71M6601

19-5704; Rev 6/11 A Maxim Integrated Products Brand 71M6103/71M6113/ 71M6201/71M6203/ 71M6601/71M6603 Isolated Sensor ICs DATA SHEET June 2011 GENERAL DESCRIPTION The 71M6103/71M6113/71M6201/71M6203/71M6601/71M6603 (71M6xxx) isolated sensor ICs enable Teridian’s 4th-generation polyphase-metering 71M654x systems-on-chips (SoCs) to use nonisolating sensors such as resistive shunts without the need for costly and nonlinear isolation transformers or CTs. Isolation is provided by low-cost pulse transformers that form a bidirectional digital communication link between the 71M654x and the isolated sensor ICs. The 71M6xxx isolated sensor ICs contain a 22-bit delta-sigma ADC, an amplifier with differential inputs, a precision voltage reference, a temperature sensor, and a supply voltage generator that is energized by power pulses provided by the 71M654x. In conjunction with the 71M654x metering SoCs, the isolated sensor ICs offer unprecedented BOM cost reduction, immunity to magnetic tampering, and enhanced reliability for single-phase and polyphase applications. FEATURES • 0.1% Accuracy Over 2000:1 Current Range • Exceeds IEC 62053/ANSI C12.20 Standards • Compatible with Shunt Resistors as Low as 50µΩ • On-Chip Temperature Sensor Enables Localized Digital Temperature Compensation by the 71M654x • 22-Bit ADC • Powered from the 71M654x Using Pulses Sent Through the Transformer • 3.3mW Typical Consumption • On-Chip Power Monitoring • Industrial Temperature Range • 8-Pin Lead(Pb)-Free SO Package C NEUTRAL B A Shunt Current Sensors LOAD POWER SUPPLY NEUTRAL Note: This system is referenced to Neutral 3x TERIDIAN 71M6xx3 MUX and ADC IADC0 IADC1 }IN* VADC10 (VC) IADC6 IADC7 }IC VADC9 (VB) IADC4 IADC5 }IB VADC8 (VA) IADC2 IADC3 }IA VREF SERIAL PORTS V3P3A V3P3SYS GNDA GNDD PWR MODE CONTROL WAKE-UP REGULATOR VBAT VBAT_RTC BATTERY MONITOR RTC BATTERY BATTERY 71M6xx3 71M6xx3 Resistor Dividers Pulse Transformers 71M6xx3 TERIDIAN 71M6543F/ 71M6543H TEMPERATURE SENSOR RAM COMPUTE ENGINE FLASH MEMORY COM0...5 SEG SEG/DIO LCD DRIVER DIO, PULSES DIO LCD DISPLAY AMR TX RX MODUL- RX ATOR TX POWER FAULT COMPARATOR 8888.8888 PULSES, DIO I2C or µWire EEPROM 32 kHz IR MPU RTC TIMERS ICE V3P3D OSCILLATOR/ PLL XIN XOUT 9/17/2010 HOST SPI INTERFACE *IN = Neutral Current v1.2 © 2008–2011 Teridian Semiconductor Corporation 1 PDS_6xxx_010 71M6xxx Data Sheet Table of Contents 1 2 3 3.1 3.2 Hardware Description ............................................................................................................ 4 Functional Description .......................................................................................................... 4 Applications Information ....................................................................................................... 5 Product Selection.................................................................................................................. 5 External Components for the 71M6xxx ................................................................................ 6 3.2.1 Current Sensor Side .................................................................................................... 6 3.2.2 Pulse Transformer ....................................................................................................... 6 3.3 3.4 3.5 4 4.1 4.2 4.3 4.4 Connections to Sensors and to the 71M654x ...................................................................... 7 PCB Layout Considerations ................................................................................................. 9 Compatibility with the 71M654x.......................................................................................... 10 Specifications ...................................................................................................................... 