5.0SMLJ18A-TP

5.0SMLJ11A THRU 5.0SMLJ400A E480232 Features • • • • • Low Inductance Built in Strain Relief For Surface Mount Application in Order to Optimize Board Space High Temperature Soldering: 260°C/10 Seconds at Terminals Typical ID:less than 1uA above 10V • • • • • • • Low Profile Package Repetition Rate( duty cycle): 0.01% Glass Passivated Junction Excellent Clamping Capability Halogen Free. “Green” Device (Note 1) Moisture Sensitivity Level 1 Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates Compliant. See Ordering Information) 5000 Watt TVS 11 to 400 Volts SMC (DO-214AB) (LEAD FRAME) G Mechanical Data • Polarity: Color Band Denotes Positive End( cathode) Except Bi-directional Types H Maximum Ratings Cathode Mark • Operating Junction Temperature Range: -55°C to +175°C • Storage Temperature Range: -55°C to +175°C A • Typical Thermal Resistance: 23°C/W Junction to Ambient Peak Pulse Power Surge Current on 10/1000μs Waveform IPPM Peak Pulse Power Dissipation on 10/1000μs Waveform PPPM 5000W(Min) Air Contact 30kV 30kV PD 6.5W VF 5.0V IEC 61000-4-2 ESD Power Dissipationon infinite heat sink Maximum instantaneous forward voltage at 100 A for unidirectional only Fast response time Note 3,4 TL=75°C Typically less than 1.0ps from 0 Volts to BV Min B F DIM A B C D E F G H DIMENSIONS INCHES MM MIN MAX MIN MAX 0.079 0.103 2.00 2.62 0.108 0.128 2.75 3.25 0.002 0.008 0.051 0.203 0.006 0.012 0.152 0.305 0.030 0.060 0.76 1.52 0.305 0.320 7.75 8.13 0.260 0.280 6.60 7.11 0.220 0.245 5.59 6.22 NOTE Suggested Solder Pad Layout 4.40mm Note: 1. Halogen free "Green” products are defined as those which contain