MAS9285A1TG00

DA9285.004 13 July 2006 IC FOR XO TRIMMING • • • • • • DESCRIPTION MAS9285 is capacitive digital to analog converter integrated circuit well suited to make initial offset trimming of the crystal oscillator. The trimming is done by a serial bus and the calibration information is stored in an internal PROM. MAS9285 Very Low Power Wide Trimming Range Wide Supply Voltage Range Very High Level of Integration Electrically Trimmable Low Cost FEATURES • • • Very small size Minimum current draw W ide operating temperature range APPLICATIONS • • OCXO All Crystal Oscillators BLOCK DIAGRAM MAS9285 DA CLK PV VDD Digital 2 3 5 VSS X1 Figure 1. Block diagram of MAS9285. 1 (11) DA9285.004 13 July 2006 PIN DESCRIPTION Pin Description Serial Bus Data Input Serial Bus Clock Input Programming Input Power Supply Voltage Power Supply Ground CDAC Output with Bias Option Symbol DA CLK PV VDD VSS X1 x-coordinate 192 425 656 161 368 629 y-coordinate 152 152 158 855 855 871 Note Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Power Dissipation Storage Temperature Note: Not valid for programming pin PV Symbol VDD - VSS VIN PMAX TST Min -0.3 VSS -0.3 -55 Max 6.0 VDD + 0.3 100 150 Unit V V mW o C Note 1) RECOMMENDED OPERATION CONDITIONS Parameter Supply Voltage Supply Current Operable Temperature Symbol VDD ICC TC Conditions Vdd = 3.3 Volt -40 Min 2.5 Typ 2.8 7 Max 5.5 50 +85 Unit V A o C ELECTRICAL CHARACTERISTICS (recommended operation conditions) Parameter Operation Frequency Symbol Min Typ Max 200 Unit MHz Note 2 (11) DA9285.004 13 July 2006 IC OUTLINES VDD VSS X1 MAS9285 940 µm DA CLK PV Die map reference 794 µm Figure 2. IC outline of MAS9285. Note 1: MAS9285 pads are round with 80 µm diameter at opening. Note 2: Pins PV, CLK and DA must not be connected in XO module end-user application. APPLICATION MAS9285 DA CLK PV VDD Digital 2 3 5 VSS X1 VC OUT 155MHz VCXO X1 X'Tal X2 Figure 3. Typical application for MAS9285 3 (11) DA9285.004 13 July 2006 PIN CONFIGURATION (TSOT-6) TSOT-6 VDD DA CLK 6 5 4 85AX 1 X1 2 VSS 3 PV 85AX = Product version (MAS9285AX, where x = number) PIN DESCRIPTION (TSOT-6) Pin Name X1 VSS PV CLK DA VDD Pin Number in TSOT-6 1 2 3 4 5 6 Type O G I I I P Function CDAC Output with Bias Option Power Supply Ground Programming Input Serial Bus Clock Input Serial Bus Data Input Power Supply Voltage G = Ground, I = Input, O = Output, P = Power 4 (11) DA9285.004 13 July 2006 PIN CONFIGURATION (QFN-6) QFN-6 PV CLK DA X1 VSS VDD 851 = Product version (MAS9285A1) XXX = MAS lot number (3 last digit) 851 XXX PIN DESCRIPTION (QFN-6) Pin Name X1 VSS VDD DA CLK PV Pin Number in TSOT-6 1 2 3 4 5 6 Type O G I I I P Function CDAC Output with Bias Option Power Supply Ground Power Supply Voltage Serial Bus Data Input Serial Bus Clock Input Programming Input G = Ground, I = Input, O = Output, P = Power Exposed pad* can be connected to ground or left floating * see package outline information on page 8 5 (11) DA9285.004 13 July 2006 PACKAGE OUTLINE (TSOT-6) GAUGE PLANE b C L e L2 L C L E C L E1 e1 D C L c 1) PACKAGE OUTLINE DIMENSIONS INCLUSIVE OF METAL BURR & SOLDER PLATING A A2 2) PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH 3) ALL SPECIFICATIONS COMPLY TO JEDEC MO193 4) Q REFERS TO ALL PACKAGE DRAFT ANGLES A1 Symbol A A1 A2 b c D E E1 e e1 L L2 Q Min -0.01 0.84 0.30 0.12 Nom -0.05 0.87 -0.127 2.90BSC 2.80BSC 1.60BSC 0.95BSC 1.90BSC 0.40 0.25BSC 10° Max 1.00 0.10 0.90 0.45 0.20 Unit mm mm mm mm mm mm mm mm mm mm mm mm 0.30 4° 0.50 12° 6 (11) DA9285.004 13 July 2006 SOLDERING INFORMATION (TSOT-6) N For Lead-Free / RoHS Compliant Green TSOT-6 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish According to RSH test IEC 68-2-58/20 260°C 3 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Matte Tin TAPE & REEL SPECIFICATIONS (TSOT-6) W3 W2 Feeding Direction A D C N 8 mm W1 B 85AX 85AX 4 mm Other Dimensions according to EIA-481 Standard 3000 Components on Each Reel Dimension A B C D N W 1 (measured at hub) W 2 (measured at hub) W 3 (includes flange distortion at outer edge) Trailer Leader Min 1.5 12.80 20.2 50 8.4 7.9 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape Max 178 13.50 9.9 14.4 10.9 Unit mm mm mm mm mm mm mm mm mm mm 7 (11) DA9285.004 13 July 2006 PACKAGE OUTLINE (QFN-6) D TOP VIEW D/2 E/2 PIN 1 MARK AREA SIDE VIEW A1 A A3 SEATING PLANE D2 BOTTOM VIEW b e Symbol A A1 A3 b D D2 (Exposed pad) E E2 (Exposed pad) e L Min 0.700 0.000 0.178 0.200 1.350 0.750 0.300 Nom PACKAGE DIMENSIONS 0.750 0.020 0.203 0.250 2.000 BSC 1.400 2.000 BSC 0.800 0.650 BSC 0.350 Max 0.800 0.050 0.228 0.300 1.450 0.850 0.400 Unit mm mm mm mm mm mm mm mm mm mm EXPOSED PAD Dimensions do not include mold or interlead flash, protrusions or gate burrs. E2 SHAPE OF PIN #1 IDENTIFICATION IS OPTIONAL L E2/2 D2/2 8 (11) DA9285.004 13 July 2006 SOLDERING INFORMATION (QFN-6) N For Lead-Free / RoHS Compliant Green QFN 2mm x 2mm x 0.75mm Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Lead Finish According to RSH test IEC 68-2-58/20 260°C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org 7.62 - 25.4 µm, Matte Tin EMBOSSED TAPE SPECIFICATIONS (QFN-6) PO P2 P1 DO X E 10 O T MAX W F B0 X User Direction of Feed A0 K0 Detail X-X Dimension Ao Bo Do E F Ko Po P1 P2 T W Min/Max 2.30 ±0.05 2.30 ±0.05 1.50 +0.1/-0.0 1.75 ±0.10 3.50 ±0.05 1.00 ±0.05 4.0 4.0 ±0.10 2.0 ±0.05 0.254 ±0.02 8.00 ±0.3/-0.1 Unit mm mm mm mm mm mm mm mm mm mm mm 9 (11) DA9285.004 13 July 2006 REEL SPECIFICATIONS (QFN-6) W2 A D B Tape Slot for Tape Start C N W1 Carrier Tape Cover Tape End Start Trailer Components Leader Dimension A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader Min 1.5 12.80 20.2 50 8.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 3000 Components on Each Reel Max 178 13.50 9.90 14.4 Unit mm mm mm mm mm mm mm mm mm Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative 10 (11) DA9285.004 13 July 2006 ORDERING INFORMATION Package Tested wafers 215 µm TSOT-6 Pb-free, RoHS compliant MAS9285A1HU06 IC FOR XO Trimming QFN-6 Pb-free, RoHS compliant Please contact Micro Analog Systems Oy for other wafer thickness options. Product Code MAS9285A1TG00 MAS9285A1GC06 Product IC FOR XO Trimming IC FOR XO Trimming Comments Die size 794 x 940 µm T&R/3000 pcs/reel T&R/3000 pcs/reel LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 11 (11)