11 Absolute Maximum Ratings................................................................................................ 11 Recommended External Components ............................................................................... 11 Recommended Operating Conditions................................................................................ 11 Performance Specifications ............................................................................................... 12 4.4.1 Supply Current .......................................................................................................... 12 4.4.2 Power and Data Pulses ............................................................................................. 12 4.4.3 VCC Voltage Monitor ................................................................................................. 12 4.4.4 Temperature Sensor.................................................................................................. 12 4.4.5 VREF Performance Specifications ............................................................................. 13 4.4.6 ADC Converter .......................................................................................................... 14 4.5 4.6 4.7 4.8 5 6 7 T ypical Performance Data .................................................................................................. 15 Package Outline Drawing ................................................................................................... 16 IC Pinout .............................................................................................................................. 17 Pin Description.................................................................................................................... 17 Ordering Information ........................................................................................................... 18 Related Information ............................................................................................................. 18 Contact Information ............................................................................................................. 18 v1.2 © 2008–2011 Teridian Semiconductor Corporation 2 PDS_6xxx_010 71M6xxx Data Sheet Figures Figure 1: Block Diagram .......................................................................................................................... 4 Figure 2: External Components Connected to the 71M6xxx ..................................................................... 7 Figure 3: Current Sensors Connected to the 71M6541D/F Using One 71M6x01....................................... 8 Figure 4: Current Sensors Connected to the 71M6543F/H or 71M6545/H with Three 71M6xx3 ................ 9 Figure 5: Copper Separation and Signal Traces for a Polyphase PCB.................................................... 10 Figure 6: Wh Error at Room Temperature (71M6203, 100A/0.1A, 60Hz/240V AC) ................................. 15 Figure 7: VARh Error at Room Temperature (71M6203, 100A/0.1A, 60Hz/240V AC) ............................. 15 Figure 8: SOIC-8 Package Outline ......................................................................................................... 16 Figure 9: Pinout for 8-Pin SO Package .................................................................................................. 17 Tables Table 1: Remote Interface Commands..................................................................................................... 5 Table 2: Product Variations...................................................................................................................... 6 Table 3: Absolute Maximum Ratings ...................................................................................................... 