0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
MAX14500

MAX14500

  • 厂商:

    MAXIM(美信)

  • 封装:

  • 描述:

    MAX14500 - Hi-Speed USB-to-SD Card Readers with Bypass - Maxim Integrated Products

  • 数据手册
  • 价格&库存
MAX14500 数据手册
19-4117; Rev 1; 4/09 KIT ATION EVALU ABLE AVAIL Hi-Speed USB-to-SD Card Readers with Bypass General Description Features ♦ USB 2.0 Hi-Speed and Full-Speed Compliant ♦ SDHC Card Support ♦ Internal Hi-Speed USB SD Card Reader Eases Host µP Overhead ♦ On-Chip Termination and Pullup Resistors ♦ Internal SD Switches Allow For Multiplexing Two SD Cards on a Single-Microprocessor SD Port ♦ Accommodates Clock Input Frequencies 26MHz, 19.2MHz, 13MHz, and 12MHz ♦ Internal Clock Squarer for Low-Amplitude TCXO Signals ♦ No Power-Supply Sequencing Required ♦ Compatible with +1.8V to +3.3V I/O Host Microprocessor ♦ Simple Control Mode Requires Only a Single GPIO ♦ I2C Control Provides Multiple Configuration Options ♦ I2C Control Required for Two SD Cards ♦ On-Chip Power-On Reset/Brown-Out Reset MAX14500–MAX14503 The MAX14500–MAX14503 USB-to-SD™ card readers provide a means for portable devices that support fullspeed USB communication (12Mbps) with one or two SD card slots, upgrading the USB SD card reader function to USB Hi-Speed (480Mbps) operation. The MAX14500–MAX14503 have two modes of operation: Pass Thru and Card Reader. In pass thru, the SD and USB signals pass through the MAX14500–MAX14503 without modification, appearing like the device is not present. The host microprocessor firmware does not need modification, as there is no change from the host microprocessor’s perspective. In Card Reader mode, the MAX14500–MAX14503 implement a Hi-Speed USB card reader that operates independently of the host microprocessor. All the capabilities of the full-speed USB port and SD card slot are preserved with the additional feature that allows a faster way for a PC to read or write to the SD card. The MAX14500–MAX14503 support SD high capacity SDHC cards. The 40-pin TQFN version supports one SD card, while the 56-bump WLP version supports two SD cards. The MAX14500–MAX14503 feature advanced powersaving modes to reduce power consumption in portable applications. The low-power Sleep modes allow the ability to disable internal circuit blocks, providing power-saving operating modes. The default clock input for each part number is specified in the ordering information. The MAX14500–MAX14503 feature the option to change the default values using the I2C interface. The MAX14500–MAX14503 are available in 5mm x 5mm, 40-pin TQFN, and 3.23mm x 3.5mm, 56-bump WLP packages. These devices operate over a wide supply voltage range and are specified over the -40°C to +85°C extended temperature range. Ordering Information/ Selector Guide PART MAX14500ETL+* MAX14500AEWN+* MAX14501ETL+* MAX14501AEWN+* MAX14502 AETL+ MAX14502AEWN+* MAX14503ETL+* MAX14503AEWN+* INPUT SD FREQUENCY CARDS (MHz) 12 12 13 13 19.2 19.2 26 26 1 2 1 2 1 2 1 2 PINPACKAGE 40 TQFN-EP** 56 WLP 40 TQFN-EP** 56 WLP 40 TQFN-EP** 56 WLP 40 TQFN-EP** 56 WLP Applications Cell Phones PDAs MP3 Players Digital Still Cameras GPS Note: All devices are specified over the -40°C to +85°C operating temperature range. +Denotes a lead(Pb)-free/RoHS-compliant package. *Future product—contact factory for availability. **EP = Exposed pad. SD is a trademark of the SD Card Association. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 ABSOLUTE MAXIMUM RATINGS (All voltages referenced to GND.) VCC ...........................................................................-0.3V to +4V VSD ...........................................................................-0.3V to +4V VIO ............................................................................-0.3V to +4V VTM ...........................................................................-0.3V to +4V KVBUS......................................................................-0.3V to +4V CLDO........................................................................-0.3V to +2V CDAT1_[3:0], HDAT1_[3:0], CCMD1, HCMD1, CCLK1, HCLK1, CCRD_PRST, HCRD_PRST, CDAT2_[3:0], HDAT2_[3:0], CCMD2, HCMD2, CCLK2, HCLK2 .........-0.3V to (VSD + 0.3V) BUSY, BERR/INT, MODE, SCL, SDA, I2C_SEL, ADD, RST.................................................-0.3V to (VIO + 0.3V) CD+, CD-, HD+, HD-, RREF, FREF ............-0.3V to (VTM + 0.3V) Continuous Power Dissipation (TA = +70°C) 40-Pin TQFN (derate 35.7mW/°C above +70°C) ........2857mW Junction-to-Case Thermal Resistance (θJC) (Note 1) 40-Pin TQFN ................................................................1.7°C/W Junction-to-Ambient Thermal Resistance (θJA) (Note 1) 40-Pin TQFN .................................................................28°C/W Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10s) .................................+300°C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +2.4V to +3.6V, VSD = +2.4V to +3.6V, VIO = +1.5V to +3.6V, VTM = +2.91V to +3.4V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C.) (Note 2) PARAMETER DC CHARACTERISTICS Pass thru VCC Supply Voltage VCC Card reader active, fCCLK_ ≤ 26MHz Card reader active, fCCLK_ > 26MHz Pass thru VSD Supply Voltage Logic Interface Supply Voltage USB Supply Voltage Digital Core LDO Regulator Output Voltage VCC Supply Current VSD Supply Current VIO Supply Current VTM Supply Current VSD Comparator Threshold VTM Comparator Threshold MODE, I2C_SEL, ADD, RST Input-Voltage Low VSD VIO VTM VCLDO ICC ISD IIO ITM VSDCT VTMCT VIL CCLDO = 1.0µF Pass thru Card reader active Pass thru Card reader active Pass thru Card reader active Pass thru Card reader active 1.0 2.0 Card reader active, fCCLK_ ≤ 26MHz Card reader active, fCCLK_ > 26MHz 2.1 2.1 2.4 2.0 2.0 2.4 1.5 2.91 1.8 5 35 17 3 2 0.2 13 25 1.5 2.5 1.9 2.9 0.4 50 10 15 50 40 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.4 V V V µA mA µA mA µA mA µA mA V V V V V SYMBOL CONDITIONS MIN TYP MAX UNITS 2 _______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass ELECTRICAL CHARACTERISTICS (continued) (VCC = +2.4V to +3.6V, VSD = +2.4V to +3.6V, VIO = +1.5V to +3.6V, VTM = +2.91V to +3.4V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C.) (Note 2) PARAMETER MODE, I2C_SEL, ADD, RST Input-Voltage High BUSY, BERR/INT Output-Voltage Low BUSY, BERR/INT Output-Voltage High I2C_SEL, ADD, RST Input Leakage Current MODE Input Resistance to GND FREF Full-Swing Input-Voltage High FREF Full-Swing Input-Voltage Low FREF Low-Amplitude InputVoltage Low FREF Input Leakage Current FREF Input Resistance KVBUS Comparator Threshold KVBUS Comparator Hysteresis KVBUS Comparator Input Impedance SDA/SCL Input Low Voltage SDA/SCL Input High Voltage VTH VHYS RIN VIL_I2C VIH_I2C VIO > +2V, 3mA sink current SDA Output Logic-Low SDA/SCL Input Leakage Current SD CARD INTERFACE On-Resistance Off-Leakage Current Off-Capacitance On-Capacitance Pullup Resistance Output High Voltage Output Low Voltage RON IILSD CSD_OFF CSD_ON RPU VOH VOL VTEST = 0 or VSD, ITEST = 10mA (Note 3) VTEST = 0 or VSD (Note 3) (Note 4) (Note 5) CCMD1, CCMD2, CDAT1_[3:0], CDAT2_[3:0] IOH = -100µA IOL = 100µA 50 0.75 x VSD 0.125 x VSD -1 5 10 75 100 10 +1 Ω µA pF pF kΩ V V VOL_I2C IIN_I2C VIO ≤ +2V, 3mA sink current 0.7 x VIO 0 0 -10 0.4 0.2 x VIO +10 V µA 10 0.3 x VIO SYMBOL VIH VOL VOH IIL RMODE VIH VIL VIL IILF Full-Swing mode Low-Amplitude input mode 1.0 200 -10 1 1.25 20 1.5 +10 ILOAD = 1mA ILOAD = -1mA VIO 0.4 -1 150 1.3 0.4 300 +1 500 CONDITIONS MIN 2/3 x VIO 0.4 TYP MAX UNITS V V V µA kΩ V V mV µA MΩ V mV MΩ V V MAX14500–MAX14503 _______________________________________________________________________________________ 3 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 ELECTRICAL CHARACTERISTICS (continued) (VCC = +2.4V to +3.6V, VSD = +2.4V to +3.6V, VIO = +1.5V to +3.6V, VTM = +2.91V to +3.4V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C.) (Note 2) PARAMETER SYMBOL VSD < 2.4V Input High Voltage VIH VSD ≥ 2.4V VSD < 2.4V Input Low Voltage VIL VSD ≥ 2.4V USB INTERFACE On-Resistance On-Resistance Flatness On-Capacitance Off-Capacitance AC CHARACTERISTICS (Note 6) SD CARD CLOCK TIMING (CCLK_), DEFAULT SPEED (Figure 5a) Clock Low Time Clock High Time Clock Rise Time Clock Fall Time Clock Low Time Clock High Time Clock Rise Time tWL tWH tTLH tTHL tWL tWH tTLH CL = 10pF CL = 10pF CL = 10pF CL = 10pF CL = 40pF CL = 40pF CL = 40pF 7 7 3 3 5 2 14 2.5 400 5 250 0.6 19 19 10 10 ns ns ns ns ns ns ns ns ns ns ns ns kHz pF ns µs RON RONFLAT CON_USB COFF_USB VCD_ = 0 or VTM, switch closed VCD_ = 0 to 3.3V, VTM = +3.3V Switch closed, measured from CD+ and CDSwitch open, measured from CD+, CD-, HD+, HD5 2 12 6 Ω Ω pF pF CONDITIONS MIN 0.8 x VSD 0.625 x VSD 0.2 x VSD 0.25 x VSD V TYP MAX UNITS V SD CARD CLOCK TIMING (CCLK_), HI-SPEED (Figure 5b) Clock Fall Time tTHL CL = 40pF SD CARD COMMAND TIMING (CCMD1, CCMD2) (Figure 5b) Input Setup Time tISU Input Hold Time Output Delay Time During Data Transfer Mode Output Hold