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MX7828BQ

MX7828BQ

  • 厂商:

    MAXIM(美信)

  • 封装:

  • 描述:

    MX7828BQ - CMOS, High-Speed, 8-Bit ADCs with Multiplexer - Maxim Integrated Products

  • 数据手册
  • 价格&库存
MX7828BQ 数据手册
19-0255; Rev 2; 4/94 CMOS, High-Speed, 8-Bit ADCs with Multiplexer _______________General Description The MAX154/MAX158 and MX7824/MX7828 are highspeed, multi-channel analog-to-digital converters (ADCs). The MAX154 and MX7824 have four analog input channels, while the MAX158 and MX7828 have eight channels. Conversion time for all devices is 2.5µs. The MAX154/MAX158 also feature a 2.5V on-chip reference, forming a complete high-speed data acquisition system. All four converters include a built-in track/hold, eliminating the need for an external track/hold with many input signals. The analog input range is 0V to +5V, although the ADC operates from a single +5V supply. Microprocessor interfaces are simplified by the ADC’s ability to appear as a memory location or I/O port without the need for external logic. The data outputs use latched, three-state buffer circuitry to allow direct connection to a microprocessor data bus or system input port. The MX7824 and MX7828 are pin compatible with Analog Devices’ AD7824 and AD7828. The MAX154 and MAX158, which feature internal references, are also compatible with these products. ____________________________Features o One-Chip Data Acquisition System o Four or Eight Analog Input Channels o 2.5µs per Channel Conversion Time o Internal 2.5V Reference (MAX154/MAX158 only) o Built-In Track/Hold Function o 1/2LSB Error Specification o Single +5V Supply Operation o No External Clock o New Space-Saving SSOP Package MX7824/MX7828 ______________Ordering Information PART MX7824LN MX7824KN MX7824LCWG MX7824KCWG MX7824LCAG TEMP. RANGE 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C PIN-PACKAGE 24 Narrow Plastic DIP 24 Narrow Plastic DIP 24 Wide SO 24 Wide SO 24 SSOP ERROR (LSB) ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 ________________________Applications Digital Signal Processing High-Speed Data Acquisition Telecommunications High-Speed Servo Control Audio Instrumentation MX7824KCAG 0°C to +70°C 24 SSOP Ordering Information continued on last page. __________________________________________________________Pin Configurations TOP VIEW AIN6 1 AIN4 1 AIN3 2 AIN2 3 AIN1 4 TP (REF OUT) 5 DB0 6 DB1 7 DB2 8 DB3 9 RD 10 INT 11 GND 12 24 VDD 23 NC 22 A0 21 A1 AIN5 2 AIN4 3 AIN3 4 AIN2 5 AIN1 6 TP (REF OUT) 7 DB0 8 DB1 9 DB2 10 DB3 11 RD 12 INT 13 GND 14 28 AIN7 27 AIN8 26 VDD 25 A0 MAX158 MX7828 24 A1 23 A2 22 DB7 21 DB6 20 DB5 19 DB4 18 CS 17 RDY 16 VREF+ 15 VREF- MAX154 MX7824 20 DB7 19 DB6 18 DB5 17 DB4 16 CS 15 RDY 14 VREF+ 13 VREF- DIP/SO/SSOP DIP/SO/SSOP ( ) ARE FOR MAX154/MAX158 ONLY. ________________________________________________________________ Maxim Integrated Products 1 Call toll free 1-800-998-8800 for free samples or literature. CMOS, High-Speed, 8-Bit ADCs with Multiplexer MX7824/MX7828 ABSOLUTE MAXIMUM RATINGS Supply Voltage, VDD to GND ........................................0V, +10V Voltage at Any Other Pins......................GND - 0.3V, VDD + 0.3V Output Current (REF OUT)..................................................30mA Power Dissipation (any package) to +75°C ....................450mW Derate above +25°C by ..............................................6mW/°C Operating Temperature Ranges MX7824, MX7828 KN/LN/KCW_/LCW_ ............................................0°C to +70°C BQ/CQ .............................................................