSC 0.65 BSC 4.8 0.65 0.60 0.80 0.41 1.02 0° 0.25 BSC 0.07 0.07 8° mm mm mm mm mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. All measurement according to JEDEC standard MO-187. 8 (14) DA9283.006 13 July 2006 PACKAGE (TSSOP-8) OUTLINE e/2 A VIEW B-B b E E1 c1 12° REF c S b1 R INDEX AREA GAUGE PLANE 0° -8° A e 0.25 12° REF L1 L D A A2 B A1 b MS/ 21.11.2001 B VIEW A-A Symbol A A1 A2 b b1 c c1 D E E1 e L L1 R S Min -0.05 0.85 0.19 0.19 0.09 0.09 2.90 4.30 0.50 0.09 -- Nom --0.90 -0.22 --3.00 6.4 BSC 4.40 0.65 BSC 0.60 1.00 REF -0.20 Max 1.10 0.15 0.95 0.30 0.25 0.20 0.16 3.10 4.50 0.75 --- Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-153. 9 (14) DA9283.006 13 July 2006 SOLDERING INFORMATION N For Eutectic Sn/Pb Maximum Reflow Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish Moisture Sensitivity Level (MSL) N For Pb-Free Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish Moisture Sensitivity Level (MSL) 260°C 3 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Matte Tin 1 240°C 2 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% 1 10 (14) DA9283.006 13 July 2006 EMBOSSED TAPE SPECIFICATIONS (MSOP-8) P1 P2 E W F PO DO T BO AO User Direction of Feed A D1 Section A-A KO Pin 1 Designator Dimension Min/Max Unit Ao Bo Do D1 E F Ko Po P1 P2 T W 5.00 ±0.10 3.20 ±0.10 1.50 +0.1/-0.0 1.50 min 1.75 5.50 ±0.05 1.45 ±0.10 4.0 8.0 ±0.10 2.0 ±0.05 0.3 ±0.05 12.00 +0.30/-0.10 mm mm mm mm mm mm mm mm mm mm mm mm 11 (14) DA9283.006 13 July 2006 REEL SPECIFICATIONS (MSOP-8) W2 A D B Tape Slot for Tape Start C N W1 5000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative Carrier Tape Cover Tape End Start Trailer Dimension Min Components Max Leader Unit A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader 330 1.5 12.80 20.2 50 12.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 13.50 14.4 18.4 mm mm mm mm mm mm mm mm mm W eight g 12 (14) DA9283.006 13 July 2006 ORDERING INFORMATION Product Code Recommended Supply Voltage Output Frequency Pulling range 0 V < VC < 3.3 V Package MAS9283AATG00 MAS9283AASM06 MAS9283AASN06 MAS9283ABTG00 MAS9283ACTG00 MAS9283ADTG00 MAS9283AETG00 MAS9283AGTG00 MAS9283AGSM06 MAS9283AGSN06 MAS9283AHTG00 MAS9283AJTG00 MAS9283AKTG00 MAS9283ALTG00 MAS9283ANTG00 MAS9283ANSN06 MAS9283APTG00 MAS9283AQTG00 MAS9283ARTG00 MAS9283ATTG00 MAS9283AUTG00 MAS9283AVTG00 MAS9283AWTG00 MAS9283AXTG00 IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO IC FOR 3.3 / 5.0 V VCXO fo fo fo fo/2 fo/4 fo/8 fo/16 fo fo fo fo/2 fo/4 fo/8 fo/16 fo fo fo/2 fo/4 fo/8 fo fo/2 fo/4 fo/8 fo/16 > 250 ppm > 250 ppm > 250 ppm > 250 ppm > 250 ppm > 250 ppm > 250 ppm > 200 ppm > 200 ppm > 200 ppm > 200 ppm > 200 ppm > 200 ppm > 200 ppm > 300 ppm > 300 ppm > 300 ppm > 300 ppm > 300 ppm > 165 ppm > 165 ppm > 165 ppm > 165 ppm > 165 ppm EWS tested wafers 215 µm MSOP-8, T&R/5000 pcs/r. MSOP-8, T&R/5000 pcs/r. Pb free RoHS EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm MSOP-8, T&R/5000 pcs/r. MSOP-8, T&R/5000 pcs/r. Pb free RoHS EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm MSOP-8, T&R/5000 pcs/r. Pb free, RoHS EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm EWS tested wafers 215 µm Contact Micro Analog Systems Oy for other wafer thickness, Power Down logic options and versions in MSOP8 and TSSOP8 packages. Note 1: Typical Vc Sensitivity values with a 30 ppm/pF crystal. Note 2: In Recommended Supply Voltage column voltage version is maximum optimized Voltage Control (VC) value. 13 (14) DA9283.006 13 July 2006 LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 14 (14)