Time I2C CHARACTERISTICS SCL Clock Frequency SDA, SCL Capacitance SDA Output Fall Time Hold Time After Repeated START fSCL CIO_I2C tOF_I2C tHD,STA tIH tODLY tOH 4 _______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 ELECTRICAL CHARACTERISTICS (continued) (VCC = +2.4V to +3.6V, VSD = +2.4V to +3.6V, VIO = +1.5V to +3.6V, VTM = +2.91V to +3.4V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C.) (Note 2) PARAMETER Clock Low Period Clock High Period Setup Time for Repeated START Hold Time for Data Setup Time for Data SDA/SCL Input Fall Time SDA/SCL Rise Time Setup Time for STOP Bus Free Time Between STOP and START SYMBOL tLOW_I2C tHIGH_I2C tSU,STA tHD,DAT tSU,DAT tF_I2C tR_I2C tSU,STO tBUF 0.6 1.3 100 300 300 CONDITIONS MIN 1.3 0.6 0.6 0 0.9 TYP MAX UNITS µs µs µs µs ns ns ns µs µs USB HI-SPEED SOURCE ELECTRICAL CHARACTERISTICS (VCC = +2.4V to +3.6V, VSD = +2.4V to +3.6V, VIO = +1.5V to +3.6V, VTM = +2.91V to +3.4V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C.) (Note 2) PARAMETER DC CHARACTERISTICS Hi-Speed Squelch Detection Threshold (Diff Signal Amplitude) Hi-Speed Differential Input Signaling Levels Hi-Speed Data Signaling Common-Mode Voltage Range Hi-Speed Idle Level Hi-Speed Data Signaling High Hi-Speed Data Signaling Low Chirp J Level (Differential Voltage) Chirp K Level (Differential Voltage) Termination Voltage (Hi-Speed) AC CHARACTERISTICS Rise Time Fall Time Driver Waveform Requirements Driver-Output Resistance Source Jitter Total (Including Frequency Tolerance) ZHSDRV Specified by Hi-Speed transmit eye diagram tHSR tHSF (Note 6) (Note 6) Specified by Hi-Speed transmit eye diagram 500 500 See the Typical Operating Characteristics section 40.5 49.5 Ω ps ps VHSSQ VIL SCM VHSOI VHSOH VHSOL VCHIRPJ VCHIRPK VHSTERM (Note 6) Specified by Hi-Speed receive eye diagram (Note 6) -50 -10 360 -10 700 -900 -10 +500 +10 440 +10 1100 -500 +10 mV mV mV mV mV mV mV 100 150 mV SYMBOL CONDITIONS MIN TYP MAX UNITS See the Typical Operating Characteristics section _______________________________________________________________________________________ 5 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 USB FULL-SPEED SOURCE ELECTRICAL CHARACTERISTICS (VCC = +2.4V to +3.6V, VSD = +2.4V to +3.6V, VIO = +1.5V to +3.6V, VTM = +2.91V to +3.4V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C.) (Note 2) PARAMETER DC CHARACTERISTICS SE Receiver Input High SE Receiver Input Low Differential Common-Mode Voltage Receiver Differential Input Sensitivity Transmitter High Transmitter Low Transmitter Output Signal Crossover Voltage Bus Pullup Resistor on Upstream Facing Port (Idle Bus) Bus Pullup Resistor on Upstream Facing Port (Upstream Port Receiving) Input Impedance Termination Voltage for Upstream Facing Port Pullup (RPU) AC CHARACTERISTICS Rise Time Fall Time Differential Rise and Fall Time Matching Full-Speed Data Rate tFR tFF tFRFM tFDRATHS (Note 6) 4 4 90 11.994 20 20 111.11 12.030 ns ns % Mbps VIH VIL VCM VDI VOH VOL VCRS RPUI RL = 15kΩ connected to GND RL = 1.5kΩ connected to 3.3V (Note 6) 0.8 0.2 2.8 0 1.3 0.900 1.25 3.6 0.3 2.0 1.575 2.0 0.8 2.0 V V V V V V V kΩ kΩ kΩ VTM V SYMBOL CONDITIONS MIN TYP MAX UNITS RPUA ZINP VTERM 1.425 300 2.5 3.090 Note 2: All parameters are tested at TA = +25°C. Specifications over temperature are guaranteed by design. Note 3: On-resistance is measured by applying voltage and current on the SD card interface (CCLK1, CCMD1, CDAT1_[3:0], CCLK2, CCMD2, CDAT2_[3:0]). Note 4: Off-capacitance measured with SD switch open (CCLK1, HCLK1, CCMD1, HCMD1, CDAT1_[3:0], HDAT1_[3:0], CCLK2, HCLK2, CCMD2, HCMD2, CDAT2_[3:0], HDAT2_[3:0]). Note 5: On-capacitance measured on SD card side (CCLK1, CCMD1, CDAT1_[3:0], CCLK2, CCMD2, CDAT2_[3:0]). Note 6: Specifications guaranteed by design. 6 _______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass Typical Operating Characteristics (VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C, unless otherwise noted.) HI-SPEED EYE DIAGRAM FOR CARD READER MODE MAX14500 toc01 MAX14500–MAX14503 USB ON-RESISTANCE vs. USB COMMON VOLTAGE (VCD_) VTM = 3.3V MAX14500 toc02 10 8 DIFFERENTIAL VOLTAGE RON (Ω) 6 4 2 0 0.9 UNIT TIME INTERVAL 1.3 1.7 2.1 2.5 2.9 3.3 VCD_ COMMON VOLTAGE (V) SD CHANNEL ON-RESISTANCE vs. SD CHANNEL COMMON VOLTAGE MAX14500 toc03 PASS THRU VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE NO CLOCK MAX14500 toc04 35 SD CHANNEL ON-RESISTANCE (Ω) 30 25 20 15 10 5 0 0 VSD = +3V 6 5 SUPPLY CURRENT (µA) 4 3 2 1 0 0.5 1.0 1.5 2.0 2.5 2.0 2.4 2.8 3.2 3.6 SD CHANNEL COMMON VOLTAGE (V) VCC SUPPLY VOLTAGE (V) PASS THRU VIO SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX14500 toc05 PASS THRU VSD SUPPLY CURRENT vs. SUPPLY VOLTAGE NO CLOCK MAX14500 toc06 4 NO CLOCK 30 25 SUPPLY CURRENT (µA) 20 15 10 5 SUPPLY CURRENT (µA) 3 2 1 0 1.5 1.8 2.1 2.4 2.7 3.0 3.3 VIO SUPPLY VOLTAGE (V) 0 1.8 2.1 2.4 2.7 3.0 3.3 VSD SUPPLY VOLTAGE (V) _______________________________________________________________________________________ 7 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Typical Operating Characteristics (continued) (VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C, unless otherwise noted.) PASS THRU VCC SUPPLY CURRENT vs. TEMPERATURE MAX14500 toc07 CARD READER VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX14500 toc08 CARD READER VTM SUPPLY CURRENT vs. SUPPLY VOLTAGE DEVICE ENUMERATED DATA RATE = 0Mbps MAX14500 toc009 10 NO CLOCK 33 DEVICE ENUMERATED DATA RATE = 0Mbps 23 22 SUPPLY CURRENT (mA) 21 20 19 18 8 SUPPLY CURRENT (µA) 6 SUPPLY CURRENT (mA) 32 31 4 2 30 0 -40 -15 10 35 60 85 TEMPERATURE (°C) 29 2.0 2.4 2.8 3.2 3.6 VCC SUPPLY VOLTAGE (V) 17 2.9 3.0 3.1 3.2 3.3 3.4 VTM SUPPLY VOLTAGE (V) PASS THRU USB CHANNEL FREQUENCY RESPONSE -2 -4 -6 ON-LOSS (dB) -8 -10 -12 -14 -16 -18 -20 0.1 1 10 FREQUENCY (MHz) 100 1000 -80 0.1 MAX14500 toc10 PASS THRU SD CHANNEL OFF-ISOLATION MAX14500 toc11 0 0 -20 OFF-ISOLATION (dB) -40 -60 1 10 FREQUENCY (MHz) 100 1000 8 _______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass Pin Description PIN TQFN WLP INPUTS/OUTPUTS 1 2 3 4 C4 A2 B4 A3 I2C_SEL SCL SDA ADD I2C Select Input. I2C_SEL must be connected to VIO or GND at power-up. Drive I2C_SEL low to disable I2C control and drive I2C_SEL high to enable I2C control. I2C Serial-Clock Input. SCL is +3.6V tolerant and the high threshold is set by VIO. If the I2C interface is not used, connect SCL to GND. I2C Serial-Data I/O. SDA is +3.6V tolerant and the high threshold is set by VIO. If the I2C interface is not used, connect SDA to GND. I2C Address Selection Input. Connect ADD to VIO or GND to select between two I2C slave addresses: (GND = 1110 000Xb and VIO = 1110 001Xb). Card Reader Error/Interrupt Output. BERR/INT becomes BERR for simple control and INT for I2C control. BERR/INT goes low to indicate an error in Card Reader mode during simple control and asserts for enabled interrupts during I2C control. Busy Output. BUSY asserts low to indicate device is in Card Reader mode. Card Reader/Pass Thru Mode Select Input. MODE is only active during simple control. Drive MODE low to enable Pass Thru mode and drive MODE high to enable Card Reader mode. For I2C control, MODE must be connected to GND. Reset Input. Drive RST low to reset the internal registers to default values and put all outputs in high impedance. Connect RST to VIO for normal operation. Frequency Input. FREF is the clock input (12MHz/13MHz/19.2MHz/26MHz) for the internal logic and USB PHY. FREF can accept a square-wave or sine-wave clock. An internal clock squaring circuit can be enabled or disabled through I2C. In simple control, the internal clock squarer is enabled by default. Reference Resistor. Connect a Bias Resistor 6.19kΩ ±1% from RREF to GND. USB Analog Switch/Hi-Speed USB Transceiver. CD+ connects to D+ on the USB connector. USB Analog Switch/Hi-Speed USB Transceiver. CD- connects to D- on the USB connector. USB Analog Switch. HD+ connects to D+ on the host side. USB Analog Switch. HD- connects to D- on the host side. USB Bus Power-Supply Detection Input. Connect a resistor-divider between USB VBUS, KVBUS, and GND. NAME FUNCTION MAX14500–MAX14503 6 7 8 B6 A7 C6 BERR/INT BUSY MODE 9 B7 RST 25 E6 FREF 27 USB INTERFACE 22 21 20 19 28 F5 RREF G7 F7 G8 F8 E5 CD+ CDHD+ HDKVBUS SD CARD INTERFACE 13 12 11 C8 B8 C7 CDAT1_0 CDAT1_1 CDAT1_2 SD Card 1 Data Bus Analog Switch/Card Reader Interface. CDAT1_0 connects to DAT0 on the SD card. SD Data Card 1 Bus Analog Switch/Card Reader Interface. CDAT1_1 connects to DAT1 on the SD card. SD Data Card 1 Bus Analog Switch/Card Reader Interface. CDAT1_2 connects to DAT2 on the SD card. _______________________________________________________________________________________ 9 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Pin Description (continued) PIN TQFN 10 34 32 WLP A8 E2 E3 NAME CDAT1_3 CCMD1 CCLK1 FUNCTION SD Card 1 Data Bus Analog Switch/Card Reader Interface. CDAT1_3 connects to DAT3 on the SD card. SD Card 1 Command Analog