11 Table 4: Recommended External Components ...................................................................................... 11 Table 5: Recommended Operating Conditions ....................................................................................... 11 Table 6: Supply Current Performance Specifications.............................................................................. 12 Table 7: Timing Specifications for Power and Data Pulses ..................................................................... 12 Table 8: VCC Voltage Monitor Specifications ......................................................................................... 12 Table 9: Temperature Sensor Specifications .......................................................................................... 12 Table 10: VREF Performance Specifications.......................................................................................... 13 Table 11: ADC Converter Specifications ................................................................................................ 14 Table 12: Pin Description ....................................................................................................................... 17 Table 13: Product Variations.................................................................................................................. 18 Table 14: Packaging Information, Corresponding CE Codes, and Ordering Numbers ............................. 18 v1.2 © 2008–2011 Teridian Semiconductor Corporation 3 PDS_6xxx_010 71M6xxx Data Sheet 1 HARDWARE DESCRIPTION The 71M6103/71M6113/71M6201/71M6203/71M6601/71M6603 (71M6xxx) remote sensor ICs integrate all functional blocks required to implement an isolated front-end with digital communication capability. Figure 1 shows the 71M6xxx IC block diagram. The chip includes the following: • • • • • • • • • Preamplifier with a fixed gain 22-bit delta-sigma ADC ADC voltage reference Temperature sensor VCC monitor Power-on reset circuitry Bidirectional pulse interface Active rectifiers for supply-voltage generation from the power pulses provided by the 71M654x Digital control section providing control registers for the selection of operation modes INP + SHUNT INN + CROSS ADC_CLK PREAMP ADC VREF VBIAS ADC_OUT BUFFER VCC 1:1.1 To 71M654X SP PLL PULSEIO SN RD_DATA VDD RD_CLK WR_DATA RD_DATA DIGITAL SECTION RESET DATA_IN[15:0] ACTIVE RECTIFIERS CHOP BAND GAP IBIAS TEMP/VCC MONITOR Primary Secondary POWER ON RESET OTP MEMORY GND VCC TEST Figure 1: Block Diagram 2 FUNCTIONAL DESCRIPTION During normal operation, the SP and SN pins of the 71M6xxx are connected to the pulse transformer. When PLL_FAST = 1 in the 71M654x, power pulses generated by the 71M654x arrive every 610.35ns. The PLL in the 71M6xxx locks to these incoming power pulses. The communication between the 71M654x and the 71M6xxx is synchronized to the multiplexer frames of the 71M654x. The communication protocol is Teridian-proprietary, and details are not described in this data sheet. All aspects of the communication between the 71M654x and the 71M6xxx are managed on the hardware level and they are completely transparent to the user. The communication interface can run at two different data rates. Power pulses are generated every 610.35ns if the PLL_FAST register in the 71M654x is set to 1, and every 1.905µs if PLL_FAST is set to 0. The power pulses are 101.7ns wide with PLL_FAST = 1, and 160ns wide with PLL_FAST = 0. v1.2 © 2008–2011 Teridian Semiconductor Corporation 4 PDS_6xxx_010 71M6xxx Data Sheet The 71M6xxx isolated sensors provide a continuous data stream of ADC data plus an independent data stream that contains auxiliary information as requested by the 71M654x. The ADC data is processed by CE code in the 71M654x and stored in CE RAM. Auxiliary information is processed by the MPU of the 71M654x