-40°C to +85°C TQ/UQ............................................................-55°C to +125°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10sec) .............................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VDD = +5V, VREF+ = +5V, VREF- = GND, Mode 0, TA = TMIN to TMAX, unless otherwise noted.) PARAMETER ACCURACY Resolution Total Unadjusted Error (Note 1) No Missing Codes Resolution Channel to Channel Mismatch REFERENCE INPUT Reference Resistance VREF+ Input Voltage Range VREF- Input Voltage Range REFERENCE OUTPUT—MAX154/MAX158 Only (Note 2) Output Voltage Load Regulation Power-Supply Sensitivity Temperature Drift (Note 3) Output Noise Capacitive Load ANALOG INPUT Analog Input Voltage Range Analog Input Capacitance Analog Input Current AINR CAIN IAIN Any channel, AIN = 0V to 5V 0.7 2.4 0.8 1 -1 5 8 VREF45 ±3 0.157 VREF+ V pF µA V/µs V V µA µA pF eN REF OUT TA = +25°C IL = 0mA to 10mA, TA = +25°C VDD ±5%, TA = +25°C MAX15_C MAX15_E MAX15_M 2.47 2.50 -6 ±1 40 40 60 200 0.01 2.53 -10 ±3 70 70 100 µV/rms µF ppm/°C V mV mV 1 VREFGND 4 VDD VREF+ kΩ V V MAX15_A, MX782_L/C/U MAX15_B, MX782_K/B/T 8 ±1/4 8 ±1/2 ±1 Bits LSB Bits LSB SYMBOL CONDITIONS MIN TYP MAX UNITS Slew Rate, Tracking SR –– –– —— LOGIC INPUTS ( RD , CS , A0, A1, A2) Input High Voltage Input Low Voltage Input High Current Input Low Current Input Capacitance (Note 4) VINH VINL IINH IINL CIN 2 _______________________________________________________________________________________ CMOS, High-Speed, 8-Bit ADCs with Multiplexer ELECTRICAL CHARACTERISTICS (VDD = +5V, VREF+ = +5V, VREF- = GND, Mode 0, TA = TMIN to TMAX, unless otherwise noted.) PARAMETER LOGIC OUTPUTS Output High Voltage Output Low Voltage Three-State Output Current Output Capacitance (Note 4) POWER SUPPLY Supply Voltage Supply Current Power Dissipation Power-Supply Sensitivity Note 1: Note 2: Note 3: Note 4: PSS VDD = ±5% VDD IDD 5V ±5% for specified performance –– –– —— CS = RD = 2.4V 4.75 25 ±1/16 5.25 15 75 ±1/4 V mA mW LSB COUT VOH VOL —– –— DB0–DB7, INT; IOUT = -360µA —– –— DB0–DB7, INT; RDY IOUT = 1.6mA IOUT = 2.6mA 5 4.0 0.4 0.4 ±3 8 V V µA pF SYMBOL CONDITIONS MIN TYP MAX UNITS MX7824/MX7828 DB0–DB7, RDY; VOUT = 0V to VDD Total unadjusted error includes offset, full-scale, and linearity errors. Specified with no external load unless otherwise noted. Temperature drift is defined as change in output voltage from +25°C to TMIN or TMAX divided by (25 - TMIN) or (TMAX - 25). Guaranteed by design. TIMING CHARACTERISTICS (Note 5) (VDD = +5V, VREF+ = +5V, VREF- = GND, Mode 0, TA = TMIN to TMAX, unless otherwise noted.) TA = +25°C MIN –– –– — — CS to RD Setup Time –– –– — — CS to RD Hold Time Multiplexer Address Setup Time Multiplexer Address Hold Time –– — CS to RDY Delay Conversion Time (Mode 0) –– — Data Access Time After RD Data Access Time —– –— After INT, Mode 0 – – —– — –— RD to INT Delay (Mode 1) Data Hold Time Delay Time Between Conversions –– — RD Pulse Width (Mode 1) tCSS tCSH tAS tAH tRDY tCRD tACC1 tACC2 tINTH tDH tP tRD CL = 50pF, RL = 5kΩ (Note 6) (Note 6) CL = 50pF (Note 7) 500 60 600 20 40 0 0 0 30 30 1.6 40 2.0 85 50 75 60 500 80 500 TYP MAX MAX15_ _C/E MX782_K/L/B/C MIN 0 0 0 35 60 2.4 110 60 100 70 600 80 400 MAX MAX15_ _M MX782_T/U MIN 0 0 0 40 60 2.8 120 70 100 70 MAX ns ns ns ns ns µs ns ns ns ns ns ns PARAMETER SYMBOL CONDITIONS UNITS Note 5: All input control signals are specified with tR = tF = 20ns (10% to 90% of +5V) and timed from a 1.6V voltage level. Note 