Switch/Card Reader Interface. CCMD1 connects to CMD on the SD card. SD Card 1 Clock Analog Switch/Card Reader Interface. CCLK1 connects to CLK on the SD card. SD Card 1 Analog Switch for Card Present Detection. CCRD_PRST is the card detection line to the SD socket. When in Pass Thru mode, CCRD_PRST is connected to HCRD_PRST. SD Card 1 Data Bus Analog Switch. HDAT1_0 connects to DAT0 on the SD port of the host µP. SD Card 1 Data Bus Analog Switch. HDAT1_1 connects to DAT1 on the SD port of the host µP. SD Card 1 Data Bus Analog Switch. HDAT1_2 connects to DAT2 on the SD port of the host µP. SD Card 1 Data Bus Analog Switch. HDAT1_3 connects to DAT3 on the SD port of the host µP. SD Card 1 Command Analog Switch. HCMD1 connects to CMD on the SD port of the host µP. SD Card 1 Clock Analog Switch. HCLK1 connects to CLK on the SD port of the host µP. SD Card 1 Analog Switch for Card Present Detection. HCRD_PRST is connected to CCRD_PRST in Pass Thru mode. SD Card 2 Data Bus Analog Switch/Card Reader Interface. CDAT2_0 connects to DAT0 on the SD card. SD Card 2 Data Bus Analog Switch/Card Reader Interface. CDAT2_1 connects to DAT1 on the SD card. SD Card 2 Data Bus Analog Switch/Card Reader Interface. CDAT2_2 connects to DAT2 on the SD card. SD Card 2 Data Bus Analog Switch/Card Reader Interface. CDAT2_3 connects to DAT3 on the SD card. SD Card 2 Command Analog Switch/Card Reader Interface. CCMD2 connects to CMD on the SD card. SD Card 2 Clock Analog Switch/Card Reader Interface. CCLK2 connects to CLK on the SD card. SD Card 2 Data Bus Analog Switch. HDAT2_0 connects to DAT0 on the SD port of the host µP. SD Card 2 Data Bus Analog Switch. HDAT2_1 connects to DAT1 on the SD port of the host µP. 33 F1 CCRD_PRST 17 16 15 14 31 29 30 — — — — — — — — D7 D8 D6 D5 G1 G2 F2 D2 D1 B5 A5 F4 F3 D3 E1 HDAT1_0 HDAT1_1 HDAT1_2 HDAT1_3 HCMD1 HCLK1 HCRD_PRST CDAT2_0 CDAT2_1 CDAT2_2 CDAT2_3 CCMD2 CCLK2 HDAT2_0 HDAT2_1 10 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass Pin Description (continued) PIN TQFN — — — WLP C5 A4 G4 NAME HDAT2_2 HDAT2_3 HCMD2 HCLK2 FUNCTION SD Card 2 Data Bus Analog Switch. HDAT2_2 connects to DAT2 on the SD port of the host µP. SD Card 2 Data Bus Analog Switch. HDAT2_3 connects to DAT3 on the SD port of the host µP. SD Card 2 Command Analog Switch. HCMD2 connects to CMD on the SD port of the host µP. SD Card 2 Clock Analog Switch. HCLK2 connects to CLK on the SD port of the host µP. I/O Logic-Level Translator Voltage. Bypass VIO to GND with a 0.1µF ceramic capacitor. VIO powers the logic inputs/outputs and I2C block. USB Analog Switch and Transceiver Power Supply. Bypass VTM to GND with a 0.1µF ceramic capacitor. Bypass Capacitor for Internal +1.8V LDO. Connect a 1µF ceramic capacitor (X7R, X5R, or better) from CLDO to GND. CLDO must not be used to power external circuitry. Digital Supply Voltage. Bypass VCC to GND with a 1µF ceramic capacitor (X7R, X5R, or better). SD Card Voltage. Bypass VSD to GND with a 1µF ceramic capacitor (X7R, X5R, or better). Ground MAX14500–MAX14503 — G3 POWER SUPPLY 5 23 A6 F6 VIO VTM 38 B1, B2 CLDO 39 40 18, 24, 26, 37 B3, C3 A1 C1, C2, E7, E8, G5, G6 VCC VSD GND NO CONNECTION 35, 36 D4, E4 EXPOSED PAD — — N.C. EP No Connection. Connect N.C. to GND. Exposed Pad. Connect EP to GND. Do not use EP as the sole GND connection. ______________________________________________________________________________________ 11 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 SIMPLE CONTROL SD PORT 1 SWITCHES CCRD_PRST CCLK1 HCRD_PRST HCLK1 HCMD1 HDAT1_[3:0] 4 VIO VIO VSD VSD VCC SD CARD INTERFACE MODE BUSY SD PORT SD SLOT 4 CCMD1 CDAT1_[3:0] I/O LEVEL TRANSLATORS VCC USB HS CARD READER CLDO RREF BERR I2C_SEL ADD SCL SDA VTM HOST PROCESSOR HOST I/O KVBUS USB TRANSCEIVER VBUS D+ USB CONNECTOR DGND CD+ CDUSB SWITCHES MAX14500– MAX14503 VTM FREF HD+ HD- USB Figure 1. Typical Application Circuit for Simple Control Mode with One SD Card 12 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 I2C CONTROL SD PORT 1 SWITCHES CCRD_PRST CCLK1 HCRD_PRST HCLK1 HCMD1 HDAT1_[3:0] VIO VSD VSD VCC SD CARD INTERFACE BUSY OPTIONAL MODE 4 VIO SD PORT SD SLOT 4 CCMD1 CDAT1_[3:0] I/O LEVEL TRANSLATORS VCC USB HS CARD READER CLDO RREF INT I2C_SEL ADD SCL SDA VTM VIO HOST PROCESSOR HOST I/O KVBUS USB TRANSCEIVER VBUS D+ USB CONNECTOR DGND CD+ CDUSB SWITCHES MAX14500– MAX14503 VTM FREF HD+ HD- USB Figure 2. Typical Application Circuit for I2C Control Mode with One SD Card ______________________________________________________________________________________ 13 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 I2C CONTROL SD PORT 2 SWITCHES CCLK2 HCLK2 HCMD2 HDAT2_[3:0] 4 SD PORT2 SD SLOT2 4 CCMD2 CDAT2_[3:0] SD PORT 1 SWITCHES CCRD_PRST CCLK1 HCRD_PRST HCLK1 HCMD1 HDAT1_[3:0] VIO VIO VSD 4 SD PORT1 SD SLOT1 4 CCMD1 CDAT1_[3:0] VSD SD CARD INTERFACE BUSY MODE OPTIONAL VCC I/O LEVEL TRANSLATORS VCC USB HS CARD READER CLDO RREF KVBUS USB TRANCEIVER VBUS D+ USB CONNECTOR DGND USB SWITCHES CD+ CD- INT I2C_SEL ADD SCL SDA VTM VTM VIO HOST PROCESSOR HOST I/O MAX14500– MAX14503 FREF HD+ HD- USB Figure 3. Typical Application Circuit for I2C Control Mode with Two SD Cards 14 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 I2C CONTROL SD PORT 2 SWITCHES CCLK2 HCLK2 HCMD2 HDAT2_[3:0] SD SLOT2 4 CCMD2 CDAT2_[3:0] SD PORT 1 SWITCHES CCRD_PRST CCLK1 HCRD_PRST HCLK1 HCMD1 HDAT1_[3:0] VIO VIO VSD 4 SD PORT SD SLOT1 4 CCMD1 CDAT1_[3:0] VSD SD CARD INTERFACE VCC BUSY MODE OPTIONAL I/O LEVEL TRANSLATORS VCC USB HS CARD READER CLDO RREF KVBUS USB TRANCEIVER VBUS D+ USB CONNECTOR DGND USB SWITCHES CD+ CD- INT I2C_SEL ADD SCL SDA VTM VTM VIO HOST PROCESSOR HOST I/O MAX14500– MAX14503 FREF HD+ HD- USB Figure 4. Typical Application Circuit for I2C Control Mode with One SD Port and Two SD Cards ______________________________________________________________________________________ 15 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Timing Diagrams fPP tWL tWH VIH CLOCK VIL tTHL tISU tTLH tIH VIH INPUT VIL VOH OUTPUT VOL tODLY (max) tODLY (min) SHADED AREAS ARE NOT VALID Figure 5a. SD Card Default Timing Diagram 16 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass Timing Diagrams (continued) MAX14500–MAX14503 VOH VIH VIL VOL tWL fPP tWH VIH CCLK1 CCLK2 VIL tTHL tISU CDAT1 _[3:0], CDAT2_[3:0], CCMD1, CCMD2 (READ) tTLH tIH VIH VIL VOH CDAT1 _[3:0], CDAT2_[3:0], CCMD1, CCMD2 (WRITE) VOL tODLY tOH Figure 5b. SD Card Hi-Speed Timing Diagram ______________________________________________________________________________________ 17 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Timing Diagrams (continued) tR_I2C SDA tSU,DAT tLOW_I2C tHIGH_I2C tHD,STA tR_I2C START CONDITION tF_I2C REPEATED START CONDITION STOP CONDITION START CONDITION tHD,DAT tF_I2C tBUF tHD,STA tSU,STO tSU,STA SCL Figure 6. I2C Timing Diagram Detailed Description The MAX14500–MAX14503 can be added to devices that have an SD card slot and a USB full-speed port (12Mbps) to provide a Hi-Speed USB path to an SD card bypassing the host microprocessor (µP), allowing for faster SD card transfers (Figures 1–4). Without the MAX14500–MAX14503, a host µP with a full-speed USB port moves data between an SD card and a host PC at 12Mbps when transferring data from an SD card through USB. The host µP has additional overhead because it has to accept data from the SD cards, process the data by putting it in USB format, and then transfer the data through the USB port. The MAX14500– MAX14503 create an alternate path from the SD card to USB, providing USB Hi-Speed capability. By bypassing the host µP using the MAX14500–MAX14503, SD card read and write operations are not limited by host µP overhead and USB full-speed data rates. The MAX14500–MAX14503 operate in Pass Thru and Card Reader mode. In Pass Thru mode, the MAX14500– MAX14503 are transparent to the host µP. All read and write operations pass from the host µP SD port to the SD card without modification. All of the features of the original device are intact and there is no need to change firmware in the host µP. In Card Reader mode, the SD card is connected to the PC with the internal USB Hi-Speed card reader, bypassing the host µP. The MAX14500–MAX14503 can be controlled in two ways. The simple control method uses a single output from a µP or ASIC to select Pass Thru or Card Reader mode. Only one SD card can be used as a Hi-Speed USB card reader in simple control. I2C control allows more configuration options and provides status information along with error conditions and additional interrupts. Two SD cards can be connected and each set of SD port switches can be controlled independently (two SD port version under I2C control). The state of I2C_SEL must not change after VIO is applied. With I2C control, the I2C bus is used to read and write to internal registers for configuration, error checking, control, and status reporting. The control and configuration registers have various functions including wakeup, SD card selection, interrupt enable, and SD switch settings. The status registers give the status of errors, SD card detection, power supplies, and interrupts. Putting the MAX14500–MAX14503 to sleep puts the device into Pass Thru mode. The state of SD port switches for card 1 and card 2 can be changed while in Pass Thru. Some I2C commands are executed upon waking up or entering Card Reader mode. For register settings that involve Card Reader mode, (when in Sleep mode), programming the I 2C registers changes the values, but the actions do not execute until the internal logic wakes up or Card Reader mode is entered. The register map indicates when register bit changes take effect. 