using I/O RAM registers. Basic settings and functions of the 71M6xxx can be controlled by various I/O RAM registers in the 71M654x. The command sent towards the 71M6xxx is placed in the RCMD[4:2] register of the 71M654x, with further specification contained in the TMUXRn[2:0] register. Refer to the 71M654x data sheets for details. Table 1 shows the allowable combinations of values in RCMD[4:2] and TMUXRn[2:0] , and the achieved operation along with the type and format of data sent back by the 71M6xxx isolated sensors. T able 1: Remote Interface Commands RCMD[4:2] 001 001 001 001 010 010 010 110 TMUXRn[2:0] 00X 01X 10X 11X 00X 01X 10X 111 Temperature Supply voltage Chip version Reset Read Operation/Command Chip-characteristic temperature data R6K_RD [15:0] TRIMT (see note), use bits [8:1] TRIMBGC (see note), use bits [15:6] TRIMBGA (see note), use bits [15:8] TRIMBGB bits [15:8], TRIMBGD bits [7:0] (see note) Output of the temperature sensor, bits [10:0] Supply voltage measurement , bits [7:0] Chip version code, use bits [15:8] — Note: TRIMBGA to TRIMBGD and TRIMT are values used for characterizing the individual 71M6xxx over temperature. Availability of TRIMBGA to TRIMBGD and TRIMT depends on the part number (see Table 10 for details). The remote interface commands listed in Table 1 enable the 71M654x to gather the following information from the 71M6xxx: • • • • Output of the temperature sensor Information on how the device is characterized over temperature Supply voltage Chip version code The control commands listed in Table 1 enable the 71M654x to initiate the following actions in the 71M6xxx: • • • Read the 71M6xxx temperature sensor Read the 71M6xxx VCC sensor Hardware reset With hardware and temperature characterization information on each connected 71M6xxx isolated sensor available to the 71M654x host MPU, temperature compensation of the energy measurement can be implemented based on the individual temperature characteristics of the 71M6xxx isolated sensors. For example, when the 71M6xxx are used in a polyphase meter containing three shunt resistors, the temperature increase in each 71M6xxx can be monitored and used to compensate for the temperature coefficient of the 71M6xxx VREF and the corresponding shunt resistor. 3 3.1 APPLICATIONS INFORMATION Product Selection A low-noise differential-input preamplifier applies gain to the signal from the current sensor to the optimal input range of the ADC. The current sensor is connected to the inputs of the preamplifier through INP and INN. The output of the preamplifier connects directly to the input of the ADC. See 5 Ordering Information for available part types. Shunt resistances from 736µΩ to as low as 50µΩ can be accommodated, depending on desired current range and part type. v1.2 © 2008–2011 Teridian Semiconductor Corporation 5 PDS_6xxx_010 71M6xxx Data Sheet The shunt resistance must be balanced with the maximum current range of the part type, as shown in Table 2. Various combinations of current ranges and shunt resistance values are possible. However, the shunt resistance for a given current has to be chosen carefully as not to exceed the maximum RMS voltage at the INP/INN pins of the 71M6xxx. The maximum wattage of the shunt resistor is another consideration that applies to the resistance range of the shunt. T able 2: Product Variations 1 Part Application Maximum Current (A) 60 100 200 Accuracy 2 Class (%) 1 1 1 0.5 0.2 0.2 Maximum RMS Voltage at INP/INN (mV) 44 19.6 12.6 Maximum Shunt 3 Resistance (µΩ) 736 196 63 Shunt 4 Power (W) 1.44 1.2 2.0 Typical Shunt 5 Resistance (µΩ) 400 120 50 71M6601 71M6603 71M6103 71M6113 71M6201 71M6203 S P P S P Note 1: S = single phase, P = polyphase. Note 2: Accuracy over temperature (-40°C to +85°C for 71M620x parts, -20°C to +60° for all other parts), when combined with 71M654x or 71M654xH IC. Note 3: Maximum resistance at maximum current. Note 4: P ower at maximum current and typical shunt resistance. Note 5: T ypical resistance values provide room for overhead while maintaining optimum dynamic range. The inputs of the preamplifier are referenced to local ground (the GND pin of the 71M6xxx). This means that in an isolated system, the INP and INN pins have to be biased towards this local GND. See 3.2.1 Current Sensor Side for details. 