6: Measured with load circuits of Figure 1 and defined as the time required for an output to cross 0.8V or 2.4V. Note 7: Defined as the time required for the data lines to change 0.5V when loaded with the circuits of Figure 2. _______________________________________________________________________________________ 3 CMOS, High-Speed, 8-Bit ADCs with Multiplexer MX7824/MX7828 __________________________________________Typical Operating Characteristics (TA = +25°C, unless otherwise noted.) REFERENCE TEMPERATURE DRIFT (MAX154/MAX158 ONLY) MX7824/28-1 OUTPUT CURRENT vs. TEMPERATURE VDD = 5V OUTPUT CURRENT (mA) 16 ISOURCE VOUT = 2.4V 12 MX7824/28-2 ACCURACY vs. DELAY BETWEEN CONVERSIONS (tp) VDD = 5V VREF = 5V 1.5 MX7824/28-3 2.520 20 2.0 REF OUT VOLTAGE (V) 2.510 LINEARITY ERROR (LSB) 2.500 1.0 8 ISINK VOUT = 0.4V 4 2.490 0.5 2.480 -50 0 50 100 150 AMBIENT TEMPERATURE (°C) 0 -100 -50 0 50 100 150 AMBIENT TEMPERATURE (°C) 0 300 400 500 600 tp (ns) 700 800 900 ACCURACY vs. VREF (VREF = VREF+ - VREF-) MX7824/28-4 POWER-SUPPLY CURRENT vs. TEMPERATURE (NOT INCLUDING REFERENCE LADDER) MX7824/28-5 2.0 VDD = 5V LINEARITY ERROR (LSB) 1.5 8 IDD – SUPPLY CURRENT (mA) 7 6 5 4 3 2 VDD = 4.75V VDD = 5.25V 1.0 VDD = 5V 0.5 0 0 1 2 3 4 5 VREF (V) -100 -50 0 50 100 150 AMBIENT TEMPERATURE (°C) +5V 3k DBN 3k DGND 100pF DBN 100pF DGND DBN 3k DGND 10pF DBN +5V 3k 10pF DGND a. High-Z to VOH b. High-Z to VOL a. VOH to High-Z b. VOL to High-Z Figure 1. Load Circuits for Data-Access Time Test 4 Figure 2. Load Circuits for Data-Hold Time Test _______________________________________________________________________________________ CMOS, High-Speed, 8-Bit ADCs with Multiplexer _____________________________________________________________Pin Descriptions PIN NAME MAX154 MX7824 1 2 3 4 5 6 7 8 9 10 AIN4 AIN3 AIN2 AIN1 REF OUT TP DBO DB1 DB2 DB3 –– — RD Analog Input Channel 4 Analog Input Channel 3 Analog Input Channel 2 Analog Input Channel 1 Reference Output (2.5V) for MAX154. Test point for MX7824. Do not connect. Three-State Data Output, bit 0 (LSB) Three-State Data Output, bit 1 Three-State Data Output, bit 2 Three-State Data Output, bit 3 –– — Read Input. RD controls conversions and data access. See Digital Interface section. Interrupt Output. INT going low indicates the completion of a conversion. See Digital Interface section. Ground Lower Limit of Reference Span. Sets the zero-code voltage. Range: GND to VREF+. Upper Limit of Reference Span. Sets the full-scale input voltage. Range: VREF- to VDD. Ready Output. Open-drain output with no active pull-up device. Goes low –– — when CS goes low and high impedance at the end of a conversion. –– — Chip-Select Input. CS must be low for the device to be selected. Three-State Data Output, bit 4 Three-State Data Output, bit 5 Three-State Data Output, bit 6 Three-State Data Output, bit 7 (MSB) Channel Address 1 Input Channel Address 0 Input No Connect Power-Supply Voltage, +5V 19 20 21 22 23 24 25 26 27 28 DB4 DB5 DB6 DB7 A2 A1 A0 VDD AIN8 AIN7 FUNCTION MAX158 MX7828 1 2 3 4 5 6 7 8 9 10 11 12 AIN6 AIN5 AIN4 AIN3 AIN2 AIN1 REF OUT TP DB0 DB1 DB2 DB3 –– — RD Analog Input Channel 6 Analog Input Channel 5 Analog Input Channel 4 Analog Input Channel 3 Analog Input Channel 2 Analog Input Channel 1 Reference Output (2.5V) for MAX158. Test point for MX7828. Do not connect. Three-State Data Output, bit 0 (LSB) Three-State Data Output, bit 1 Three-State Data Output, bit 2 Three-State Data Output, bit 3 –– — Read Input. RD controls conversions and data access. See Digital Interface