18 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Table 1. Power-Up Default Mini Register Map for Configuration Registers REGISTER NAME REGISTER ADDRESS (hex) POWER-UP VALUE (hex) POWER-UP DEFAULT SETTINGS SD2SW = 1, SD switch 2 is closed SD1SW = 1, SD switch 1 is closed MODE[1:0] = 00, Card Reader mode is not active WAKEUP = 0, shutdown SD2ONEBIT = 0, SD2 bus in 4-bit data mode SD1ONEBIT = 0, SD1 bus in 4-bit data mode INTPULSE = 0, INT stays asserted until status register is read INTACTHI = 0, INT asserts active low CLKSOURCE = 00000, default clock input FORCEFS = 0, USB Hi-Speed Control Register (CONTROL) 0x00 0x18 Configuration Register 1 (CONFIG1) Configuration Register 2 (CONFIG2) Configuration Register 3 (CONFIG3) 0x01 0x00 0x02 0x00 0x03 0x00 SD2MAXCLK = 0000, default clock (base SD clock) SD1MAXCLK = 0000, default clock (base SD clock) USBFS = 0, disable INT for full-speed status change USBSR = 0, disable INT for suspend/resume status change VTM = 0, disable INT for VTM status change VSD = 0, disable INT for VSD status change KVBUS = 0, disable INT for VBUS status change BSY = 0, disable INT for BUSY status change SDSTAT = 0, disable INT for SD card status change FWUPD = 0, disable INT for firmware update status change Interrupt Enable Register 1 (IE1) 0x04 0x00 Interrupt Enable Register 2 (IE2) USB Vendor ID High Byte (USBVIDH) USB Vendor ID Low Byte (USBVIDL) USB Product ID High Byte (USBPIDH) USB Product ID Low Byte (USBPIDL) 0x05 0x00 0x06 0x00 If VID = 0x0000, 0x06BA is used during USB enumeration, VID high byte = 0x06 0x07 0x00 If VID = 0x0000, 0x06BA is used during USB enumeration, VID low byte = 0xBA 0x08 0x00 If PID = 0x0000, 0x38A4 is used during USB enumeration, PID high byte = 0x38 0x09 0x00 If PID = 0x0000, 0x38A4 is used during USB enumeration. PID low byte = 0xA4 ______________________________________________________________________________________ 19 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 SD PORT 2 SWITCHES CCLK2 SD SLOT2 CCMD2 4 CDAT2_[3:0] HCLK2 HCMD2 HDAT2_[3:0] 4 SD PORT2 SD PORT 1 SWITCHES CCRD_PRST CCLK1 SD SLOT1 4 CCMD1 CDAT1_[3:0] HCRD_PRST HCLK1 HCMD1 HDAT1_[3:0] 4 SD PORT1 SD CARD INTERFACE HOST PROCESSOR I/O LEVEL TRANSLATORS USB HS CARD READER HOST I/O USB TRANSCEIVER MAX14500– MAX14503 D+ USB CONNECTOR CD+ HD+ USB DCDUSB SWITCHES HD- Figure 7. Default Startup (Pass Thru Mode) Default Power-Up (Pass Thru Mode) In the default Pass Thru mode, the MAX14500– MAX14503 are transparent and the existing host functions (access to SD cards and USB) are preserved (Figure 7). The host µP reads and writes data to the SD card from the SD port, and can communicate to a PC through its existing full-speed USB port. All of the features of the original chipset are intact. The MAX14500– MAX14503 sleep when in Pass Thru mode (WAKEUP = 0), when the MODE input is low, or when the MODE bits [2:1] in control register (0x00) are set to Card Reader mode, not active. In Sleep mode, the internal microcontroller is turned off and current consumption is mini20 mized. The settings for SD port switches for card 1 and card 2 are controlled by SD port switch bits [4:3] in the control register. Card Reader Mode In Card Reader mode, the PC communicates with the SD card through USB with an internal Hi-Speed SD card reader, bypassing the host µP. Figure 8 shows card reader mode with SD card 1 connected to the PC with the internal card reader. The 40-pin TQFN can connect to a single SD card in Card Reader mode. With the 56-bump WLP operating under I2C control, either SD card can be selected for Card Reader mode. ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 SD PORT 2 SWITCHES CCLK2 SD SLOT2 CCMD2 4 CDAT2_[3:0] HCLK2 HCMD2 HDAT2_[3:0] 4 SD PORT2 SD PORT 1 SWITCHES CCRD_PRST CCLK1 SD SLOT1 4 CCMD1 CDAT1_[3:0] HCRD_PRST HCLK1 HCMD1 HDAT1_[3:0] 4 SD PORT1 SD CARD INTERFACE HOST PROCESSOR I/O LEVEL TRANSLATORS USB HS CARD READER HOST I/O USB TRANSCEIVER MAX14500– MAX14503 D+ USB CONNECTOR CD+ HD+ USB DCDUSB SWITCHES HD- Figure 8. Card Reader Mode. The USB port is connected to SD card 1. In the 2 port version, a second SD card (SD slot 2) can be independently connected and disconnected to the host µP. When the card reader is initiated in the control register, the internal USB switch disconnects from the host µP USB port and connects to the internal USB Hi-Speed SD card reader unit. When the MAX14500–MAX14503 disconnect from the host to implement a stand-alone high-speed card reader, it simulates a disconnect on the host USB and SD ports to maintain data coherence. The SD connections are restored to the host µP by closing the analog switch connecting CCRD_PRST to HCRD_PRST. Certain registers execute actions when entering Card Reader mode. These actions are only valid for Card Reader mode. Writing to these registers in Sleep mode, or when awake, updates the registers, but the action is carried out when Card Reader mode is activated for one of the SD cards (see the Register Map section). When Card Reader mode is initially entered, the internal microcontroller enumerates with the PC to establish a high-speed USB mass storage device. No actions by the host µP are required for enumeration other than entering Card Reader mode. Once the USB-SD card connection is established, PC to SD card data transfer begins and various interrupts monitor the status the of Card Reader mode if enabled. The BSY flag is represented externally by the BUSY output and can be read serially through I2C. The BUSY output is always active. If the host µP requests Sleep mode in the middle of the data transfer, the MAX14500–MAX14503 do not complete the transfer, exit Card Reader mode, reconnect USB switches, and 21 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 PASS THRU IF ASLEEP REQUEST TO ENTER CARD READER CARD READER (TRANSFER DATA) SD COMMAND IN PROGRESS REQUEST TO SLEEP OR PASS THRU IF AWAKE NO SD COMMAND IN PROGRESS • DISCONNECT SD SWITCHES FOR CARD READER • ENUMERATE SD CARD • OPEN USB SWITCHES • DEENUMERATE PC • CLOSE USB SWITCHES • ASSERT BUSY • SET BUSY FLAG • DEENUMERATE SD CARD • RESTORE SD SWITCHES TO I2C SETTINGS • ENUMERATE PC • DEASSERT BUSY • CLEAR BUSY FLAG Figure 9. Card Reader Flow Chart go to sleep. Because the BUSY output (BSY bit in I2C) indicates Card Reader mode, the host µP may monitor this output after commanding a mode change to determine when the change takes place (Figure 9). If the host requests the other SD card to enter Card Reader mode, the busy flag deasserts and reasserts to let the host know that the change took place. Simple Control (I2C_SEL = Low) The MAX14500–MAX14503 feature a very simple control scheme for entering Card Reader mode that requires a single logic (GPIO) from the host µP. The simple control may only be used with the single SD port versions. When I2C_SEL is connected low at startup, the MODE input controls whether the device is in Pass Thru or Card Reader mode. Driving MODE low enables Pass Thru mode (Figure 10), and the host µP has a direct connection to the SD card and USB connector through internal analog switches. Driving MODE high enables Card Reader mode between SD card 1 and the PC through the USB connector (Figure 11). BERR/INT functions as the bridge error output BERR that asserts for card reader errors. Interrupts are not enabled, the clock source is set to the default as 22 defined by the part number, and the BERR and BUSY outputs are active. Upon MODE transitioning high, SD card 1 connects to the USB connector in Card Reader mode and BUSY asserts low. The BUSY output indicates that the device is in Card Reader mode. BUSY may be important to the host µP, as the time to complete enumeration/de-enumeration may take a long time (> 100ms). I2C Control (I2C_SEL = High) The MAX14500–MAX14503 feature I 2 C control that allows access to internal registers for complete control over configuration, SD port analog switches, interrupts, clock configuration, advanced power-on states, and error status. I2C control uses I2C to serially program the MAX14500–MAX14503 to be in Card Reader or Pass Thru mode, and allows either SD card to be connected in Card Reader mode. While a SD card is connected in Card Reader mode, the other SD port analog switches can be independently controlled serially through I2C. Using the I2C bus to put the device to sleep minimizes the supply current while maintaining control over the SD port switches. ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 SD PORT 1 SWITCHES CCRD_PRST CCLK1 SD SLOT 1 4 CCMD1 CDAT1_[3:0] HCRD_PRST HCLK1 HCMD1 HDAT1_[3:0] 4 SD PORT1 HOST PROCESSOR SD CARD INTERFACE BUSY I/O LEVEL TRANSLATORS USB HS CARD READER BERR MODE = LOW I2C_SEL = LOW HOST I/O USB TRANSCEIVER MAX14500– MAX14503 HD+ USB D+ USB CONNECTOR CD+ D- CDUSB SWITCHES HD- Figure 10. I2C_SEL Connected Low to Enable Simple Control and MODE = 0 to Enable Pass Thru Control Register (0x00) The control register controls the settings of SD port analog switches, Card Reader mode, and sleep (Table 2.) The state of the SD port analog switches can be changed when the device is in Sleep mode or in Card Reader mode, and actions are executed immediately. If SD card 1 is connected to the PC through USB in Card Reader mode, the state of the SD port 1 switches are ignored, but the SD port 2 switches can still be controlled through the Control register. Likewise, if SD card 2 is connected to the USB connector in Card Reader mode, the state of the SD port 2 switches are ignored, but the SD port 1 switches can still be controlled through the Control register. Changing the card reader bits in Sleep mode does not cause the device to enter Card Reader mode. Under this condition, the MAX14500–MAX14503 enter Card Reader mode upon waking up. Configuration Registers The MAX14500–MAX14503 have three configuration registers (CONFIG1 = 0x01, CONFIG2 = 0x02, CONFIG3 = 0x03). The configuration registers control the SD bus bit data mode, interrupt polarity, interrupt clearance, clock configuration, SD clock, and USB speed for Card Reader mode. The default settings are shown in the Register Map section. Interrupts (INT) All interrupts are masked in the default reset state. There are two interrupt enable registers (IE1 = 0x04, IE2 = 0x05) and two interrupt request registers (IRQ1 = 0x10, IRQ2 = 0x11). The BERR/INT output functions as the bridge error output BERR in simple control and functions as an interrupt INT in I2C control. The polarity of INT and how INT is asserted can be programmed in CONFIG1. The INT output asserts for enabled interrupts and errors in Card Reader mode. The polarity of INT can be active-high or active-low, and INT can be pro23 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Table 2. Control Register (0x00) BIT [7:5] RESERVED SD PORT 2 ANALOG SWITCHES SD Port 2 is a set of six analog switches connecting the SD port to the SD card. This set contains: clock (CCLK2), command (CCMD2), and four data lines (CDAT2_[3:0]). The card-present line is not available for this port. This setting is ignored when Card Reader mode is enabled for this port. SD PORT 1 ANALOG SWITCHES SD Port 1 is a set of seven analog switches connecting the SD port to the SD card. This set contains: card-present (CCRD_PRST), clock (CCLK1), command (CCMD1), and four data lines (CDAT1_[3:0]). The difference between Port 1 and Port 2 is the card-present line. This setting is ignored when Card Reader mode is enabled for this port. DESCRIPTION VALUE 000 0 FUNCTION Set these bits to 0. Analog switches are open, disconnecting the SD port from the SD card. Analog switches are closed, connecting the SD port to the SD card. Analog switches are open, disconnecting the SD port from the SD card. Analog switches are closed, connecting the SD port to the SD card. Card Reader mode not active. Card Reader mode active: Connects to SD card 1. Card Reader mode active: Connects to SD card 2. Request internal logic to shut down. 0 1 Wake up internal logic. DEFAULT 000 4 1 1 0 3 1 1 00, 11 [2:1] CARD READER MODE Changing these bits in Sleep mode does not execute the action until the host µP wakes up the MAX14500–MAX14503. 01 10 00 0 WAKEUP In Sleep mode, the MAX14500–MAX14503 are in Pass Thru mode. SD port switches are controlled by their respective bits. Entering Sleep mode reduces the supply current by turning off the internal logic. Request to shut down may be delayed due to USB and deenumeration. 0 grammed to stay asserted until the status register is read, or stay asserted for 10ms. If INT is programmed to stay asserted, a read to the status register is required to clear INT. INT can be programmed to be active-high or active-low when I2C_SEL is high (I2C control). INT is high impedance in Sleep mode (WAKEUP = 0), regardless of the INT polarity programmed in the I2C registers. Use a pullup or pulldown resistor for the desired inactive INT polarity state during Sleep mode. USB Interrupts When enabled, the INT output asserts an interrupt for changes in the USB connection and if the operating system suspends the USB connection. VBUS is detected at the KVBUS input and changes in VBUS voltage can assert an interrupt when enabled. Power-Supply Interrupts The MAX14500–MAX14503 feature many advanced power-saving modes. VCC, VSD, and VTM do not need to be applied for I2C communication. Changes in VSD and VTM can assert an interrupt when enabled to indicate different power-saving modes (see the P ower-Supply Modes section). Busy Interrupt When enabled, changes in the BSY bit can assert an interrupt (see the Busy Indication (BSY) section). SD Status Interrupt When enabled, the SDSTAT bit asserts an interrupt for card detection and removal upon entering Card Reader mode for the SD card socket configured as the card reader. The SDSTAT bit is not active during Pass Thru mode and does not change states in the IRQ registers upon card insertion and removal during Pass Thru mode. Interrupt Masking All interrupts are masked at power-up. While masked interrupts do not assert the INT output, they do register as changes in the interrupt request registers (IRQ1 and IRQ2). The status register (STATUS1 = 0x12) indicates the current state of the interrupt bits. If interrupts are masked, polling IRQ1 and IRQ2 indicate the fields with changes, and STATUS1 gives the current state. Reading the IRQ registers resets the interrupt request bits. If polling is used to read the device status, it is required to read both the status register and the interrupt request registers to check for state changes. 24 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 SD PORT 1 SWITCHES CCRD_PRST CCLK1 SD SLOT 1 4 CCMD1 CDAT1_[3:0] HCRD_PRST HCLK1 HCMD1 HDAT1_[3:0] 4 SD PORT1 HOST PROCESSOR SD CARD INTERFACE BUSY I/O LEVEL TRANSLATORS USB HS CARD READER BERR MODE = HIGH I2C_SEL = LOW HOST I/O USB TRANSCEIVER MAX14500– MAX14503 D+ USB CONNECTOR CD+ HD+ USB DCDUSB SWITCHES HD- Figure 11. I2C_SEL is connected low to enable simple control and MODE = 1 to enable Card Reader mode for SD card 1. Error Checking In simple control, the BERR/INT output functions as BERR and indicates if an error occurs during Card Reader mode. If BERR asserts low to indicate an error, the MAX14500–MAX14503 stay in Card Reader mode. If the error clears, data transfer begins. BERR asserts if KVBUS, VTM, or VSD are not present. It is recommended that MODE be pulled low when BERR indicates an error to return the MAX14500–MAX14503 to Pass Thru mode for the host µP to clear the error. In I2C control, BERR/INT functions as an interrupt output (INT) and asserts for errors encountered in Card Reader mode when interrupts are not masked. To find the source of the interrupt, read the interrupt request registers and status register. Busy Indication (BSY) The BUSY output is used in simple control and I2C control to indicate when Card Reader mode is active. In simple control, transitioning MODE high to low requests the internal microcontroller to enable Pass Thru mode. BUSY asserts low while in Card Reader mode and deasserts high in Pass Thru mode. The BSY bit in STATUS1 (0x12) behaves similarly with I2C control. The BUSY output is represented by the BSY bit. Requests to put the device to sleep or bypass (Pass Thru mode) while in Card Reader mode can be verified by checking the state of the BUSY signal or BSY bit. The BUSY output indicates the status of the BUSY flag in STATUS1. The BSY bit is 1 when the BUSY output asserts low. When enabled, changes in the busy flag cause an interrupt. In I2C control, either the BSY bit or the BUSY output give the status of the busy state. ______________________________________________________________________________________ 25 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 RUNTIME NO NO INTERRUPT ACTIVITY OCCURS INTERRUPT REQUEST REGISTERS READ? NO HAS INTERRUPT STATUS CHANGED? NO YES YES IS INT ENABLED? • INTERRUPT STATUS REGISTER BIT UPDATED • INTERRUPT REQUEST REGISTER BIT SET YES CLEAR INT IS INTERRUPT MASK BIT ENABLED? YES INT ENABLED-BASED ON INTPULSE AND INTACTHI FIELD SETTINGS NOTE: THIS IS VALID FOR I2C CONTROL ONLY Figure 12. Typical Interrupt Servicing Flowchart Drive RST low to reset all the registers to the default value and minimize the supply current. Reset (RST) Sleep The MAX14500–MAX14503 can be put