BAS21-TP

BAS21-TP

  • 厂商:

    MCC(美微科)

  • 封装:

    SOT-23

  • 描述:

    特性:非常适合自动插入。 结温150℃。 快速开关速度。 外延平面芯片结构。 无铅涂层/符合RoHS标准(“P”后缀表示符合RoHS标准)。

  • 数据手册
  • 价格&库存
BAS21-TP 数据手册
MCC TM Micro Commercial Components BAS19 THRU BAS21   omponents 20736 Marilla Street Chatsworth    !"# $ %    !"# Features • • • • • • Small Ideally Suited for Automatic Insertion 150oC Junction Temperature Fast Switching speed Epitaxial Planar Die Construction Lead Free Finish/Rohs Compliant ("P"Suffix designates RoHS Compliant. See ordering information) Halogen free available upon request by adding suffix "-HF" Signal Diodes 250mW Mechanical Data • • • Epoxy meets UL 94 V-0 flammability rating Moisture Sensitivity Level 1 Weight: 0.008 grams ( approx.) SOT-23 Top View A D Continuous Reverse MCC Part Marking Voltage Number VR (V) BAS19 BAS20 BAS21 JP JR JS 100 150 200 Repetitive Peak Reverse Voltage VRRM (V) 120 200 250 3 C B 1 F 2 E H G J K DIMENSIONS o Maximum Ratings @ 25 C Unless Otherwise Specified Parameter Symbol Value @ t=1us 2.5 Non-repetitive Peak IFSM Forward Surge Current @ t=1s 0.5 IF(AV) Average Rectified Forward Current 200(1) IF Forward DC Current at Tamb=25oC 200(2) Repetitive Peak Forward Current IFRM 625 Unit A mA mA DIM A B C D E F G H J K INCHES MIN .110 .083 .047 .035 .070 .018 .0005 .035 .003 .015 MM MIN 2.80 2.10 1.20 .89 1.78 .45 .013 .89 .085 .37 MAX 3.04 2.64 1.40 1.03 2.05 .60 .100 1.12 .180 .51 NOTE Suggested Solder Pad Layout mA Ptot 250 mW Power Dissipation up to Tamb=25oC Thermal Resistance Junction to RqJA 430 oC/W Ambient Operating & Storage Temperature Tj, TSTG -65~150 oC MAX .120 .098 .055 .041 .081 .024 .0039 .044 .007 .020 .031 .800 .035 .900 .079 2.000 inches mm Notes: (1) Measured under pulse conditions; Pulse time = tp
BAS21-TP 价格&库存

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BAS21-TP
  •  国内价格 香港价格
  • 1+0.973301+0.12565
  • 10+0.6010910+0.07760
  • 100+0.36622100+0.04728
  • 500+0.26271500+0.03392
  • 1000+0.229011000+0.02957

库存:8588