section. Interrupt Output. INT going low indicates the completion of a conversion. See Digital Interface section. Ground Lower Limit of Reference Span. Sets the zero-code voltage. Range: GND to VREF+. Upper Limit of Reference Span. Sets the full-scale input voltage. Range: VREF- to VDD. Ready Output. Open-drain output with no active pull-up device. Goes low –– — when CS goes low and high impedance at the end of a conversion. –– — Chip-Select Input. CS must be low for the device to be selected. Three-State Data Output, bit 4 Three-State Data Output, bit 5 Three-State Data Output, bit 6 Three-State Data Output, bit 7 (MSB) Channel Address 2 Input Channel Address 1 Input Channel Address 0 Input Power-Supply Voltage, +5V Analog Input Channel 8 Analog Input Channel 7 5 PIN NAME FUNCTION MX7824/MX7828 11 12 13 INT GND VREF- 13 14 15 INT GND VREF- 14 VREF+ 16 VREF+ 15 RDY 16 17 18 19 20 21 22 23 24 –– — CS DB4 DB5 DB6 DB7 A1 A0 NC VDD 17 RDY 18 –– — CS _______________________________________________________________________________________ CMOS, High-Speed, 8-Bit ADCs with Multiplexer MX7824/MX7828 _______________Detailed Description Converter Operation The MAX154/MAX158 and MX7824/MX7828 use what is commonly called a “half-flash” conversion technique (Figure 3). Two 4-bit flash ADC sections are used to achieve an 8-bit result. Using 15 comparators, the upper 4-bit MS (most significant) flash ADC compares the unknown input voltage to the reference ladder and provides the upper four data bits. An internal DAC uses the MS bits to generate an analog signal from the first flash conversion. A residue voltage representing the difference between the unknown input and the DAC voltage is then compared to the reference ladder by 15 LS (least significant) flash comparators to obtain the lower four output bits. ___________________Digital Interface The MAX154/MAX158 and MX7824/MX7828 use only Chip Select (CS) and Read (RD) as control inputs. A READ operation, taking CS and RD low, latches the multiplexer address inputs and starts a conversion (Table 1). Table 1. Truth Table for Input Channel Selection MAX154/MX7824 A1 A0 0 0 1 1 0 1 0 1 MAX158/MX7828 A2 A1 A0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 SELECTED CHANNEL AIN1 AIN2 AIN3 AIN4 AIN5 AIN6 AIN7 AIN8 Operating Sequence The operating sequence is shown in Figure 4. A conversion is initiated by a falling edge of RD and CS. The comparator inputs track the analog input voltage for approximately 1µs. After this first cycle, the MS flash result is latched into the output buffers and the LS conversion begins. INT goes low approximately 600ns later, indicating the end of the conversion, and that the lower four bits are latched into the output buffers. The data can then be accessed using the CS and RD inputs. There are two interface modes, which are determined by the length of the RD input. Mode 0, implemented by keeping RD low until the conversion ends, is designed for microprocessors that can be forced into a WAIT state. In this mode, a conversion is started with a READ operation (taking CS and RD low), and data is read when the conversion ends. Mode 1, on the other hand, VREF+ VREFAIN1 4-BIT FLASH ADC (4MSB) DB7 DB6 DB5 DB4 AIN4 MUX* 4-BIT DAC THREESTATE DRIVERS AIN8 VREF+ 16 4-BIT FLASH ADC (4LSB) DB3 DB2 DB1 DB0 REF OUT** 2.5V REF ADDRESS LATCH DECODE A0 A1 A2 RDY TIMING AND CONTROL CIRCUITRY CS RD INT *MAX154/MX7824 – 4-Channel Mux MAX158/MX7828 – 8-Channel Mux ** REF OUT on MAX154/MAX158 only Figure 3. Functional Diagram 6 _______________________________________________________________________________________ CMOS, High-Speed, 8-Bit ADCs with Multiplexer RD 500ns 1000ns 600ns INT GOING LOW INDICATES THAT CONVERSION IS COMPLETE AND THAT DATA CAN BE READ SETUP TIME REQUIRED BY THE INTERNAL COMPARATORS PRIOR TO STARTING CONVERSION VIN IS SAMPLED AND THE FOUR MSBs ARE LATCHED There are two status outputs: Interrupt (INT) and Ready (RDY). RDY, an open-drain output (no internal pull-up device), is connected to the processor’s READY/WAIT input. RDY goes low on the falling edge of CS and goes high impedance at the end of the conversion, when the conversion result appears on the data outputs. If the RDY output is not required, its external pull-up resistor can be omitted. INT goes low when the conversion is complete and returns high on the rising edge of CS or RD. MX7824/MX7828 VIN IS TRACKED BY INTERNAL COMPARATORS Interface Mode 1 Mode 1 is designed for applications where the microprocessor is not forced into a WAIT state. Taking CS and RD low latches the multiplexer address and starts a conversion (Figure 6). Data from the previous conversion is immediately read from the outputs (DB0–DB7). INT goes high at the rising edge of CS or RD and goes low at the end of the conversion. A second READ operation is required to read the result of this conversion. The second READ latches a new multiplexer address and starts another conversion. A delay of 2.5µs must be allowed between READ operations. RDY goes low on the falling edge of CS and goes high impedance at the rising edge of CS. If RDY is not needed, its external pull-up resistor can be omitted. Figure 4. Operating Sequence does not require microprocessor WAIT states. A READ operation simultaneously initiates a conversion and reads the previous conversion result. Interface Mode 0 Figure 5 shows the timing diagram for Mode 0 operation. This is used with microprocessors that have WAIT state capability, whereby a READ instruction is extended to accommodate slow-memory devices. Taking CS and RD low latches the analog multiplexer address and starts a conversion. Data outputs DB0–DB7 remain in the high-impedance condition until the conversion is complete. CS tCSS RD tCSH tCSS tP tAS ANALOG CHANNEL ADDRESS RDY tRDY ADDR VALID tAH tAS ADDR VALID INT tINTH tCRD tACC2 tDH DATA VALID DATA HIGH IMPEDANCE Figure 5. Mode 0 Timing Diagram _______________________________________________________________________________________ 7 CMOS, High-Speed, 8-Bit ADCs with Multiplexer MX7824/MX7828 CS tCSS RD tRD tCSH tCSS tRD tCSH tP tAS ANALOG CHANNEL ADDRESS RDY tRDY tCRD tINTH tINTH tRDY ADDR VALID tAH tAS ADDR VALID tAH INT tACCI OLD DATA tDH tACCI NEW DATA tDH DATA Figure 6. Mode 1 Timing Diagram _____________Analog Considerations Reference and Input The VREF+ and VREF- inputs of the converter define the zero and the full-scale of the ADC. In other words, the voltage at VREF- is equal to the input voltage that produces an output code of all zeros, and the voltage at VREF+ is equal to input voltage that produces an output code of all ones (Figure 7). Figure 8 shows some possible reference configurations. For the MAX154/MAX158, a 0.01µF bypass capacitor to GND should be used to reduce the highfrequency output impedance of the internal reference. Larger capacitors should not be used, as this degrades the stability of the reference buffer. The 2.5V reference output is with respect to the GND pin. OUTPUT CODE 11111111 11111110 11111101 FULL-SCALE TRANSITION 1LSB = F8 = VREF+ - VREF256 256 00000011 