to sleep by programming the WAKEUP bit to 0 in the control register with I2C control, or by driving the MODE input low in simple control. This turns off the internal microcontroller to minimize current. Reads and writes to the I2C are still functional, and registers can be updated with new values. Most register actions do not take effect until the internal microcontroller wakes up or when Card Reader mode is enabled. The SD port analog switches can 26 change states while the internal microcontroller is in Sleep mode. The Register Map section shows which registers are enabled in Sleep mode, at power-up, and upon entering Card Reader mode. Clock Configuration The MAX14500–MAX14503 come preprogrammed to accept a 12MHz, 13MHz, 19.2MHz, or 26MHz default clock input with the clock squarer enabled for lowamplitude TCXO signals (see the O rdering Information/Selector Guide). This clock is used for the USB and SD subsystems and is not required for operation of the I2C interface. This allows the clock frequency to be changed in the system. The PLL subsystem con- ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass sists of two blocks: a clock squarer input (enabled by default), which accepts low-signal amplitude TCXO signals (down to 200mV), and a PLL with fixed dividers. The PLL sub system can be configured using the I2C interface. The complete list of PLL subsystem combinations are listed in Table 3. I2C Serial Interface Serial Addressing The MAX14500–MAX14503 operate as I2C slave devices that send and receive data through an I2C-compatible 2-wire interface. The interface uses a serial-data line (SDA) and a serial-clock line (SCL) to achieve bidirectional communication between master(s) and slave(s). A master initiates all data transfers to and from the MAX14500–MAX14503, and generates the SCL clock that synchronizes the data transfer. The SDA line operates as both an input and an open-drain output requiring a pullup resistor on SDA. The SCL line operates only as an input. A pullup resistor is required on SCL if there are multiple masters on the 2-wire interface, or if the master in a single-master system has an open-drain SCL output. Each transmission consists of a START (S) condition by a master, followed by the MAX14500–MAX14503’s 7-bit slave address, plus a R/W bit, a register address byte, one or more data bytes, and finally a STOP (P) condition. START and STOP Conditions Both SCL and SDA remain high when the interface is idle. A master signals the beginning of a transmission with a START condition by transitioning SDA from high to low while SCL is high (Figure 13). When the master has finished communicating with the slave, it issues a STOP condition by transitioning SDA from low to high while SCL is high. The bus is then free for another transmission. MAX14500–MAX14503 Table 3. Clock Source Bit Values CLKSOURCE 00000b 00001b 00010b 00101b 00110b 01001b 01010b 01101b 01110b SOURCE (MHz) See Ordering Information/ Selector Guide 19.2 19.2 13.0 13.0 12.0 12.0 26.0 26.0 NOTES Default low-amplitude clock Rail-to-rail square wave Low-amplitude sine wave Rail-to-rail square wave Low-amplitude sine wave Rail-to-rail square wave Low-amplitude sine wave Rail-to-rail square wave Low-amplitude sine wave SDA SCL S START CONDITION P STOP CONDITION Figure 13. START and STOP Conditions ______________________________________________________________________________________ 27 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 SDA SCL DATA LINE STABLE; DATA VALID CHANGE OF DATA ALLOWED Figure 14. Bit Transfer START CONDITION CLOCK PULSE FOR ACKNOWLEDGE 1 2 8 9 SCL SDA BY TRANSMITTER SDA BY RECEIVER S Figure 15. Acknowledge SDA 1 MSB 1 1 0 0 0 ADD R/W LSB ACK SCL Figure 16. Slave Address Bit Transfer One data bit is transferred during each clock pulse (Figure 14). The data on SDA must remain stable while SCL is high. Acknowledge The acknowledge bit is a clocked 9th bit (Figure 15), which the recipient uses to handshake receipt of each byte of data. Each byte transferred effectively requires nine bits. The master generates the 9th clock pulse, and the recipient pulls down SDA during the acknowledge clock pulse. The SDA line is stable low during the high period of the clock pulse. When the master is transmitting to the MAX14500–MAX14503, the MAX14500–MAX14503 generate the acknowledge bit because the MAX14500–MAX14503 are the recipients. When the MAX14500–MAX14503 are transmitting to the master, the master generates the acknowledge bit because the master is the recipient. 28 Slave Addresses The MAX14500–MAX14503 have a 7-bit long slave address. The bit following the 7-bit slave address is the R/W bit, which is low for a write command and high for a read command. The address bit ADD is externally driven high or low by the ADD input to select between two slave addresses to avoid conflict with other I2C addresses (Figure 16). Table 4 shows the binary values for reads and writes. Table 4. Slave Addresses ADD High High GND GND FUNCTION Read Write Read Write 1 1 1 1 1 1 1 1 DEVICE ADDRESS 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 1 0 1 0 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 0 = WRITE ADDRESS = 0xE0 REGISTER ADDRESS = 0x01 S 1 1 1 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A REGISTER 0x01 WRITE DATA D7 D6 D5 D4 D3 D2 D1 D0 A/A P S = START BIT P = STOP BIT A = ACK A = NACK D_ = DATA BIT Figure 17. Format for I2C Write. In this example the register 0x01 is written. 0 = WRITE ADDRESS = 0xE0 REGISTER ADDRESS = 0x01 S 1 1 1 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A REGISTER 0x01 WRITE DATA REGISTER 0x02 WRITE DATA D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 A/A P Figure 18. Format for Writing to Multiple Registers. In this example, registers 0x01 and 0x02 are written in sequence. Format for Writing A write to the MAX14500–MAX14503 comprises the transmission of the slave address with the R/W bit set to zero, followed by at least 1 byte of information. The first byte of information is the register address or command byte. The register address determines which register of the MAX14500–MAX14503 is to be written by the next byte if received. If a STOP condition is detected after the register address is received, then the MAX14500– MAX14503 take no further action beyond storing the register address (Figure 17). Any bytes received after the register address are data bytes. The first data byte goes into the register selected by the register address and subsequent data bytes go into subsequent registers (Figure 18). If multiple data bytes are transmitted before a STOP condition, these bytes are stored in subsequent registers because the register address autoincrements. Format for Reading The MAX14500–MAX14503 are read using the internally stored register address as an address pointer, the same way the stored register address is used as an address pointer for a write. The pointer autoincrements after each data byte is read using the same rules used for a write. Thus, a read is initiated by first configuring the register address by performing a write (Figure 19). The master can now read consecutive bytes from the MAX14500–MAX14503, with the first data byte being read from the register addressed pointed by the previously written register address (Figure 20). Once the master sends a NACK, the MAX14500–MAX14503 stop sending valid data. Applications Information SD Ports The MAX14500–MAX14503 support one or two SD cards or SD interface NAND flash memory. SD Ports Configuration There are three operational configurations: • 40-pin TQFN version, containing one host port and one SD card (Figures 1, 2) • 56-bump WLP version, containing two SD host ports and two SD cards. There are two SD hosts and two SD memory cards. Use this mode if the host has two SD ports (Figure 3). 