3.2 3.2.1 External Components for the 71M6xxx Current Sensor Side Figure 2 shows the external components required for the 71M6xxx. It is recommended to use the following components: • • • 1.0µF capacitor between the GND and VCC pins. This capacitor minimizes the VCC ripple voltage. One 1kΩ resistor each from the sensor output pins to GND. These resistors help to bias the input voltage at the INP and INN pins towards GND. In environments where EMC is a concern, ferrite beads can be placed between the sense pins of the shunt resistor and the INP/INN pins of the 71M6xxx. 3.2.2 Pulse Transformer A low-cost pulse transformer is used for the link between the 71M654x and the 71M6xxx. It is the responsibility of the meter system designer to qualify the transformer used in the system over the required operating temperature range. The following commercially available transformer is suitable for this application: • W ürth Electronics Midcom Inc., P/N 750-11-0056 REV 2 (www.midcom-inc.com) v1.2 © 2008–2011 Teridian Semiconductor Corporation 6 PDS_6xxx_010 71M6xxx Data Sheet Current Shunt Sensor Load R1 1 k Ω TERIDIAN 71M6xxx 5 NC R2 1 k Ω 7 1 6 VCC INP INN C1 1. 0 µF TEST Voltage Sensing 8 2 3 Pulse Transformer V3P3A TERIDIAN 71M654x Figure 2: External Components Connected to the 71M6xxx 3.3 Connections to Sensors and to the 71M654x Figure 3 shows the sensor connections for single-phase meter application using a 71M6541D/F and 71M6x01. This single-phase configuration uses one local shunt and one shunt isolated with a 71M6x01 device. Since the local shunt is connected to the LINE circuit, the meter is also referenced to the LINE circuit. Figure 4 shows the sensor connections for a polyphase meter application using a 71M6543F/H or 71M6545/H. This polyphase configuration uses three 71M6xx3 to isolate the shunt sensors for the three phases, while a locally connected fourth shunt sensor can be optionally used to sense neutral current. Since the local shunt is connected to the neutral circuit, the meter is also referenced to the neutral circuit. v1.2 © 2008–2011 Teridian Semiconductor Corporation IAN IAP VA GND 4 SN SP 7 PDS_6xxx_010 Shunt LOAD LINE 71M6xxx Data Sheet NEUTRAL Shunt Note: This system is referenced to LINE NEUTRAL LINE POWER SUPPLY Resistor Divider TERIDIAN 71M6x01 MUX and ADC IAP IAN Pulse Transformer VA IBP IBN VREF SERIAL PORTS V3P3A V3P3SYS GNDA GNDD PWR MODE CONTROL LINE TERIDIAN 71M6541D/F WAKE-UP REGULATOR VBAT VBAT_RTC BATTERY MONITOR RTC BATTERY BATTERY TEMPERATURE SENSOR RAM COMPUTE ENGINE FLASH MEMORY COM0...5 SEG SEG/DIO LCD DRIVER DIO, PULSES DIO LCD DISPLAY AMR TX RX MODUL- RX ATOR TX POWER FAULT COMPARATOR 8888.8888 PULSES, DIO I2C or µWire EEPROM 32 kHz IR MPU RTC TIMERS ICE V3P3D OSCILLATOR/ PLL XIN XOUT HOST SPI INTERFACE 11/5/2010 Figure 3: Current Sensors Connected to the 71M6541D/F Using One 71M6x01 v1.2 © 2008–2011 Teridian Semiconductor Corporation 8 PDS_6xxx_010 Shunt Current Sensors LOAD 71M6xxx Data Sheet C NEUTRAL B A POWER SUPPLY NEUTRAL Note: This system is referenced to Neutral 3x TERIDIAN 71M6xx3 MUX and ADC IADC0 IADC1 }IN* VADC10 (VC) IADC6 IADC7 }IC VADC9 (VB) IADC4 IADC5 }IB VADC8 (VA) IADC2 IADC3 }IA VREF SERIAL PORTS V3P3A V3P3SYS GNDA GNDD PWR MODE CONTROL WAKE-UP REGULATOR VBAT VBAT_RTC BATTERY MONITOR RTC BATTERY BATTERY 71M6xx3 71M6xx3 Resistor Dividers Pulse Transformers 71M6xx3 TERIDIAN 