00000010 00000001 VREF+ Bypassing A 47µF electrolytic and 0.1µF ceramic capacitor should be used to bypass the VDD pin to GND. These capacitors must have minimum lead length, since excess lead length may contribute to conversion errors and instability. If the reference inputs are driven by long lines, they should be bypassed to GND with 0.1µF capacitors at the reference input pins. 8 00000000 VREF1 2 3 AIN INPUT VOLTAGE (IN TERMS OF LSBs) FS–1LSB FS Figure 7. Transfer Function _______________________________________________________________________________________ CMOS, High-Speed, 8-Bit ADCs with Multiplexer AINx(+) AINx(-) +5V VIN GND VDD REF OUT 0.1µF 47µF 0.01µF VREF+ VREF- Input Current The converters’ analog inputs behave somewhat differently from conventional ADCs. The sampled data comparators take varying amounts of current from the input, depending on the cycle they are in. The equivalent circuit of the converter is shown in Figure 9a. When the conversion starts, AIN(n) is connected to the MS and LS comparators. Thus, AIN(n) is connected to thirty-one 1pF capacitors. To acquire the input signal in approximately 1µs, the input capacitors must charge to the input voltage through the on-resistance of the multiplexer (about 600Ω) and the comparator’s analog switches (2kΩ to 5kΩ per comparator). In addition, about 12pF of stray capacitance must be charged. The input can be modeled as an equivalent RC network shown in Figure 9b. As RS (source impedance) increases, the capacitors take longer to charge. Since the length of the input acquisition time is internally set, large source resistances (greater than 100Ω) will cause settling errors. The output impedance of an opamp is its open-loop output impedance divided by the loop gain at the frequency of interest. It is important that the amplifier driving the converter input have sufficient loop gain at approximately 1MHz to maintain low output impedance. MX7824/MX7828 MAX154 MAX158 Figure 8a. Internal Reference (MAX154/MAX158 only) AINx(+) AINx(-) +5V 0.1µF 47µF 2.5V MX584 VIN GND VDD VREF+ VREF- MX7824 MX7828 Figure 8b. External Reference +2.5V Full-Scale AINx(+) AINx(-) +5V 0.1µF 47µF VIN GND Input Filtering The transients in the analog input caused by the sampled data comparators do not degrade the converter’s performance, since the ADC does not “look” at the input when these transients occur. The comparator’s outputs track the input during the first 1µs of the conversion, and are then latched. Therefore, at least 1µs will be provided to charge the ADC’s input capacitance. It is not necessary to filter these transients with an external capacitor on the AIN terminals. MAX154 MAX158 VREF+ MX7824 MX7828 VDD VREF- Figure 8c. Power Supply as Reference * Current path must still exist from VIN(-) to Ground +5V 0.1µF 47µF 2.5V AINx(-) * VREFAINx(+) Sinusoidal Inputs VIN GND VDD VREF+ MAX154 MAX158 MX7824 MX7828 The MAX154/MAX158 and MX7824/MX7828 can measure input signals with slew rates as high as 157mV/µs to the rated specifications. This means that the analog input frequency can be as high as 10kHz without the aid of an external track/hold. The maximum sampling rate is limited by the conversion time (typical tCRD = 2µs) plus the time required between conversions (tp = 500ns). It is calculated as: fMAX = 1 1 = = 400kHz tCRD + tp (2.0 + 0.5) µs Figure 8d. Inputs Not Referenced to GND _______________________________________________________________________________________ 9 CMOS, High-Speed, 8-Bit ADCs with Multiplexer MX7824/MX7828 fMAX permits a maximum sampling rate of 50kHz per channel when using the MAX158/MX7828 and 100kHz per channel when using the MAX154/MX7824. These rates are well above the Nyquist requirement of 20kHz sampling rate for a 10kHz input bandwidth. 