29 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 0 = WRITE ADDRESS = 0xE0 REGISTER ADDRESS = 0x01 S 1 1 1 0 0 0 0 0 1 = READ A 0 0 0 0 0 0 0 1 A P ADDRESS = 0xE1 REGISTER 0x01 READ DATA S 1 1 1 0 0 0 0 1 A D7 D6 D5 D4 D3 D2 D1 D0 A/A P Figure 19. Format for Reading 0 = WRITE ADDRESS = 0xE0 REGISTER ADDRESS = 0x00 S 1 1 1 0 0 0 0 0 1 = READ A 0 0 0 0 0 0 0 0 A P ADDRESS = 0xE1 REGISTER 0x00 READ DATA S 1 1 1 1 0 0 0 1 A D7 D6 D5 D4 D3 D2 D1 D0 A REGISTER 0x01 READ DATA REGISTER 0x02 READ DATA D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 A REGISTER 0x03 READ DATA D7 D6 D5 D4 D3 D2 D1 D0 A P Figure 20. Format for Reading Multiple Registers • 56-bump WLP version, containing one port and two SD cards. The host SD ports 1 and 2 are connected together at the host. This configuration allows two SD cards connected to one host, but only one SD card is connected to the host at a time. The host uses the MAX14500–MAX14503’s internal SD port switches to multiplex between the cards. This configuration can also be used to limit the bus capacitive loading of having two cards connected at the same time to the bus (Figure 4). internally read the max frequency directly from the SD card. In I2C control, the maximum clock frequency is programmable to values lower than the maximum allowed by the SD card, helping with issues such as excessive bus capacitance causing data errors. Table 5. Maximum SD Card Clock Frequency INPUT FREQUENCY (MHz) 12 13 19.2 26 BASE SD CLOCK (MHz) 48 52 48 52 SD Card Clock Frequency The SD card clock frequency is the lower of the maximum the card can support as read from the SD card and base SD clock (base SD clock is determined from values shown in Table 5). The MAX14500–MAX14503 30 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 ≤ VSD MECHANICAL CARD DETECT SWITCH CCRD_PRST CCMD1 CCLK1 SD CARD CDAT1_[3:0] HDAT1_[3:0] MAX14500–MAX14503 SD PORT1 SWITCH HCRD_PRST HCMD1 HCLK1 HOST SD PORT CARD PRESENT INPUT ≤ VSD MECHANICAL CARD DETECT SWITCH MAX14500–MAX14503 SD PORT2 SWITCH CARD PRESENT INPUT CCMD2 CCLK2 SD CARD CDAT2_[3:0] HDAT2_[3:0] HCMD2 HCLK2 HOST SD PORT Figure 21. Host Card Detection Schemes SD Port Switches The SD port analog switches change states immediately whether the MAX14500–MAX14503 are in Sleep mode (WAKEUP = 0) or awake. If the internal USB Hi-Speed SD card reader is in operation, the SD card switches for the selected path are opened automatically. Any writes to the SD port switch bits for that path are ignored. The SD port analog switches for the path not being used for the card reader are controllable by the host µP, and any writes to these bits affect state changes immediately. Card Detection The MAX14500–MAX14503 provide an analog switch to pass the card present signal on SD card slot 1. This allows the host µP to continue using the SD slot card present switch (see Figure 21). The internal analog switch can be bypassed if an alternate algorithm is used to detect card data change. The second SD card path does not provide this analog switch so if this path is used for another SD card socket, an alternate carddetection mechanism for the host µP may be needed. If the second SD card path is used for an SD interface NAND chip, no card detection is required. The MAX14500–MAX14503 do not use the SD card slot switch to detect insertion and removals. Instead, a pro- tocol-based detection mechanism is used that polls for the presence or absence of an SD card. This allows both path 1 and path 2 to support an SD card slot with removable SD cards without a connection between the MAX14500–MAX14503 and the SD socket card present switch. The pullup voltage for the card slot detection may be any voltage equal to or less than VSD. Enumeration The MAX14500–MAX14503 enumerate to the USB mass storage class and appear as a USB mass storage device on most operating systems. USB Hi-Speed vs. Full-Speed The MAX14500–MAX14503 support USB Hi-Speed and full-speed operation. The MAX14500–MAX14503 operate at 480Mbps when plugged into a Hi-Speed USB host, and at 12Mbps when plugged into a full-speed host. USB VID/PID Using I2C, the MAX14500–MAX14503 have dedicated I2C registers for vendor identification (VID) and product identification (PID). The programmed 16-bit default values are shown in the Register Map section. The factory default values can be replaced with your company’s VID and PID. ______________________________________________________________________________________ 31 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Power-Supply Modes The MAX14500–MAX14503 have four power-supply inputs (Table 6). Bypass VCC, VIO, VSD, and VTM with high-frequency, surface-mount ceramic capacitors as close as possible to the supply pins. Power modes: 1) Idle. Only VIO is required to be present. I2C registers can be updated, but no operation is possible. 2) Pass Thru Mode. VIO needs to be present so the voltage level at MODE can be detected. To allow USB pass thru, the VTM supply needs to be present. To allow SD pass thru, VSD supply needs to be present. Each supply is independent from the others and no power-supply sequencing is required. 3) Card Reader Mode. All supplies are needed. When the card reader is actively transferring data, this mode draws the most current, mainly from VCC and VTM. Table 6. Power-Supply Inputs SUPPLY VTM VCC VSD VIO FUNCTION USB transceiver and USB switch power Digital core 1.8V LDO SD card level translator and SD switches Host microprocessor level translator RANGE (V) +2.91 to +3.4 +2.1 to +3.6 +2.0 to +3.6 +1.5 to +3.6 Layout Considerations The MAX14500–MAX14503 support Hi-Speed USB and requires careful PCB layout. Use controlled-impedance matched traces of equal lengths to the USB connector with no discontinuities and a minimum number of feedthroughs. All SD traces (CLK, CMD, DAT_) should be of equal lengths and as short as possible. Power-supply inputs: 1) VTM USB Transceiver Power. This supply powers the USB analog switches, PLL subsystem, and the USB 2.0 transceiver. This regulator can be internal to a power-management IC, or it can be discrete and is recommended to be powered from USB VBUS. This supply must be present when the MAX14500– MAX14503 are used in Card Reader mode to pass USB signals in Pass Thru mode. 2) VCC Digital Logic Power. This supply powers the digital logic/internal microcontroller/flash memory. There is an internal +1.8V LDO (CLDO) with shutdown controlled by the state of the MODE input and internal logic. 3) VSD SD Card Power. This supply powers the SD card level translator and SD card switches. V SD needs to be present to pass SD signals in Pass Thru mode. 4) VIO Host Interface Power. This supply powers the digital I/O and I2C interface. Choosing Pullup Resistors I2C requires pullup resistors to provide a logic-high level to data and clock lines. There are tradeoffs between power dissipation and speed, and a compromise must be made in choosing pullup resistor values. Every device connected to the bus introduces some capacitance, even when the device is not in operation. I2C specifies 300ns rise time to go from low to high (30% to 70%) for fast mode, which is defined for data rates up to 400kbps. To meet the rise time requirement, choose pullup resistors so the rise time (tR) is less than 300ns where tR ≈ 0.85 x RPULLUP x CBUS. If the transition time becomes too slow, the setup and hold times may not be met and waveforms may not be recognized. 32 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Register Map FIELD NAME READ WRITE BITS RESET DESCRIPTION VALID WHEN CONTROL: Control Register (0x00) RFU SD2SW R/W R/W [7:5] 4 000 1 Reserved for future use Setting of SD port 2 switches: 0 = open 1 = closed Setting of SD port 1 switches: 0 = open 1 = closed Activates PC USB Hi-Speed SD card reader: 00 = not active 01 = card reader active for SD port 1 10 = card reader active for SD port 2 11 = not active Wakes the internal µC: 0 = requests µC to shut down 1 = wakes µC Force the SD port 2 bus to 1 bit mode: 0 = SD bus 4-bit data mode 1 = SD bus 1-bit data mode Force the SD port 1 bus to 1 bit mode: 0 = SD bus 4-bit data mode 1 = SD bus 1-bit data mode INT assertion method: 0 = INT stays asserted until STATUS register is read 1 = INT asserts for 10ms pulse INT pin active level: 0 = active-low 1 = active-high Reserved for future use Reserved for future use Sets the configuration for the clock input: 00000 = default 00001 = 19.2MHz rail-to-rail square wave 00010 = 19.2MHz low-amplitude AC-coupled sine wave 00101 = 13MHz rail-to-rail square wave 00110 = 13MHz low-amplitude AC-coupled sine wave 01001 = 12MHz rail-to-rail square wave 01010 = 12MHz low-amplitude AC-coupled sine wave 01101 = 26MHz rail-to-rail square wave 01110 = 26MHz low-amplitude AC-coupled sine wave All other values = default — Powered SD1SW R/W 3 1 Powered MODE R/W [2:1] 00 WAKEUP = 1 WAKEUP R/W 0 0 Powered CONFIG1: Configuration Register 1 (0x01) SD2ONEBIT R/W 7 0 Enter Card Reader mode Enter Card Reader mode SD1ONEBIT R/W 6 0 INTPULSE R/W 5 0 WAKEUP = 1 INTACTHI RFU RFU R/W R/W R/W 4 [3:0] 7 0 0000 0 WAKEUP = 1 — — CONFIG2: Configuration Register 2 (0x02) CLKSOURCE R/W [6:2] 00000 Enter Card Reader mode ______________________________________________________________________________________ 33 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Register Map (continued) FIELD NAME READ WRITE R/W R/W BITS RESET DESCRIPTION Sets the maximum USB speed: 0 = Hi-Speed 1 = full speed Reserved for future use Limits the max clock for SD card 2. The SD clock will be the minimum of either this register or the SD card max speed register. 0111 = base SD clock/64 0110 = base SD clock/32 0101 = base SD clock/16 0100 = base SD clock/8 0011 = base SD clock/4 0010 = base SD clock/2 0001 = base SD clock 0000 = default (base SD clock) Limits the max clock for SD card 1. The SD clock will be the minimum of either this register or the SD card max speed register. 