71M6543F/ 71M6543H TEMPERATURE SENSOR RAM COMPUTE ENGINE FLASH MEMORY COM0...5 SEG SEG/DIO LCD DRIVER DIO, PULSES DIO LCD DISPLAY AMR TX RX MODUL- RX ATOR TX POWER FAULT COMPARATOR 8888.8888 PULSES, DIO I2C or µWire EEPROM 32 kHz IR MPU RTC TIMERS ICE V3P3D OSCILLATOR/ PLL XIN XOUT 9/17/2010 HOST SPI INTERFACE *IN = Neutral Current Figure 4: Current Sensors Connected to the 71M6543F/H or 71M6545/H with Three 71M6xx3 3.4 PCB Layout Considerations To limit emissions and susceptibility to electromagnetic and magnetic fields, the signal wiring between the shunt resistors and the 71M6xxx should be as short as possible and should consist of tightly twisted pair cable. Similarly, the PCB traces between the 71M6xxx and the 71M654x should be routed as short as possible and should be surrounded by grounded copper structures. The trace pairs should be routed as close to each other as permitted by the PCB manufacturer. The copper separation (gap) between the shunt side and the 71M654x side of the signal transformer should be as wide as permitted by the footprint of the transformer, as shown in Figure 5. v1.2 © 2008–2011 Teridian Semiconductor Corporation 9 PDS_6xxx_010 71M6xxx Data Sheet Signal traces Isolation gap T ransformers Figure 5: Copper Separation and Signal Traces for a Polyphase PCB 3.5 Compatibility with the 71M654x The 71M6xxx isolated sensor ICs are designed to be operated in conjunction with the 71M654x energymetering ICs. Operation of the 71M6xxx isolated sensor ICs requires a 71M654x IC with CE code capable of interfacing with the 71M6xxx. CE codes written for operation with CTs do not work with the 71M6xxx. The 71M6xxx isolated sensor ICs are not arbitrarily interchangeable. Each type of the 71M6xxx must be matched with its corresponding CE code in the 71M654x per Table 14. A 71M6xxx remote sensor IC generates unpredictable results when paired with a CE code for a different part number. All 71M6xxx isolated sensor ICs used in a polyphase system must be of the same part number. v1.2 © 2008–2011 Teridian Semiconductor Corporation 10 PDS_6xxx_010 71M6xxx Data Sheet 4 4.1 SPECIFICATIONS Absolute Maximum Ratings Table 3 shows the absolute maximum ranges for the device. Stresses beyond Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation at these or any other conditions beyond those indicated under recommended operating conditions (4.3 Recommended Operating Conditions) is not implied. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. All voltages are with respect to GND. T able 3: Absolute Maximum Ratings SUPPLIES AND GROUND PINS: VCC GND ANALOG INPUT PINS: INP, INN, SP, SN TEMPERATURE: Operating Junction Temperature (Peak, 100ms) Operating Junction Temperature (Continuous) Storage Temperature Range Soldering Temperature (10s duration) -0.5V to 4.6V -0.1V to +0.1V -10mA to +10mA, -0.5V to (VCC + 0.5V) +140°C +125°C -45°C to +165°C +250°C 4.2 NAME C1 R1, R2 Recommended External Components T able 4: Recommended External Components FROM VCC Sensor TO GND GND FUNCTION Bypass capacitor for supply To establish proper bias for INP/INN pins VALUE 1.0 1 UNITS µF kΩ 4.3 Recommended Operating Conditions T able 5: Recommended Operating Conditions PARAMETER VCC Supply Voltage Operating Temperature Range CONDITIONS MIN 2.5 -40 TYP MAX 3.6 +85 UNITS V ⁰C v 1.2 © 2008–2011 Teridian Semiconductor Corporation 11 PDS_6xxx_010 71M6xxx Data Sheet 4.4 Performance Specifications Unless otherwise specified, all parameters listed in this section are valid over the Recommended Operating Conditions provided in Table 5. 