79LV2040
20 Megabit (512K x 40-Bit) Low Low Voltage EEPROM MCM
Logic Diagram
Memory
FEATURES:
• • • • 512k x 40-bit EEPROM MCM RAD-PAK® radiation-hardened against natural space radiation Total dose hardness: - >100 krad (Si) - Dependent upon orbit Excellent Single event effects - SELTH > 84 MeV/mg/cm2 - SEU > 37 MeV/mg/cm2 read mode - SEU = 11.4 MeV/mg/cm2 write mode High endurance - 10,000 cycles (Page Programming Mode) - 10 year data retention Page Write Mode: 128 Dword Page High Speed: - 200 and 250 ns maximum access times Automatic programming - 15 ms automatic Page/Dword write Low power dissipation - 100 mW/MHz active current - 1.5 mW standby current
DESCRIPTION:
Maxwell Technologies’ 79LV2040 multi-chip module (MCM) memory features a greater than 100 krad (Si) total dose tolerance, dependent upon orbit. Using Maxwell Technologies’ patented radiation-hardened RAD-PAK® MCM packaging technology, the 79LV2040 is the first radiation-hardened 8 megabit MCM EEPROM for space application. The 79LV2040 uses twenty 1 Megabit high speed CMOS die to yield a 20 megabit product. The 79LV2040 is capable of in-system electrical byte and page programmability. It has a 128 x 40 page programming function to make the erase and write operations faster. It also features Data Polling and a Ready/Busy signal to indicate the completion of erase and programming operations. In the 79LV2040, hardware data protection is provided with the RES pin, in addition to noise protection on the WE signal and write inhibit on power on and off. Software data protection is implemented using the JEDEC optional standard algorithm. Maxwell Technologies' patented RAD-PAK® packaging technology incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing the required radiation shielding for a lifetime in orbit or space mission. In a GEO orbit, RAD-PAK provides greater than 100 krad (Si) radiation dose tolerance. This product is available with screening up to Maxwell Technologies self-defined Class K
•
•
• • • •
09.07.05 Rev 1
All data sheets are subject to change without notice
1
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com
©2005 Maxwell Technologies All rights reserved.
20 Megabit (512K x 40-Bit) EEPROM MCM
79LV2040
PINOUT DESCRIPTION
1, 11, 21, 30, 40, 50, 51, 61, 71, 80, 90, 100 2, 12, 22, 29, 39, 49, 52, 62, 72, 79, 89, 99 60 - 53, 41 - 48, 10 3, 91 - 98, 88 - 81 13, 14, 15, 16 23 - 28, 31, 32, 78 -73, 70 - 68 33 VSS - Ground
VCC - Positive Supply
D0 to D39
Data I/O
CS0\ - CS3\
Chip Enable
Memory
A0 to A16 Address Inputs
RES\ - Reset
34 - 38
WE\0 - WE\4
Write Enables
66 - 63
RBSY\0 - RBSY\3 Ready/Busy
67
OE\ - Output Enable
09.07.05 Rev 1
All data sheets are subject to change without notice
2
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
79LV2040
TABLE 1. 79LV2040 ABSOLUTE MAXIMUM RATINGS
PARAMETER Supply Voltage Input Voltage Package Weight Operating Temperature Range Storage Temperature Range 1. VIN min = -3.0V for pulse width VOL High-Z --VOL High-Z
Program Reset X X 1. Refer to the recommended DC operating conditions. 2. For CE0-3 only one CE can be used (“on”) at a time. 3. Bits 7, 15, 23, 31 and 39
09.07.05 Rev 1
All data sheets are subject to change without notice
7
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
FIGURE 1. READ TIMING WAVEFORM
79LV2040
Memory
FIGURE 2. BYTE WRITE TIMING WAVEFORM (1) (WE CONTROLLED)
09.07.05 Rev 1
All data sheets are subject to change without notice
8
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
79LV2040
FIGURE 3. BYTE WRITE TIMING WAVEFORM (2) (CE CONTROLLED)
Memory
FIGURE 4. PAGE WRITE TIMING WAVEFORM (1) (WE CONTROLLED)
1) A7-A16 are Page Addresses and must be the same within a Page Write Operation.
09.07.05 Rev 1
All data sheets are subject to change without notice
9
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
1
79LV2040
FIGURE 5. PAGE WRITE TIMING WAVEFORM (2) (CE CONTROLLED)
Memory
1) A7-A16 are Page Addresses and must be the same within a Page Write Operation.
FIGURE 6. DATA POLLING TIMING WAVEFORM
I/O1 1) BITS 7, 15, 23, 31 AND 39
09.07.05 Rev 1
All data sheets are subject to change without notice
10
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
79LV2040
FIGURE 7. SOFTWARE DATA PROTECTION TIMING WAVEFORM (1) (IN PROTECTION MODE)
FIGURE 8. SOFTWARE DATA PROTECTION WAVEFORM (2) (IN NON-PROTECTION MODE)
Memory
EEPROM APPLICATION NOTES
This application note describes the programming procedures for the EEPROM modules and with details of various techniques to preserve data integrity.
Automatic Page Write
Page-mode write feature allows 1 to 128 bytes of data to be written into the EEPROM in a single write cycle. Loading the first byte of data, the data load window opens 30µ s for the second byte. In the same manner each additional byte of data can be loaded within 30µ s of the preceding falling edge of either WE or CE. When CE and WE are kept high for 100µ s after data input, the EEPROM enters the write mode automatically and the data input is written into the EEPROM.
WE, CE Pin Operation
During a write cycle, addresses are latched by the falling edge of WE or CE, and data is latched by the rising edge of WE or CE.