0111 = base SD clock/64 0110 = base SD clock/32 0101 = base SD clock/16 0100 = base SD clock/8 0011 = base SD clock/4 0010 = base SD clock/2 0001 = base SD clock 0000 = default (base SD clock) Reserved for future use Full-speed status change: 0 = disable contribution to INT 1 = enable contribution to INT USB suspend-resume status change: 0 = disable contribution to INT 1 = enable contribution to INT VTM voltage-detector change: 0 = disable contribution to INT 1 = enable contribution to INT VSD voltage-detector change: 0 = disable contribution to INT 1 = enable contribution to INT VBUS voltage-detector change: 0 = disable contribution to INT 1 = enable contribution to INT VALID WHEN Enter Card Reader mode — FORCEFS RFU 1 0 0 0 CONFIG3: Configuration Register 3 (0x03) SD2MAXCLK R/W [7:4] 0000 Enter Card Reader mode SD1MAXCLK R/W [3:0] 0000 Enter Card Reader mode IE1: Interrupt Enable Register 1 (0x04) RFU USBFS R/W R/W 7 6 0 0 — Powered USBSR R/W 5 0 Powered VTM R/W 4 0 Powered VSD R/W 3 0 Powered KVBUS R/W 2 0 Powered 34 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Register Map (continued) FIELD NAME READ WRITE R/W BITS RESET DESCRIPTION BUSY state change: 0 = disable contribution to INT 1 = enable contribution to INT SD card status change: 0 = disable contribution to INT 1 = enable contribution to INT Note: Reflects currently selected card in Card Reader mode Firmware update status change: 0 = disable contribution to INT 1 = enable contribution to INT VALID WHEN Powered BUSY 1 0 SDSTAT R/W 0 0 Powered IE2: Interrupt Enable Register 2 (0x05) FWUPD RFU R/W R/W 7 [6:0] 0 Powered — 0000000 Reserved for future use Bits 15–8 of USB vendor ID reported during card reader enumeration. If this register is written, the written value is used for USB enumeration, otherwise a default VID of 0x06BA (Maxim Integrated Products) is used. Bits 7–0 of USB vendor ID reported during card reader enumeration. If this register is written, the written value is used for USB enumeration, otherwise a default VID of 0x06BA (Maxim Integrated Products) is used. USBVIDH: USB Vendor ID High Byte (0x06) Enter Card Reader mode VID 1 R/W [7:0] 0x00 USBVIDL: USB Vendor ID Low Byte (0x07) Enter Card Reader mode VID 2 R/W [7:0] 0x00 USBPIDH: USB Product ID High Byte (0x08) Bits 15–8 of USB product ID reported during card reader enumeration. If this register is written, the written value is used for USB enumeration, otherwise a default PID of 0x38A4 is used. Enter Card Reader mode PID 1 R/W [7:0] 0x00 USBPIDL: USB Product ID Low Byte (0x09) Bits 7–0 of USB product ID reported during card reader enumeration. If this register is written, the written value is used for USB enumeration, otherwise if zero, a default PID of 0x38A4 is used. Do not write to this register Do not write to this register Do not write to this register Do not write to this register Enter Card Reader mode PID 2 R/W [7:0] 0x00 Test Register (0x0A) Test Register Test Register (0x0B) Test Register Test Register (0x0C) Test Register Test Register (0x0D) Test Register R/W — 0x00 — R/W — 0x00 — R/W — 0x00 — R/W — 0x00 — ______________________________________________________________________________________ 35 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Register Map (continued) FIELD NAME Test Register (0x0E) Test Register Firmware Portal RFU USBFS USBSR VTM VSD VBUS BSY SDSTAT R/W R/W R R R R R R R R — [7:0] 7 6 5 4 3 2 1 0 0x00 0x00 Do not write to this register Contact factory. Do not write to this register. Reserved for future use 0 = no change in USB full-speed mode status 1 = change in USB full-speed mode status 0 = no change in USB suspend/resume status 1 = change in USB suspend/resume status 0 = no change in VTM detector status 1 = change in VTM detector status 0 = no change in VSD detector status 1 = change in VSD detector status 0 = no change in VBUS detector status 1 = change in VBUS detector status 0 = no change in BUSY status 1 = change in BUSY status 0 = no change in SD card present status 1 = change in SD card present status — — — Enter Card Reader mode Enter Card Reader mode WAKEUP = 1 WAKEUP = 1 WAKEUP = 1 WAKEUP = 1 Enter Card Reader mode Code download — — Enter Card Reader mode Enter Card Reader mode WAKEUP = 1 WAKEUP = 1 WAKEUP = 1 WAKEUP = 1 FWP: Firmware Portal (0x0F) IRQ1: Interrupt Request Register 1 (0x10) READ WRITE BITS RESET DESCRIPTION VALID WHEN IRQ2: Interrupt Request Register 2 (0x11) Firmware Update RFU RFU USBFS USBSR VTM VSD VBUS BSY R R R R R R R R R 7 [6:0] 7 6 5 4 3 2 1 Contact factory Reserved for future use Reserved for future use 0 = no connection or Hi-Speed connection 1 = full-speed connection 0 = USB resume 1 = USB suspend 0 = no voltage 1 = VTM supply present 0 = no voltage 1 = VSD supply present 0 = no voltage 1 = VBUS supply present 0 = not busy 1 = busy STATUS1: Status Register 1 (0x12) 36 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Register Map (continued) FIELD NAME READ WRITE BITS RESET DESCRIPTION The insert/removal status is only valid for the card currently set to Card Reader mode (Reg 0x00 bits 1-2) 0 = no card 1 = card present Reserved for future use VALID WHEN Enter Card Reader mode SDSTAT R 0 STATUS2: Status Register 2 (0x13) RFU High Byte of Response Data Low Byte of Response Data RFU Register (0x16) RFU RFU Register (0x17) RFU RFU Register (0x18) RFU RFU Register (0x19) RFU RFU Register (0x1A) RFU Firmware Incremental Revision Firmware Minor Revision Firmware Major Revision Chip Revision (0x1E) Chip Revision Package Type (0x1F) Package Type R [7:0] 0x00 = 40-lead TQFN 0x05 = 56-bump WLP 0xFF = unknown WAKEUP = 1 R [7:0] Chip revision WAKEUP = 1 R [7:0] Reserved for future use — Firmware Incremental Revision (0x1B) R [7:0] Firmware incremental revision WAKEUP = 1 R [7:0] Reserved for future use — R [7:0] Reserved for future use — R [7:0] Reserved for future use — R [7:0] Reserved for future use — R [7:0] — Code download Code download FWUGRRH: Firmware Upgrade Response Data High Byte (0x14) R [7:0] Contact factory FWUPGRL: Firmware Upgrade Response Data Low Byte (0x15) R [7:0] Contact factory Firmware Minor Revision (0x1C) R R [7:0] [7:0] Firmware minor revision Firmware major revision WAKEUP = 1 WAKEUP = 1 Firmware Major Revision (0x1D) ______________________________________________________________________________________ 37 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Functional Diagram VSD VIO 0.1μF 1μF VSD CLK CMD DAT 0 SD INTERFACE NAND FLASH DAT 1 DAT 2 DAT 3 CCLK2 CCMD2 CDAT 2_0 CDAT 2_1 CDAT 2_2 CDAT 2_3 SD PORT 2 SWITCHES VIO HCLK2 HCMD2 HDAT 2_0 HDAT 2_1 HDAT 2_2 HDAT 2_3 CLK CMD DAT 0 DAT 1 DAT 2 DAT 3 SD PORT2 SD_DETECT CLK CMD SD CARD DAT 0 DAT 1 SD SLOT DAT 2 DAT 3 CCRD_PRST CCLK 1 CCMD 1 CDAT 1_0 CDAT 1_1 CDAT 1_2 CDAT 1_3 SD PORT 1 SWITCHES HCRD_PRST HCLK1 HCMD1 HDAT 1_0 HDAT 1_1 HDAT 1_2 HDAT 1_3 SD_DETECT CLK CMD SD PORT1 DAT 0 DAT 1 DAT 2 DAT 3 SD CARD INTERFACE LEVEL TRANSLATORS VCC 1μF VCC 0.1μF KVBUS 6.19kΩ 1% VTM (+2.91V TO +3.4V) VBUS DET USB 2.0 TRANSCEIVER CLDO 1.8V LDO MICROCONTROLLER FLASH USB SIE OSC SRAM ROM I/O LEVEL TRANSLATORS MODE BUSY BERR/INT SCL SDA RST ADD I2C_SEL HOST PROCESSOR VTM 1μF 1.5kΩ 48/52MHz PLL SQR FREF TCXO VIO HOST INTERFACE RREF D+ DUSB CONNECTOR VBUS CD+ CD- HD+ HD- D+ USB D- USB SWITCHES MAX14500–MAX14503 38 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass Pin Configurations TOP VIEW HCRD_PRST HCLK1 MAX14500–MAX14503 KVBUS RREF GND FREF GND VTM CD+ 30 29 28 27 26 25 24 23 22 21 HCMD1 CCLK1 CCRD_PRST CCMD1 N.C. N.C. GND CLDO VCC VSD 31 32 33 34 35 36 37 38 39 40 + 1 2 3 4 5 6 7 *EP 8 9 10 CDAT1_3 20 19 18 17 HD+ HDGND HDAT1_0 HDAT1_1 HDAT1_2 HDAT1_3 CDAT1_0 CDAT1_1 CDAT1_2 MAX14500 MAX14501 MAX14502 MAX14503 CD16 15 14 13 12 11 I2C_SEL SCL SDA *CONNECT EXPOSED PAD TO GND. ______________________________________________________________________________________ ADD VIO BERR/INT TQFN BUSY MODE RST 39 Hi-Speed USB-to-SD Card Readers with Bypass MAX14500–MAX14503 Pin Configurations (continued) TOP VIEW (BUMPS ON BOTTOM) 8 7 6 5 4 3 2 1 MAX14500–MAX14503 A CDAT1_3 BUSY VIO CDAT2_3 HDAT2_3 ADD SCL VSD B CDAT1_1 RST BERR/INT CDAT2_2 SDA VCC CLDO CLDO C CDAT1_0 CDAT1_2 MODE HDAT2_2 I2C_SEL VCC GND GND D HDAT1_1 HDAT1_0 HDAT1_2 HDAT1_3 N.C. HDAT2_0 CDAT2_0 CDAT2_1 E GND GND FREF KVBUS N.C. CCLK1 CCMD1 HDAT2_1 F HDCDVTM RREF CCMD2 CCLK2 HCRD_PRST CCRD_PRST G HD+ CD+ GND GND HCMD2 HCLK2 HCLK1 HCMD1 WLP Chip Information PROCESS: CMOS Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE 40 TQFN-EP 56 WLP PACKAGE CODE T4055-1 W563B3+1 DOCUMENT NO. 21-0140 21-0090 40 ______________________________________________________________________________________ Hi-Speed USB-to-SD Card Readers with Bypass Revision History REVISION NUMBER 0 1 REVISION DATE 4/08 4/09 Initial release Fixed data sheet to reflect new rev material including EC table, Pin Description , Applications Information, Functional Diagram, and P in Configurations DESCRIPTION PAGES CHANGED — 1–41 MAX14500–MAX14503 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 41 © 2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
MAX14500 价格&库存

很抱歉,暂时无法提供与“MAX14500”相匹配的价格&库存,您可以联系我们找货

免费人工找货