4.4.1 Supply Current T able 6: Supply Current Performance Specifications PARAMETER CONDITIONS VCC = 3.3V MIN TYP 0.77 MAX 1.05 UNITS mA VCC Current, Normal Operation 4.4.2 Power and Data Pulses T able 7: Timing Specifications for Power and Data Pulses PARAMETER CONDITIONS Normal operation 71M654x (PLL_FAST = 0) MIN TYP 1.638 0.5249 MAX UNITS MHz Pulse Frequency 4.4.3 VCC Voltage Monitor T able 8: VCC Voltage Monitor Specifications PARAMETER CONDITIONS VCC = 3.2V MIN TYP 138 MAX UNITS LSB V +5 % VCC = 2.8V to 3.6V -5 +5 BNOM: Nominal Value, TA = +22°C VCC Voltage (Note: This is a definition— it is not a measured quantity.) BE: Measurement Error VCC = 3.195 + (BSENSE - 138) x 0.0246 + STEMP x 0.000104 VCC = 3.195 + (BSENSE - 138) x 0.0246 + STEMP x 0.000104 VCC = 2.5V -5 4.4.4 Temperature Sensor T able 9: Temperature Sensor Specifications CONDITIONS VCC = 3.2V 2 PARAMETER TNOM: Nominal Value, TA = +22°C Temperature Equation for: 71M6601, 71M6603, 71M6103 and 71M6113 (Note: This is a definition—it is not a m easured quantity.) Temperature Equation for: 71M6201 and 71M6203 (Note: This is a definition—it is not a measured quantity.) MIN TYP 870 MAX UNITS LSB TEMP = STEMP x 0.33 - STEMP x 3E-5 + 22 ºC If STEMP < 0: TEMP = STEMP x 0.33 - STEMP2 x 3E-5 + 22 If STEMP ≥ 0: TEMP = STEMP x (63 / TRIMBGA) + 22 VCC = 2.8V to -5 Temperature = 3.6V -40°C, -10°C, VCC = +55°C, +85°C 2.5V to -6.5 2.79V VCC = 3.0V 15 ⁰C +5 ºC +6.5 30 ms Temperature Error (Note 1) TETIME: Duration of Temperature Measurement Note 1: G uaranteed by design; not production tested. v 1.2 © 2008–2011 Teridian Semiconductor Corporation 12 PDS_6xxx_010 71M6xxx Data Sheet 4.4.5 VREF Performance Specifications T able 10: VREF Performance Specifications PARAMETER CONDITIONS 71M6201, 71M6203, 71M6113: TA = +22°C 71M6601, 71M6603, 71M6103: TA = +22°C MIN 1.193 1.180 TYP 1.195 1.195 8 -1.5 -2 -22 0 2 Table 10 shows the performance specifications for the ADC reference voltage (VREF). MAX 1.197 UNITS VREF Output Voltage V 1.210 kΩ +1.5 mV/V VCC = 2.5V to 3.6V VREF(CROSS = 1) VREF(CROSS = 0) +2 +22 mV V VREF Output Impedance VREF Power-Supply Sensitivity: ΔVREF/ΔVCC VREF Chop Step (Trimmed) VNOM Definition ILOAD = 10µA, -10µA on TMUXOUT VCC = 2.8V to 3.6V VNOM(T) = VREF(22) + (T - 22)TC1 + (T - 22) TC2 71M6201 AND 71M6203 (0.2% ACCURACY CLASS) VNOM Temperature Coefficients: TC1, TC2 TC1 = 0.0538 x TRIMT + 1.587(TRIMBGB - TRIMBGD) + 27.279 TC2 = -0.433 - TRIMT x 0.000854 VREF(T) Deviation from VNOM(T) (Note 1) 71M6113 (0.5% ACCURACY CLASS) VNOM Temperature Coefficients: TC1, TC2 VREF(T) Deviation from VNOM(T) (Note 1) TC1 = 251 - TRIMT x 4.60 TC2 = -0.433 - TRIMT x 0.000854 µV/°C µV/°C2 +50 ppm/°C µV/°C µV/°C2 +15 ppm/°C VREF (T ) − VNOM (T ) 10 6 VNOM (T ) 62 -15 VREF (T ) − VNOM (T ) 10 6 VNOM (T ) 62 -50 71M6601, 71M6603, AND 71M6103 (1% ACCURACY CLASS) VNOM Temperature Coefficients: TC1, TC2 TC1 = -34.8 TC2 = -0.599 µV/°C µV/°C2 -100 +100 ppm/°C VREF(T) Deviation from VNOM(T) (Note 1) VREF (T ) − VNOM (T ) 10 6 VNOM (T ) 45 Note 1: G uaranteed by design; not production tested. v 1.2 © 2008–2011 Teridian Semiconductor Corporation 13 PDS_6xxx_010 71M6xxx Data Sheet 4.4.6 ADC Converter T able 11: ADC Converter Specifications PARAMETER CONDITIONS INP and INN at INP GND potential INN VIN = 65Hz, 64kpts FFT, Blackman-Harris window MIN TYP 22 22 -85 MAX UNIT S µA dB Input Current THD (First 10 Harmonics) v 1.2 © 2008–2011 Teridian Semiconductor Corporation 14 PDS_6xxx_010 71M6xxx Data Sheet 4.5 Typical Performance Data Wh Polyphase Load Line with 50µΩ Shunts 0.5 0.4 0° 60° 300 ° 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 180° 0.1 1 10 100 Figure 6: Wh Error at Room Temperature (71M6203, 100A/0.1A, 60Hz/240V AC) VARh Polyphase Load Line with 150µΩ Shunt 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0.1 1 10 100 90° 150° Figure 7: VARh Error at Room Temperature (71M6203, 100A/0.1A, 60Hz/240V AC) v 1.2 © 2008–2011 Teridian Semiconductor Corporation 15 PDS_6xxx_010 71M6xxx Data Sheet 4.6 Package Outline Drawing 10 Controlling dimensions are in mm. 9 2.465 5.99 +0.21 -0.05 1.97 5° +3° -5° PARTING