09.07.05 Rev 1
All data sheets are subject to change without notice
11
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
Data Polling
79LV2040
Data Polling function allows the status of the EEPROM to be determined. If EEPROM is set to read mode during a write cycle, an inversion of the last byte of data to be loaded outputs from I/O 7 to indicate that the EEPROM is performing a write operation.
RDY/Busy Signal
RDY/Busy signal also allows a comparison operation to determine the status of the EEPROM. The RDY/Busy signal goes low (VOL) after the first write signal. At the end of the write cycle, the RDY/Busy returns to a high state ( VOH).
RES Signal
When RES is LOW (VL), the EEPROM cannot be read or programmed. The EEPROM data must be protected by keeping RES low when VCC is power on and off. RES should be high (VH) during read and programming operations.
Memory
Data Protection
To protect the data during operation and power on/off, the EEPROM has the internal functions described below.
1. Data Protection against Noise of Control Pins (CE, OE, WE) during Operation.
During readout or standby, noise on the control pins may act as a trigger and turn the EEPROM to programming mode by mistake. To prevent this phenomenon, the EEPROM has a noise cancellation function that cuts noise if its width is 20ns or less in programming mode. Be careful not to allow noise of a width more than 20ns on the control pins.
09.07.05 Rev 1
All data sheets are subject to change without notice
12
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
2. Data Protection at VCC on/off
79LV2040
When VCC is turned on or off, noise on the control pins generated by external circuits, such as CPUs, may turn the EEPROM to programming mode by mistake. To prevent this unintentional programming, the EEPROM must be kept in unprogrammable state during VCC on/off by using a CPU reset signal to RES pin.
3. RES Signal
RES should be kept at VSS level when VCC is turned on or off. The EEPROM breaks off programming operation when RES become low, programming operation doesn’t finish correctly in case that RES falls low during programming operation. RES should be kept high for 10 ms after the last data is input .
Memory
15ms
4. Software Data Protection Enable
The 79LV2040contains a software controlled write protection feature that allows the user to inhibit all write operations to the device. This is useful in protecting the device from unwanted write cycles due to uncontrollable circuit noise or inadvertent writes caused by minor bus contentions. Software data protection is enabled by writing the following data sequence to the EEPROM and allowing the write cycle period (tWC) of 15ms to elapse: .
Software Data Protection Enable Sequence Address
5555 AAAA or 2AAA 5555
Data
AA AA AA AA AA 55 55 55 55 55 A0 A0 A0 A0 A0
09.07.05 Rev 1
All data sheets are subject to change without notice
13
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
5. Writing to the Memory with Software Data Protection Enabled
79LV2040
To write to the device once Software protection is enabled, the enable sequence must precede the data to be written. This sequence allows the write to occur while at the same time keeping the software protection enabled
Sequence for Writing Data with Software Protection Enabled. Address
5555 AAAA or 2AAA 5555
Write Address(s)
Data
AA AA AA AA AA 55 55 55 55 55 A0 A0 A0 A0 A0
Normal Data Input
Memory
6. Disabling Software Protection
Software data protection mode can be disabled by inputting the following 6 bytes sequence. Once the software protection sequence has been written, no data can be written to the memory until the write cycle (TWC) has elapsed.
Software Protection Disable Sequence Address
5555 AAAA or 2AAA 5555 5555 AAAA or 2AAA 5555
Data
AA AA AA AA AA 55 55 55 55 55 80 80 80 80 80
AA AA AA AA AA
55 55 55 55 55 20 20 20 20 20
Devices are shipped in the “unprotected” state, meaning that the contents of the memory can be changed as required by the user. After the software data protection is enabled, the device enters the Protect Mode where no further write commands have any effect on the memory contents.
09.07.05 Rev 1
All data sheets are subject to change without notice
14
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
79LV2040
Memory
100 PIN STACKED FLAT PACKAGE
SYMBOL MIN A b c D E E1 E2 E3 e L Q S1 N .330 .013 .005 .400 .006 .006 1.346 .882 -.702 1.825 DIMENSION NOM .448 .008 .008 1.366 .897 -.708 1.900 0.025BSC .340 .018 .075 100 .350 .023 -MAX .500 .010 .010 1.388 .912 .950 ---
Note: All dimensions in inches
09.07.05 Rev 1
All data sheets are subject to change without notice
15
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
Important Notice:
79LV2040
These data sheets are created using the chip manufacturers published specifications. Maxwell Technologies verifies functionality by testing key parameters either by 100% testing, sample testing or characterization. The specifications presented within these data sheets represent the latest and most accurate information available to date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no responsibility for the use of this information. Maxwell Technologies’ products are not authorized for use as critical components in life support devices or systems without express written approval from Maxwell Technologies. Any claim against Maxwell Technologies must be made within 90 days from the date of shipment from Maxwell Technologies. Maxwell Technologies’ liability shall be limited to replacement of defective parts.
Memory
09.07.05 Rev 1
All data sheets are subject to change without notice
16
©2005 Maxwell Technologies All rights reserved
20 Megabit (512K x 40-Bit) EEPROM MCM
Product Ordering Options
79LV2040
Model Number
79C0832 RP 79LV2040
F
X
-XX
Feature Access Time
Option Details
20 = 200 ns 25 = 250 ns
Screening Flow
Multi Chip Module (MCM)1 K = Maxwell Class K H = Maxwell Class H I = Industrial (testing @ -55°C, +25°C, +125°C) E = Engineering (testing @ +25°C)
Memory
Package
F = Flat Pack
Radiation Feature
RP = RAD-PAK® package
Base Product Nomenclature
20 Megabit (512K x 40-Bit) EEPROM MCM
1) Products are manufactured and screened to Maxwell Technologies self-defined Class H and Class K flows.
09.07.05 Rev 1
All data sheets are subject to change without notice
17
©2005 Maxwell Technologies All rights reserved