3.57k 11.5Ω VIN 10.0k AIN1 CS Bipolar Input Operation The circuit in Figure 10a can be used for bipolar input operation. The input voltage is scaled by an amplifier so that only positive voltages appear at the ADC’s inputs. An external reference should be used for the MX7824/ MX7828, but is not needed with the MAX154/MAX158. The analog input range is ±4V and the output code is complementary offset binary. The ideal input/output characteristic is shown in Figure 10b. 0.01µF 16.2k MAX154 MAX158 RDY RD 0.01µF VREF+ REF OUT INT +5V 0.1µF 47µF VDD VREFGND DB0–DB7 RS VIN AIN1 RMUX CS 2pF RON 1pF 1pF • • • 15 LSB COMPARATORS ONLY CHANNEL 1 SHOWN CS 12pF TO LS LADDER Figure 10a. Bipolar ±4V Input Operation RON 1pF 1pF • • • 16 MSB COMPARATORS TO MS LADDER 11111111 11111110 11111101 10000010 10000001 10000000 01111111 -FS + 1LSB 2 FS = 8V 1LSB = FS / 256 Figure 9a. Equivalent Input Circuit +FS 2 RS VIN AIN1 B MUX 600Ω CS1 2pF RON 350Ω CS2 2pF 32pF 01111110 00000010 00000001 00000000 0V AIN INPUT VOLTAGE (LSBs) Figure 9b. RC Network Model Figure 10b. Transfer Function for ±4V Input Operation 10 ______________________________________________________________________________________ CMOS, High-Speed, 8-Bit ADCs with Multiplexer MX7824/MX7828 A15 ADDRESS BUS A0 BANDPASS FILTER 1 ADDRESS DECODE A0 A1 A2* BANDPASS FILTER 2 6 +5V 26 VDD AIN1 CS RD 5 AIN2 18 12 MREQ ZBO 5V EN 5k WAIT RD D0–D7 DATA BUS MAX154 MAX158 RDY MX7824 MX7828 RD CS DB0–DB7 SPEECH INPUT AMP MAX158 MX7828 DB0–DB7 BANDPASS FILTER 7 BANDPASS FILTER 8 +5V 28 DATA AIN7 A2 23 24 25 27 AIN8 16 VREF+ VREF15 A1 A0 GND 14 *A2 ON MAX158/MX7828 ONLY. Figure 11. Simple Mode 0 Interface Figure 12. Speech Analysis Using Real-Time Filtering +5V 24 VDD 4 AIN1 3 AIN2 2 1 14 13 12 AIN3 AIN4 VREF+ VREFGND A1 A0 21 22 16 CS 10 RD SAMPLE PULSE +15V 18 VDD 15 VREF 4 WR VOUT A 2 INT 11 MAX154 MX7824 DB0–DB7 16 17 MX7226 DB0–DB7 VOUT B 1 VOUT C VOUT D 20 19 6 5 A1 A0 VSS 3 DGND AGND A0 A1 Figure 13. 4-Channel Fast Sample and Infinite Hold ______________________________________________________________________________________ 11 CMOS, High-Speed, 8-Bit ADCs with Multiplexer MX7824/MX7828 _Ordering Information (continued) PART MX7824LEAG MX7824KEAG MX7824CQ MX7824BQ MX7824UQ MX7824TQ MX7828LN MX7828KN MX7828LCWI MX7828KCWI MX7828LCAI MX7828KCAI MX7828LP MX7828KP MX7828LEAI MX7828KEAI MX7828CQ MX7828BQ MX7828UQ MX7828TQ TEMP. RANGE -40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C -55°C to +125°C -55°C to +125°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C -55°C to +125°C -55°C to +125°C PIN-PACKAGE 24 SSOP 24 SSOP 24 CERDIP 24 CERDIP 24 CERDIP 24 CERDIP 28 Plastic DIP 28 Plastic DIP 28 Wide SO 28 Wide SO 28 SSOP 28 SSOP 28 PLCC 28 PLCC 28 SSOP 28 SSOP 28 CERDIP 28 CERDIP 28 CERDIP 28 CERDIP ERROR (LSB) ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 ±1/2 ±1 A0 GND VREF+ INT VREF0.124" (3.150mm) ( ) ARE FOR MAX154/MX7824 ADY DB3 CS AIN2 (N.C.) AIN1 (N.C.) TP (REF OUT) DB0 DB6 DB1 DB5 DB2 DB4 A1 A2 (N.C.) 0.127" (3.228mm) DB7 ___________________Chip Topography AIN4 AIN6 AIN8 (N.C.) (AIN2) (AIN4) AIN3 AIN5 AIN7 (N.C.) (AIN1) (AIN3) VDD A0 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600 © 1995 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
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