LINE 0.64 +0.25 5 -0.23 DETAIL A COO TOP VIEW 1.27 BSC 0.41 +0.08 -0.06 BOTTOM VIEW SEE DETAIL A 1.47 +0.08 -0.07 3 0.33 ±0.08 x 45° 8 1.63 +0.10 -0.08 4.93 -0.13 +0.05 4 SIDE VIEW 0.15 +0.1 0.023 SEATING PLANE 3.94 4 +0.05 -0.13 END VIEW 0.20 +0.05 -0.01 NOTES: 3 4 REFERENCE DATUM LENGTH AND WIDTH ARE REFERENCE DATUMS AND DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS, BUT INCLUDE MOLD MISMATCH. MEASURED AT THE MOLD PARTING LINE. PROTRUSIONS DO NOT EXCEED 0.1524 mm AT END AND 0.254 mm AT WINDOW. LENGTH OF TERMINAL FOR SOLDERING TO SUBSTRATE FORMED LEADS ARE PLANAR WITH RESPECT TO EACH OTHER WITHIN 0.735 mm AT SEATING PLANE. THE APPEARANCE OF PIN #1 I.D. IS OPTIONAL. COUNTRY OF ORIGIN LOCATION ON PACKAGE BOTTOM IS OPTIONAL AND DEPENDS ON ASSEMBLY LOCATION. PACKAGE IS COMPLIANT WITH JEDEC STANDARD MS-012. DIMENSIONING AND TOLERANCES PER ANSI Y14.5 M - 1982 5 8 9 10 Figure 8: SOIC-8 Package Outline v 1.2 © 2008–2011 Teridian Semiconductor Corporation 16 PDS_6xxx_010 71M6xxx Data Sheet 4.7 IC Pinout 1 2 3 4 8 7 6 5 VCC SP SN GND TEST INN INP NC Figure 9: Pinout for 8-Pin SO Package 4.8 Pin Description T able 12: Pin Description Pin 1 2 3 4 5 6 7 8 Name VCC SP SN GND NC INP INN TEST Function Supply Voltage Output. A 1.0µF capacitor to GND should be provided. Positive Bidirectional Communication Port for the Connection of the Pulse Transformer Negative Bidirectional Communication Port for the Connection of the Pulse Transformer Ground (Local Ground). The voltage at the INP and INN pins references to this pin. No Connection. No connections must be made to this pin. Positive Analog Input from Sensor. This input must be biased towards GND with a 1kΩ resistor. Negative Analog Input from Sensor. This input must be biased towards GND with a 1kΩ resistor. Input Used in Factory for Test Purposes. This pin must be connected to GND. v 1.2 © 2008–2011 Teridian Semiconductor Corporation 17 PDS_6xxx_010 71M6xxx Data Sheet 5 ORDERING INFORMATION T able 13: Product Variations Part Application Rated Current (A) Max Input Voltage at INP-INN Pins (mV) 44 Temp Range (°C) Recommended Typ Operating Meter Accuracy Temp Range Class (°C) (%) -20 to +60 1 1 100 19.6 -40 to +85 -20 to +60 0.5 0.2 196 M ax Shunt Resistance (µΩ ) 736 71M6601 71M6603 71M6103 71M6113 71M6201 71M6203 1-phase 60 3-phase 3-phase 3-phase 1-phase 200 3-phase 12.6 -40 to +85 63 T able 14: Packaging Information, Corresponding CE Codes, and Ordering Numbers Part 71M6601 71M6601 71M6603 71M6603 71M6103 71M6103 71M6113 71M6113 Packaging bulk tape and reel bulk tape and reel bulk tape and reel bulk tape and reel 71M654x CE Code EQU0-60 EQU5-60 EQU5-100 EQU5-100 EQU1-200, EQU2-200 EQU5-200 Ordering Number 71M6601-IL/F 71M6601-ILR/F 71M6603-IL/F 71M6603-ILR/F 71M6103-IL/F 71M6103-ILR/F 71M6113-IL/F 71M6113-ILR/F 71M6201-IL/F 71M6201-ILR/F 71M6203-IL/F 71M6203-ILR/F 71M6201* bulk 71M6201* tape and reel 71M6203* bulk 71M6203* tape and reel Note: All devices are lead(Pb)-free/RoHS-compliant packages. *Future product—contact factory for availability. 6 RELATED INFORMATION 71M6543F/H Data Sheet 71M6541D/F-71M6542F Data Sheet 71M6545/H Data Sheet The following documents related to the 71M6xxx are available from Teridian: 7 CONTACT INFORMATION For technical support or more information about Maxim products, contact technical support at www.maxim-ic.com/support. v 1.2 © 2008–2011 Teridian Semiconductor Corporation 18 PDS_6xxx_010 71M6xxx Data Sheet REVISION HISTORY REVISION NUMBER 1.0 1.1 1.2 REVISION DATE 12/10 3/11 6/11 DESCRIPTION Initial release Figure 1, page 4 (transformer turns ratio 1:1.1) Table 9, page 12 Table 14, page 18 Removed future status from the 71M6113 parts in Table 14 PAGES CHANGED — 4, 12, 18 18 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600  2011 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products.